Key Features - Quectel EM05 Hardware Design

2.2. Key Features

The following table describes the detailed features of EM05.
Table 2: Key Features of EM05
Feature
Function Interface
Power Supply
Transmitting Power
LTE Features
UMTS Features
CDMA2000 Features
Internet Protocol Features
SMS
(U)SIM Interface
Audio Interface
EM05_Hardware_Design
Details
PCI Express M.2 Standard Interface
Supply voltage: 3.135V~4.4V
Typical supply voltage: 3.3V

Class 3 (24dBm+1/-3dB) for WCDMA bands

Class 3 (23dBm± 2dB) for LTE-FDD bands

Class 3 (23dBm± 2dB) for LTE-TDD bands

Class 3 (24dBm± 1dB) for CDMA BC0
Support up to non-CA Cat 4
Support 1.4 to 20MHz RF bandwidth
Support MIMO in DL direction
FDD: Max 150Mbps (DL), 50Mbps (UL)
TDD: Max 130Mbps (DL), 35Mbps (UL)
Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA
Support QPSK, 16-QAM and 64-QAM modulation
DC-HSDPA: Max 42Mbps (DL)
HSUPA: Max 5.76Mbps (UL)
WCDMA: Max 384Kbps (DL), Max 384Kbps (UL)
Support 3GPP2 CDMA2000 1X Advanced, CDMA2000 1x EV-DO Rev.A
EVDO: Max 3.1Mbps (DL), 1.8Mbps (UL)
1X Advanced: Max 307.2Kbps (DL), 307.2Kbps (UL)
Support TCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/NITZ/HTTPS/ SMTP/
MMS/FTPS/SMTPS/SSL/FILE* protocols
Support PAP (Password Authentication Protocol) and CHAP (Challenge
Handshake Authentication Protocol) protocols which are usually used for
PPP connections
Text and PDU mode
Point to point MO and MT
SMS cell broadcast
SMS storage: ME by default
Support (U)SIM card: 1.8V, 3.0V
Support one digital audio interface: PCM interface
WCDMA: AMR/AMR-WB
LTE: AMR/AMR-WB
Confidential / Released
LTE Module Series
EM05 Hardware Design
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