Specifications Of Ecs-9000-6F - Vecow ECS-9000 User Manual

Environment
Operating Temperature
Storage Temperature
Humidity
Relative Humidity
Shock
Vibration
EMC

1.3.6 Specifications of ECS-9000-6F

System
Processor
Chipset
BIOS
SIO
Memory
I/O Interface
Serial
USB
GPIO
LED
SIM Card
Expansion
Mini PCIe
©Vecow ECS-9000 User Manual
35W TDP CPU :
Core™ i7, i5, i3 : -40°C to 75°C (-40°F to 167°F)
®
Xeon E3-1268L v5 : -40°C to 70°C (-40°F to 158°F)
65W TDP CPU :
Core™ i7, i5, i3 : -40°C to 55°C (-40°F to 131°F)
80W TDP CPU :
®
Xeon E3-1275 v6, E3-1275 v5, E3-1225 v5 : -40°C to
45°C (-40°F to 113°F)
-40°C to 85°C (-40°F to 185°F)
5% to 95% Humidity, non-condensing
95% at 75°C
• IEC 60068-2-27
• SSD : 50G @ Wallmount, Half-sine, 11ms
• IEC 60068-2-64
• SSD : 5Grms, 5Hz to 500Hz, 3 Axis
E13, CE, FCC, EN50155, EN50121-3-2
®
Quad Core Intel Xeon
(Kaby Lake-S/Skylake-S)
®
Intel C236
AMI
IT8786E
• DDR4 2400/2133 MHz
• Up to 64GB
• 2 260-pin SO-DIMM Socket
4 COM RS-232/422/485 w/auto flow control
• 6 USB 3.0 (External)
• 1 USB 3.0 (Internal)
16 GPIO
Power, HDD, Wireless
3 SIM Card Socket (External)
3 Mini PCIe Socket :
• 2 Full-size for PCIe/USB/External SIM Card/mSATA
• 1 Half-size for PCIe/USB 3.0/External SIM Card
®
/Core™ i7/i5/i3 Processor
GENERAL INTRODUCTION
14