Quectel EM05 Hardware Design page 54

The thermal dissipation area is shown as below. The dimensions are measured in mm.
Figure 31: Thermal Dissipation Area on Bottom Side of the Module
The table below shows the heat dissipation performance after adding a heat sink between the module
and the main PCB.
Table 33: Heat Dissipation Performance
Scenario Testing Time
No heat sink 15 minutes
Add a heat sink 15 minutes
NOTE
The test condition is: under ambient temperature 70° C with LTE Band 8, BW=20M and max power.
EM05_Hardware_Design
Thermal dissipation area
Bottom View
Temperature
Baseband
112
90
Confidential / Released
LTE Module Series
EM05 Hardware Design
PA Unit
112 ° C
89 ° C
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