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Relative Humidity
Shock
Vibration
EMC
1.3.9 Specifications of ECS-9000-2R
System
Processor
Chipset
BIOS
SIO
Memory
I/O Interface
Serial
USB
GPIO
LED
SIM Card
Expansion
Mini PCIe
SUMIT A, B
Graphics
Graphics Processor
Interface
95% at 75°C
• IEC 60068-2-27
• SSD : 50G @ Wallmount, Half-sine, 11ms
• IEC 60068-2-64
• SSD : 5Grms, 5Hz to 500Hz, 3 Axis
E13, CE, FCC, EN50155, EN50121-3-2
®
Quad Core Intel
Xeon
(Kaby Lake-S/Skylake-S)
®
Intel
C236
AMI
IT8786E
• DDR4 2400/2133 MHz
• Up to 64GB
• 2 260-pin SO-DIMM Socket
4 COM RS-232/422/485 w/auto flow control
• 6 USB 3.0 (External)
• 1 USB 3.0 (Internal)
16 GPIO
Power, HDD, Wireless
3 SIM Card Socket (External)
3 Mini PCIe Socket :
• 2 Full-size for PCIe/USB/External SIM Card/mSATA
• 1 Half-size for PCIe/USB 3.0/External SIM Card
2 SUMIT Slot (Optional)
®
Intel
HD Graphics P630/630/P530/530
• DVI-I : Up to 1920 x 1200 @ 60Hz
• DVI-D : Up to 1920 x 1200 @ 60Hz
• DisplayPort : Up to 4096 x 2304 @ 60Hz
®
/Core™ i7/i5/i3 Processor
GENERAL INTRODUCTION
21
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