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Quectel EM060K Series Hardware Design

Quectel EM060K Series Hardware Design

Lte-a module
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EM060K Series&EM120K-GL
Hardware Design
LTE-A Module Series
Version: 0.1
Date: 2023-06-12
Status: Draft

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Summary of Contents for Quectel EM060K Series

  • Page 1 EM060K Series&EM120K-GL Hardware Design LTE-A Module Series Version: 0.1 Date: 2023-06-12 Status: Draft...

  • Page 2: Legal Notices

    LTE-A Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai...

  • Page 3: Third-Party Rights

    Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

  • Page 4: Safety Information

    Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 5: About The Document

    LTE-A Module Series About the Document Revision History Version Date Author Description 2023-06-12 Frank GAO / Henry YANGf Creation of the document 2023-06-12 Frank GAO / Henry YANG Draft (Refer to Hardware Design V1.1.0) EM060K_Series&EM120K-GL_Hardware_Design 4 / 99...

  • Page 6: Table Of Contents

    LTE-A Module Series Contents Safety Information ............................3 About the Document ..........................4 Contents ..............................5 Table Index ..............................8 Figure Index .............................. 10 Introduction ............................12 1.1. Reference Standards ....................... 12 1.2. Special Marks ........................... 13 Product Overview ..........................14 2.1.
  • Page 7 LTE-A Module Series 4.2. USB Interface ........................... 40 4.3. PCM Interface* ......................... 42 4.4. Control and Indication Interfaces ..................... 43 4.4.1. W_DISABLE1# ......................44 4.4.2. W_DISABLE2# ......................44 4.4.3. WWAN_LED#........................ 46 4.4.4. WAKE_ON_WAN# ......................46 4.4.5. DPR ..........................47 4.4.6. WLAN_PA_EN ......................
  • Page 8 LTE-A Module Series 7.2. Top and Bottom Views ......................89 7.3. M.2 Connector .......................... 91 7.4. Module Installation ........................91 7.5. Packaging Specification ......................92 7.5.1. Blister Tray ........................92 7.5.2. Packaging Process ....................... 94 Appendix References ........................95 EM060K_Series&EM120K-GL_Hardware_Design 7 / 99...
  • Page 9 LTE-A Module Series Table Index Table 1: Special Marks ..........................13 Table 2: Frequency Bands and GNSS Functions of EM060K Series and EM120K-GL ......14 Table 3: Key Features ..........................15 Table 4: Definition of I/O Parameters ......................21 Table 5: Pin Description ..........................21 Table 6: Overview of Operating Modes .....................
  • Page 10 LTE-A Module Series Table 42: EM060K-EA Rx Sensitivity ......................63 Table 43: GNSS Frequency ........................64 Table 44: GNSS Performance ........................64 Table 45: Antenna Requirements ......................65 Table 46: Major Specifications of the RF Connectors ................69 Table 47: Absolute Maximum Ratings ....................... 72 Table 48: Power Supply Requirements .....................
  • Page 11 LTE-A Module Series Figure Index Figure 1: Functional Diagram for EM060K-GL&EM120K-GL ..............18 Figure 2: Functional Diagram for EM060K-NA and EM060K-EA .............. 19 Figure 3: Pin Assignment ........................... 20 Figure 4: DRX Run Time and Current Consumption in Sleep Mode ............27 Figure 5: Sleep Mode Application with USB Remote Wakeup Function ...........
  • Page 12 LTE-A Module Series Figure 42: EM060K-EA Top and Bottom Views ..................91 Figure 43: Installation Schematic ......................92 Figure 44: Blister Tray Dimension Drawing ....................93 Figure 45: Packaging Process ........................94 EM060K_Series&EM120K-GL_Hardware_Design 11 / 99...

  • Page 13: Introduction

    LTE-A Module Series Introduction This document defines EM060K series and EM120K-GL module and defines their air interfaces and hardware interfaces which are connected with your application With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module.

  • Page 14: Special Marks

    LTE-A Module Series 1.2. Special Marks Table 1: Special Marks Mark Definition Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported;...

  • Page 15: Product Overview

    The following table shows the frequency bands and GNSS functions of the module. For details about CA combinations, you can see document [1]. Table 2: Frequency Bands and GNSS Functions of EM060K Series and EM120K-GL Mode EM060K-GL...

  • Page 16: Key Features

    LTE-A Module Series GPS/GLONASS/BDS/ GPS/GLONASS/ GPS/GLONAS GPS/GLONASS/BDS/Gali GNSS Galileo BDS/ Galileo S/BDS/ Galileo The module can be applied to a wide range of applications such as industrial routers, home gateways, set- top boxes, industrial laptops, consumer laptops, industrial PDAs, rugged tablet PCs and digital signage, etc.
  • Page 17 LTE-A Module Series ⚫ EM060K-NA: – LTE ⚫ EM060K-GL and EM120K-GL: – Main antenna connector and diversity/GNSS antenna connector – 50 Ω impedance ⚫ EM060K-NA Antenna Interfaces and EM060K-EA: – Main antenna connector, Diversity antenna connector, GNSS antenna connector – 50 Ω impedance ⚫...
  • Page 18 ⚫ Supports GPS, GLONASS, BDS and Galileo GNSS Features ⚫ Data update rate: 1 Hz by default ⚫ Compliant with 3GPP TS 27.007 and 3GPP TS 27.005 AT Commands ⚫ Quectel enhanced AT commands Internet Protocol QMI/MBIM/NITZ/HTTP/HTTPS/FTP/LwM2M/PING Features Firmware Upgrade Via USB 2.0 or DFOTA...

  • Page 19: Functional Diagram

    LTE-A Module Series 2.3. Functional Diagram The following figure shows a functional diagram of EM060K series and EM120K-GL. ⚫ Power management ⚫ Baseband ⚫ LPDDR2 SDRAM+NAND flash ⚫ Radio frequency ⚫ M.2 Key-B interface EM060K_Series&EM120K-GL_Hardware_Design 18 / 99...

  • Page 20: Pin Assignment

    LTE-A Module Series 2.4. Pin Assignment The following figure shows the pin assignment of the module. Pin Name Pin Name CONFIG_2 CONFIG_1 RESET# USIM1_DET ANTCTL3 COEX_TXD ANTCTL2 COEX_RXD ANTCTL1 WLAN_PA_EN/NC ANTCTL0 RFFE_DATA PIN75 PIN74 RFFE_CLK PCIE_REFCLK_P PEWAKE# PCIE_REFCLK_M CLKREQ# PERST# PCIE_RX_P USIM2_VDD PCIE_RX_M...

  • Page 21: Pin Description

    LTE-A Module Series due to EM060K-NA and EM060K-EA does not support B46, it does not conflict with the 5 GHz frequency bands of WLAN, Pin 60 is not needed. So it is NC. 2.5. Pin Description Table 4: Definition of I/O Parameters Type Description Analog Input...
  • Page 22 LTE-A Module Series Ground Vmin = 3.135 V Power supply for the Vnom = 3.7 V module Vmax = 4.4 V Ground Internally pulled max = 4.4 V down with a FULL_CARD_ 100 kΩ resistor. DI, PD Turn on/off the module min = 1.19 V POWER_OFF# max = 0.2 V...
  • Page 23 LTE-A Module Series PCM_DOUT* PCM data output 1.8 V High level by DI, PU Dynamic power reduction 1.8 V default. Active low. min = 1.8 V W_DISABLE2# DI, PU GNSS control max = 0.4 V Active low. min = -0.4 V Ground DIO, PCM_SYNC*...
  • Page 24 Antenna GPIO control 1.8 V LTE/WLAN coexistence COEX_RXD* DI, PD 1.8 V receive ANTCTL2* Antenna GPIO control 1.8 V LTE/WLAN coexistence COEX_TXD* 1.8 V transmit If RFFE_CLK and RFFE_DATA are required, please contact Quectel for more details. EM060K_Series&EM120K-GL_Hardware_Design 24 / 99...

  • Page 25: Evb Kit

    NOTE Keep all NC and unused pins unconnected. 、 2.6. EVB Kit To help you develop applications conveniently with EM060K series and EM120K-GL, Quectel supplies an evaluation board (5G-M2 EVB). For more details, see document [2]. EM060K_Series&EM120K-GL_Hardware_Design 25 / 99...

  • Page 26: Operating Characteristics

    LTE-A Module Series Operating Characteristics 3.1. Operating Modes The table below summarizes different operating modes of the modules. Table 6: Overview of Operating Modes Mode Details Software is active. The module is registered on the network Idle and is ready to send and receive data. Full Functionality Mode Network is connected.

  • Page 27: Sleep Mode

    LTE-A Module Series 3.2. Sleep Mode In sleep mode, DRX (Discontinuous Reception) of the module is able to reduce the current consumption to a minimum level, and DRX cycle index values are broadcasted by the wireless network. The figure below shows the relationship between the DRX run time and the current consumption in sleep mode. The longer the DRX cycle is, the lower the current consumption will be.

  • Page 28: Airplane Mode

    LTE-A Module Series 3.3. Airplane Mode Execution of AT+CFUN=4 or driving W_DISABLE1# pin low will set the module to airplane mode . For more details, see Chapter 4.4.1. 3.4. Communication Interface with Host The module supports communication with the host through USB interface. USB 2.0 should be reserved for firmware upgrade.

  • Page 29: Voltage Stability Requirements

    LTE-A Module Series The following figure shows a reference design for +5 V input power supply based on DC-DC converter. The typical output of the power supply is about 3.7 V. PWR_IN PWR_OUT μ 205K 100 nF BOOT 383K 470 μF 220 μF 100 nF 33 pF...

  • Page 30: Monitor The Power Supply

    LTE-A Module Series should be. In addition, to guarantee the stability of the power supply, please use a TVS component with a reverse TVS voltage of 5.1 V and a dissipation power higher than 0.5 W. The following figure shows a reference circuit of the VCC.
  • Page 31 LTE-A Module Series High level: turn on Low level: turn off. It is recommended to use a host GPIO to control FULL_CARD_POWER_OFF#. A simple reference circuit is illustrated in the following figure. Host Module 1.8 V or 3.3 V FULL_CARD_POWER_OFF# GPIO 100K Figure 9: Turn On the Module with a Host GPIO...

  • Page 32: Turn-Off

    LTE-A Module Series Table 9: Turn-on Timing of the Module Symbol Min. Typ. Max. Comment 100 ms The turn-on time of the module. 13.7s The system booting time of the module. NOTE RESET# is automatically pulled up as on as the module is powered on. RESET# is not allowed to be pulled down by host during powering up 3.7.

  • Page 33: Reset

    LTE-A Module Series 3.8. Reset The RESET# pin serves to reset the module. Triggering the RESET# signal will lead to loss of all data from the modem and removal of system drivers. It will also lead to disconnection of the modem from the network.
  • Page 34 LTE-A Module Series FULL_CARD_POWER_OFF# RESET# Module Status Running Reseting Restart Figure 13: Reset Timing Table 12: Reset Timing of the Module Index Min. Typ. Max. Comment It is recommended to pull down RESET# for about 100 ms 0 ms 100 ms before driving FULL_CARD_POWER_OFF# low.

  • Page 35: Application Interfaces

    LTE-A Module Series Application Interfaces 4.1. (U)SIM Interface The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements and ISO/IEC 7816-3. Both Class B (3.0 V) and Class C (1.8 V) (U)SIM cards are supported, and Dual SIM Single Standby function is supported.

  • Page 36: U)Sim Hot-Swap

    LTE-A Module Series 4.1.2. (U)SIM Hot-swap The module supports (U)SIM card hot-swap via (U)SIM card hot-swap detect pins USIM1_DET and USIM2_DET. (U)SIM card insertion can be detected by high/low level. (U)SIM card hot-swap function is disabled by default. The following command configures (U)SIM card hot-swap detection. AT+QSIMDET Configure (U)SIM Card Hot-Swap Detection Test Command Response...

  • Page 37: Normally Closed (U)Sim Card Connector

    LTE-A Module Series NOTE 1. Hot-swap function is invalid if the configured value of <insert_level> is inconsistent with hardware design. 2. The underlined value represents the default configuration. 3. USIM1_DET and USIM2_DET are pulled low by default, and will be internally pulled up to 1.8 V by software configuration only when (U)SIM hot-swap is enabled by AT+QSIMDET.

  • Page 38: Normally Open (U)Sim Card Connector

    LTE-A Module Series 4.1.4. Normally Open (U)SIM Card Connector With a normally open (U)SIM card connector, CD1 and CD2 of the connector are disconnected when there is no (U)SIM card inserted. (U)SIM card detection by low level is applicable to this type of connector. Once (U)SIM hot-swap is enabled by executing AT+QSIMDET=1,0, insertion of a (U)SIM card will drive USIM_DET from high to low level, and the removal of it will drive USIM_DET from low to high level.

  • Page 39: U)Sim2 Card Compatible Design

    LTE-A Module Series Module (U)SIM Card Connector 100 nF USIM_VDD USIM_RST USIM_CLK USIM_DET USIM_DATA TVS array Figure 16: Reference Circuit for 6-Pin (U)SIM Card Connector NOTE All these resistors, capacitors and TVS array in the reference circuit should be close to (U)SIM card connector in PCB layout.

  • Page 40: U)Sim Design Notices

    LTE-A Module Series NOTE The five 0 Ω resistors must be close to the module, and all other components should be close to (U)SIM card connector in PCB layout. 4.1.7. (U)SIM Design Notices To enhance the reliability and availability of the (U)SIM card in applications, please follow the criteria below in (U)SIM circuit design.
  • Page 41 LTE-A Module Series USB_SS_TX_M USB 3.0 super-speed transmit (-) USB_SS_TX_P USB 3.0 super-speed transmit (+) Require differential impedance of 90 Ω. USB_SS_RX_M USB 3.0 super-speed receive (-) USB_SS_RX_P USB 3.0 super-speed receive (+) For more details about the USB 3.0 and 2.0 specifications, please visit http://www.usb.org/home. The following figure presents a reference circuit for the USB interface.

  • Page 42: Pcm Interface

    LTE-A Module Series ⚫ Junction capacitance of the ESD protection components might cause influences on USB data traces, so you should pay attention to the selection of the components. Typically, the stray capacitance should be less than 1.0 pF for USB 2.0, and less than 0.15 pF for USB 3.0. ⚫...

  • Page 43: Control And Indication Interfaces

    LTE-A Module Series 125 μs PCM_CLK PCM_SYNC PCM_DOUT PCM_DIN Figure 20: Auxiliary Mode Timing The following table shows the pin definition of PCM interface which can be applied to audio codec design. Table 15: Pin Definition of PCM Interface Pin No. Pin Name Description Comment...

  • Page 44: W_Disable1

    LTE-A Module Series Active low. VCC. WWAN_LED# RF status indication LED Active low. 1.8/3.3 V. WAKE_ON_WAN# Wake up the host Active low. 1.8 V, high level by DI, PU Dynamic power reduction default. Active low. min = 1.8 V max = 0.4 V W_DISABLE2# DI, PU GNSS control...
  • Page 45 LTE-A Module Series The GNSS function can also be controlled through software AT commands. The combination of W_DISABLE2# pin and AT commands controls the GNSS function. Table 18: GNSS Function Status W_DISABLE2# Logic Level AT Commands GNSS Function Status AT+QGPS=1 Enable High Level AT+QGPSEND...

  • Page 46: Wwan_Led

    LTE-A Module Series 4.4.3. WWAN_LED# The WWAN_LED# signal is used to indicate RF status of the module, and its sink current is up to 10 mA. To reduce power consumption of the LED, a current-limited resistor must be placed in series with the LED, as illustrated in the figure below.

  • Page 47: Dpr

    LTE-A Module Series Always at high level Idle/Sleep Host Module VCC_IO_HOST WAKE_ON_WAN# GPIO Wake up the host Figure 23: Reference Circuit of WAKE_ON_WAN# NOTE The voltage level on VCC_IO_HOST depends on the host side due to the open drain in pin 23 of the module.

  • Page 48: Wlan_Pa_En

    LTE-A Module Series Backoff of max transmitting power occurred according to configuration in SAR efs file Host Module GPIO NOTE: DPR pin is 1.8 V power domain. Host s GPIO could be a 1.8 V or 3.3 V voltage level. Figure 24: Reference Design of DPR 4.4.6.

  • Page 49: Configuration Pins

    LTE-A Module Series Table 24: Pin Definition of Cellular/WLAN COEX Interface Pin No. Pin Name Description Comment COEX_RXD DI, PD LTE/WLAN coexistence receive 1.8 V COEX_TXD DO, PD LTE/WLAN coexistence transmit 1.8 V 4.6. Configuration Pins Table 25: List of Configuration Pins Config_0 Config_1 Config_2...

  • Page 50: Pcie Interface

    LTE-A Module Series Host Module VCC_IO_HOST 100K 100K 100K 100K 0 Ω CONFIG_0 GPIO 0 Ω CONFIG_1 GPIO NM-0 Ω CONFIG_2 GPIO NM-0 Ω CONFIG_3 GPIO Figure 25: Recommended Circuit of Configuration Pins NOTE The voltage level VCC_IO_HOST depends on the host side, and could be a 1.8 V or 3.3 V voltage level. 4.7.

  • Page 51: Root Complex Mode

    LTE-A Module Series unconnected. PCIE_TX_M PCIe transmit (-) PCIE_TX_P PCIe transmit (+) PCIE_RX_M PCIe receive (-) PCIE_RX_P PCIe receive (+) If unused, keep it CLKREQ PCIe clock request unconnected. If unused, keep it PERST# PCIe reset unconnected. RC mode only. PEWAKE# PCIe wake up If unused, keep it open.
  • Page 52 LTE-A Module Series ⚫ Keep the maximum trace length less than 300 mm. ⚫ Keep the length matching of each differential data pair (Tx/Rx/REFCLK) less than 0.7 mm for PCIe routing traces. ⚫ Keep the differential impedance of PCIe data trace as 95 Ω ± 10 %. ⚫...

  • Page 53: Antenna Interfaces

    LTE-A Module Series Antenna Interfaces Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products.
  • Page 54 LTE-A Module Series GNSS antenna interface: ANT_GNSS ⚫ GNSS: GPS/GLONASS/Galileo/BDS Table 31: Antenna Connectors Definition for EM060K-EA Antenna Connector Description Comment Main antenna interface: ⚫ LTE: TRx ANT_MAIN ⚫ WCDMA: TRx Diversity antenna interface: 50 Ω impedance ⚫ LTE: DRx ANT_DRx ⚫...
  • Page 55 LTE-A Module Series LTE-FDD B7 2500–2570 2620–2690 LTE-FDD B8 880–915 925–960 – – LTE-FDD B12 – – LTE-FDD B13 – – LTE-FDD B14 – – LTE-FDD B17 – – LTE-FDD B18 – – LTE-FDD B19 LTE-FDD B20 832–862 791–821 – –...
  • Page 56 LTE-A Module Series – – LTE-TDD B48 3550 3700 3550 3700 Table 33: Frequency Bands for EM060K-NA 3GPP Band Transmit Receive Unit – – LTE-FDD B2 1850 1910 1930 1990 – – LTE-FDD B4 1710 1755 2110 2155 LTE-FDD B5 824–849 869–894 LTE-FDD B7...

  • Page 57: Antenna Tuner Control Interface

    LTE-A Module Series Table 34: Frequency Bands for EM060K-EA 3GPP Band Transmit Receive Unit WCDMA B1 1920–1980 2110–2170 WCDMA B3 1710–1785 1805–1880 WCDMA B5 824–849 869–894 WCDMA B8 880–915 925–960 LTE-FDD B1 1920–1980 2110–2170 LTE-FDD B3 1710–1785 1805–1880 LTE-FDD B5 824–849 869–894 LTE-FDD B7...

  • Page 58: Antenna Tuner Control Interface Through Rffe

    1.8 V RFFE_DATA DIO, PD Used for external MIPI IC control 1.8 V NOTE If RFFE_CLK and RFFE_DATA are required, please contact Quectel for more details. 5.1.3. Tx Power Table 37: EM060K-GL , EM120K-GL and EM060K-EA Tx Power Frequency Band Modulation Max.

  • Page 59: Rx Sensitivity

    LTE-A Module Series LTE-TDD QPSK 23 dBm ± 2 dB < -40 dBm 10 MHz, 1RB 5.1.4. Rx Sensitivity Table 39: EM060K-GL Rx Sensitivity Frequency Band Primary Diversity SIMO 3GPP (SIMO) (dBm) Comment WCDMA B1 -108.5 -109.5 -111.5 -106.7 WCDMA B2 -108.5 -109.5 -111.5...
  • Page 60 LTE-A Module Series LTE-FDD B17 -98.5 -99.5 -101.5 -93.3 10 MHz LTE-FDD B18 -98.5 -101.5 -96.3 10 MHz LTE-FDD B19 -98.5 -101.5 -96.3 10 MHz LTE-FDD B20 -101 -93.3 10 MHz LTE-FDD B25 -97.5 -100 -92.8 10 MHz LTE-FDD B26 -98.5 -101.5 -93.8...
  • Page 61 LTE-A Module Series Table 40: EM120K-GL Rx Sensitivity 3GPP (SIMO) Frequency Band Primary Diversity SIMO Comment (dBm) WCDMA B1 -108.5 -109.5 -111.5 -106.7 WCDMA B2 -108.5 -109.5 -111.5 -104.7 WCDMA B3 -109 -109 -111.5 -103.7 WCDMA B4 -108 -108.5 -111 -106.7 WCDMA B5 -110.5...
  • Page 62 LTE-A Module Series LTE-FDD B25 -97.5 -100 -92.8 10 MHz LTE-FDD B26 -98.5 -101.5 -93.8 10 MHz LTE-FDD B28 -99.5 -99.5 -102 -94.8 10 MHz LTE-FDD B29 -98.5 -98.5 -101 -93.3 10 MHz LTE-FDD B30 -96.5 -98.5 -95.3 10 MHz LTE-FDD B32 -96.5 -99.5...
  • Page 63 LTE-A Module Series LTE-FDD B13 -99.2 -100.5 -102.6 -93.3 10 MHz LTE-FDD B14 -100.3 -102.3 -93.3 10 MHz LTE-FDD B17 -99.2 -100.3 -102.5 -93.3 10 MHz LTE-FDD B25 -99.4 -99.2 -101.9 -92.8 10 MHz LTE-FDD B26 -99.2 -99.4 -101.9 -93.8 10 MHz LTE-FDD B29 -98.5...

  • Page 64: Gnss

    LTE-A Module Series LTE-FDD B8 -93.3 10 MHz LTE-FDD B20 -93.3 10 MHz LTE-FDD B28 -94.8 10 MHz LTE-FDD B32 -96.3 10 MHz LTE-TDD B38 -96.3 10 MHz LTE-TDD B40 -96.3 10 MHz LTE-TDD B41 -94.3 10 MHz 5.2. GNSS 5.2.1.

  • Page 65: Antenna Design Requirements

    LTE-A Module Series Acquisition Autonomous -146 Sensitivity Reacquisition Autonomous -158 Tracking Autonomous -158 Autonomous Cold start @ open sky XTRA enabled Autonomous Warm start TTFF @ open sky XTRA enabled Autonomous Hot start @ open sky XTRA enabled Autonomous Accuracy CEP-50 @ open sky NOTE...
  • Page 66 LTE-A Module Series NOTE It is recommended to use a passive GNSS antenna when LTE B13 or B14 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance. EM060K_Series&EM120K-GL_Hardware_Design 66 / 99...

  • Page 67: Antenna Connectors

    LTE-A Module Series 5.4. Antenna Connectors 5.4.1. Antenna Connector Location The antenna connector locations are shown below. Diversity/ Main Antenna Main Antenna Diversity/ GNSS Antenna GNSS Antenna Figure 27: Antenna Connectors on EM060K-GL & EM120K-GL Main Antenna Diversity GNSS Antenna Antenna Figure 28: Antenna Connectors on EM060K-NA EM060K_Series&EM120K-GL_Hardware_Design...

  • Page 68: Antenna Connector Specifications

    LTE-A Module Series Main Antenna Diversity GNSS Antenna Antenna Figure 29: Antenna Connectors on EM060K-EA NOTE The antennas from left to right are respectively main antenna, diversity antenna and GNSS Antenna. 5.4.2. Antenna Connector Specifications The modules are mounted with standard 2 mm × 2 mm receptacle antenna connectors for convenient antenna connection.

  • Page 69: Antenna Connector Installation

    LTE-A Module Series Figure 30: Dimensions of the Receptacle (Unit: mm) Table 46: Major Specifications of the RF Connectors Item Specification Nominal Frequency Range DC to 6 GHz 50 Ω Nominal Impedance Temperature Rating -40 to +85 ° C Meet the requirements of: Voltage Standing Wave Ratio (VSWR) Max.
  • Page 70 LTE-A Module Series Figure 31: Dimensions of Mated Plugs (Ø0.81/Ø1.13 mm Coaxial Cables) (Unit: mm) The following figure illustrates the connection between the receptacle RF connector on the modules and the mated plugs using a Ø 0.81 mm coaxial cable. Figure 32: Space Factor of Mated Connectors (Ø0.81 mm Coaxial Cables) (Unit: mm) The following figure illustrates the connection between the receptacle RF connector on EM060K-GL and EM120K-GL and the mated plugs using a Ø...
  • Page 71 LTE-A Module Series Figure 33: Space Factor of Mated Connectors (Ø 1.13 mm Coaxial Cables) (Unit: mm) EM060K_Series&EM120K-GL_Hardware_Design 71 / 99...

  • Page 72: Electrical Characteristics And Reliability

    LTE-A Module Series Electrical Characteristics and Reliability 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the modules are listed in the following table. Table 47: Absolute Maximum Ratings Parameter Min. Typ.

  • Page 73: Power Consumption

    LTE-A Module Series 6.3. Power Consumption Table 49: EM060K-GL Power Consumption (3.7 V Power Supply) Description Condition Typ. Unit μA OFF state Power down AT+CFUN=0 @ USB2.0 Suspend 1.65 AT+CFUN=0 @ USB3.0 Suspend 1.67 AT+CFUN=4 @ USB2.0 Suspend 1.66 AT+CFUN=4 @ USB3.0 Suspend 1.88 WCDMA PF = 64 @ USB2.0 Suspend 3.09...
  • Page 74 LTE-A Module Series Transfer WCDMA B1 HSUPA CH10700 @ 21 dBm (GNSS Off) WCDMA B2 HSDPA CH9800 @ 22.1 dBm WCDMA B2 HSUPA CH9800 @ 20.3 dBm WCDMA B3 HSDPA CH1338 @ 22.2 dBm WCDMA B3 HSUPA CH1338 @ 20 dBm WCDMA B4 HSDPA CH1638 @ 22.1 dBm WCDMA B4 HSUPA CH1638 @ 20.3 dBm WCDMA B5 HSDPA CH4407 @ 22.2 dBm...
  • Page 75 LTE-A Module Series LTE-FDD B17 CH5790 @ 23.05 dBm LTE-FDD B18 CH5925 @ 23.14 dBm LTE-FDD B19 CH6075 @ 23.18 dBm LTE-FDD B20 CH6300 @ 23.17 dBm LTE-FDD B25 CH8365 @ 23.21 dBm LTE-FDD B26 CH8865@ 23.14 dBm LTE-FDD B28 CH9360 @ 22.95 dBm LTE-FDD B30 CH9820 @ 23.03 dBm 1070 LTE-FDD B66 CH66886 @ 23.15 dBm...
  • Page 76 LTE-A Module Series WCDMA B19 CH738 @ 23 dBm Table 50: EM060K-NA Power Consumption (3.7 V Power Supply) Description Condition Typ. Unit μA OFF state Power down AT+CFUN=0 @ USB2.0 Suspend 1.56 AT+CFUN=0 @ USB3.0 Suspend 1.58 AT+CFUN=4 @ USB2.0 Suspend 1.62 AT+CFUN=4 @ USB3.0 Suspend 1.63...
  • Page 77 LTE-A Module Series LTE-FDD B14 CH5330 @ 23.36 dBm LTE-FDD B17 CH5790 @ 23.16 dBm LTE-FDD B25 CH8365 @ 23.06 dBm LTE-FDD B26 CH8865@ 23.35 dBm LTE-FDD B30 CH9820 @ 22.70 dBm LTE-FDD B66 CH66886 @ 23.12 dBm LTE-FDD B71 CH68786 @ 23.38 dBm LTE-TDD B41 CH40620 @ 23.6 dBm LTE-TDD B42 CH42590 @ 23.41 dBm LTE-TDD B43 CH44590 @ 23.27 dBm...
  • Page 78 LTE-A Module Series WCDMA PF = 64 (USB Disconnect) 18.72 WCDMA PF = 64 (USB2.0 Connect) 19.75 WCDMA PF = 64 (USB3.0 Connect) LTE-FDD PF = 64 (USB Disconnect) 18.96 ldle State LTE-FDD PF = 64 (USB2.0 Connect) 20.85 LTE-FDD PF = 64 (USB3.0 Connect) LTE-TDD PF = 64 (USB Disconnect) 19.11 LTE-TDD PF = 64 (USB2.0 Connect)
  • Page 79 LTE-A Module Series LTE-FDD B1 CH300 @ 23.02 dBm LTE-FDD B2 CH900 @ 23.1 dBm LTE-FDD B3 CH1575 @ 23.13 dBm LTE-FDD B4 CH2175 @ 23.06 dBm LTE-FDD B5 CH2525 @ 23.13 dBm LTE-FDD B7 CH3100 @ 23.03 dBm LTE-FDD B8 CH3625 @ 23.15 dBm LTE-FDD B12 CH5095 @ 23.03 dBm LTE-FDD B13 CH5230 @ 23.10 dBm LTE-FDD B14 CH5330 @ 22.95 dBm...
  • Page 80 LTE-A Module Series LTE-TDD B42 CH42590 @ 23.21 dBm LTE-TDD B43 CH44590 @ 23.14 dBm LTE-TDD B48 CH55990 @ 23.10 dBm WCDMA B1 CH10700 @23.2 dBm WCDMA B2 CH9800 @ 23.1 dBm WCDMA B3 CH1338 @ 23.2 dBm WCDMA B4 CH1638 @ 23.1 dBm WCDMA Voice* Call...
  • Page 81 LTE-A Module Series WCDMA PF = 64 (USB Disconnect) WCDMA PF = 64 (USB2.0 Connect) WCDMA PF = 64 (USB3.0 Connect) LTE-FDD PF = 64 (USB Disconnect) ldle State LTE-FDD PF = 64 (USB2.0 Connect) LTE-FDD PF = 64 (USB3.0 Connect) LTE-TDD PF = 64 (USB Disconnect) LTE-TDD PF = 64 (USB2.0 Connect) LTE-TDD PF = 64 (USB3.0 Connect)

  • Page 82: Digital I/O Characteristics

    1. Power consumption test is carried out under 3.7 V, 25 ° C with 5G-M2 EVB, and with thermal dissipation measures. 2. For more details about current consumption, please contact Quectel Technical Support to obtain the power consumption test report of the modules.

  • Page 83: Esd Protection

    LTE-A Module Series High-level input voltage 0.7 × USIM_VDD USIM_VDD + 0.3 Low-level input voltage -0.3 0.2 × USIM_VDD High-level output voltage 0.8 × USIM_VDD USIM_VDD Low-level output voltage Table 55: 1.8 V Digital I/O Requirements Parameter Description Min. Max. Unit High-level input voltage 1.65...

  • Page 84: Operating And Storage Temperatures

    LTE-A Module Series VCC, GND ± 5 ± 10 Antenna Interfaces ± 4 ± 8 Other Interfaces ± 0.5 ± 1 6.6. Operating and Storage Temperatures Table 58: Operating and Storage Temperatures Parameter Min. Typ. Max. Unit Operating Temperature Range º...

  • Page 85: Thermal Dissipation

    LTE-A Module Series 6.7. Thermal Dissipation Figure 34: Distribution of Heat Source Chips Inside the EM060K-GL&EM120K-GL Figure 35: Distribution of Heat Source Chips Inside the EM060K-NA The module offers the best performance when all internal IC chips are working within their operating temperatures.

  • Page 86: Notification

    LTE-A Module Series ⚫ Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible. ⚫ Expose the copper in the PCB area where module is mounted. ⚫ Apply a soft thermal pad with appropriate thickness and high thermal conductivity between the module and the PCB to conduct heat.

  • Page 87: Coating

    LTE-A Module Series 6.8.1. Coating If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 6.8.2.

  • Page 88: Mechanical Information And Packaging

    LTE-A Module Series Mechanical Information and Packaging This chapter mainly describes mechanical dimensions and packaging specifications of EM060K series and EM120K-GL. All dimensions are measured in millimeter (mm), and the tolerances are ± 0.15 mm unless otherwise specified. 7.1. Mechanical Dimensions Figure 37: EM060K-GL&EM120K-GL Mechanical Dimensions...

  • Page 89: Top And Bottom Views

    LTE-A Module Series Figure 38: EM060K-NA Mechanical Dimensions 7.2. Top and Bottom Views Figure 39: EM060K-GL Top and Bottom Views EM060K_Series&EM120K-GL_Hardware_Design 89 / 99...
  • Page 90 LTE-A Module Series Figure 40: EM120K-GL Top and Bottom Views Figure 41: EM060K-NA Top and Bottom Views EM060K_Series&EM120K-GL_Hardware_Design 90 / 99...

  • Page 91: Connector

    Quectel. 7.3. M.2 Connector EM060K series and EM120K-GL adopt a standard PCI Express M.2 connector which compiles with the directives and standards listed in PCI Express M.2 Specification. 7.4. Module Installation The module needs to be fixed firmly to avoid poor contact caused by shaking.

  • Page 92: Packaging Specification

    LTE-A Module Series It is recommended to use a screw with a head diameter Ø5–Ø5.5 mm. Figure 43: Installation Schematic 7.5. Packaging Specification This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts blister tray packaging and details are as follow: 7.5.1.
  • Page 93 LTE-A Module Series Figure 44: Blister Tray Dimension Drawing EM060K_Series&EM120K-GL_Hardware_Design 93 / 99...

  • Page 94: Packaging Process

    LTE-A Module Series 7.5.2. Packaging Process Each blister tray packs 15 modules. Stack 10 Packing 11 blister trays together and then put blister trays with modules together, and put 1 blister trays into conductive bag, seal and empty blister tray on the top. pack the conductive bag.

  • Page 95: Appendix References

    LTE-A Module Series Appendix References Table 60: Related Documents Document Name [1] Quectel_EM060K_Series&EM120K-GL_CA_Feature [2] Quectel_5G-M2_EVB_User_Guide [3] Quectel_EG06xK&Ex120K&EM060K_Series_AT_Commands_Manual [4] Quectel_LTE-A(Q)_Series_GNSS_Application_Note Table 61: Terms and Abbreviations Abbreviation Description Average Power Tracking ATtention Baseband BeiDou Navigation Satellite System BIOS Basic Input/Output System Bit(s) per second BPSK Binary Phase Shift Keying CBRS...
  • Page 96 LTE-A Module Series DFOTA Delta Firmware Upgrade Over-The-Air Downlink Dynamic Power Reduction Discontinuous Reception Diversity Receive External Bus Interface EIRP Equipment Isotropic Radiated Power Electrostatic Discharge Equivalent Series Resistance Frequency Division Duplex GLONASS Global Navigation Satellite System (Russia) GNSS Global Navigation Satellite System Global Positioning System Global System for Mobile Communications HSDPA...
  • Page 97 LTE-A Module Series MBIM Mobile Broadband Interface Model Mbps Megabits per second Multiple Chip Package Mobile Equipment MFBI Multi-Frequency Band Indicator MIPI Mobile Industry Processor Interface MIMO Multiple-Input Multiple-Output MLCC Multi-layer Ceramic Capacitor MMPA Multimode Multiband Power Amplifier Mobile Originated Most Significant Bit Mobile Terminated NAND...
  • Page 98 LTE-A Module Series Point of Sale Point-to-Point Protocol Primary Receive Qualcomm Low-noise Amplifer Qualcomm MSM (Mobile Station Modems) Interface QPSK Quadrature Phase Shift Keying Resource Block Radio Frequency RFFE RF Front-End Relative Humility Receive Specific Absorption Rate SDRAM Synchronous Dynamic Random-Access Memory Short Message Service SPMI System Power Management Interface...
  • Page 99 Wideband Code Division Multiple Access Wafer-scale RF transceiver Crystal Oscillator Product Marketing Name：Quectel EM120K-GL FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1.This Modular Approval is limited to OEM installation for mobile and fixed applications only.
  • Page 100 5.This module must not transmit simultaneously with any other antenna or transmitter 6.The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including...
  • Page 101 The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word “Contains”...

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