Altera Stratix III Design Manuallines
Hide thumbs Also See for Stratix III:

Advertisement

Quick Links

May 2008, version 1.1
Introduction
Table 1. Summary of Design Flow Stages and Guideline Topics (Part 1 of 2)
Stages of Design Flow
"Device Selection," on page 2
"Planning for Device Configuration," on page 6
"Early System Planning," on page 12
"Board Design Considerations," on page 18
"I/O and Clock Planning," on page 27
"Design and Compilation," on page 42
Altera Corporation
AN-469-1.1
Stratix III Design Guidelines
®
Stratix
III devices are engineered for high-speed core performance and
high-speed I/O with the best signal integrity in the industry, combined
with low-static and dynamic-power consumption. The devices also offer
increased logic density, so you can integrate more of your product to
reduce cost and board space.
It is important to follow Altera recommendations throughout the design
process for high-density, high-performance Stratix III designs. Planning
the FPGA and system early in the design process is crucial to your
success. This document provides an easy-to-use set of guidelines and a
list of factors to consider in Stratix III designs, but does not include all the
details about the product. It includes pointers to other documentation
where you can find detailed specifications, device feature descriptions,
and additional guidelines. The material covers the Stratix III device
architecture as well as aspects of the Quartus
tools that you might use in your design.
The guidelines presented in this document will help you improve
productivity and avoid common design pitfalls. The document discusses
various stages of the design flow in the order that each stage is typically
performed, as shown in
page 65
to help verify that you have followed each of the guidelines.
Device information, determining device density, package
offerings, speed grade, core voltage, migration, and
HardCopy
Configuration scheme overview, configuration features,
Quartus II settings, optional pins
Planning: design specifications, IP selection, on-chip
debugging, early power estimation
Power-up, power pins, configuration pins, signal integrity,
board-level verification
Pin assignments, early pin planning, I/O features and
connections, clock and PLL selection, SSN
Synthesis tools, coding styles and recommendations, planning
for hierarchical or team-based design, SOPC Builder
®
II software and third-party
Table
1. You can use the
Guideline Topics
®
ASICs
Application Note 469
"Design Checklist," on
1

Advertisement

Table of Contents
loading
Need help?

Need help?

Do you have a question about the Stratix III and is the answer not in the manual?

Questions and answers

Subscribe to Our Youtube Channel

Summary of Contents for Altera Stratix III

  • Page 1 FPGA and system early in the design process is crucial to your success. This document provides an easy-to-use set of guidelines and a list of factors to consider in Stratix III designs, but does not include all the details about the product. It includes pointers to other documentation where you can find detailed specifications, device feature descriptions, and additional guidelines.
  • Page 2 Knowledge Database. Device Selection The first step in the Stratix III design process is to choose the device family variant, device density, speed grade, package, and core voltage that best suit your design needs. You should also consider whether you want to target FPGA or ASIC migration devices.
  • Page 3 This feature allows future upgrades or changes to your design without any changes to the board layout, because you can replace the Stratix III device on the board with a different density Stratix III Altera Corporation...
  • Page 4 Center uses a proven turnkey process to implement the low-cost, low-power, functionally-equivalent, pin-compatible HardCopy III ASIC. The result is a drop-in replacement to the prototyping Stratix III FPGA on your system board. You can start your HardCopy III ASIC design by targeting your design to...
  • Page 5 Speed Grade The device speed grade affects the device timing performance and timing closure, as well as power utilization. Stratix III devices are available in three speed grades, –2, –3, and –4 (–2 is the fastest). Generally, the faster devices have higher cost. As one way to help you determine which speed grade your design requires, refer to the supported clock rates for specific I/O interfaces.
  • Page 6 There is limited speed grade support with the 0.9-V option. Planning for Stratix III devices are based on SRAM cells, and you must download configuration data to the Stratix III device each time the device powers up Device because SRAM memory is volatile. Choosing your device configuration...
  • Page 7 PS configuration schemes. The Altera serial configuration devices (EPCS) are used in the Fast AS configuration scheme. Check whether the configuration device supports the configuration bitstream file size for your Stratix III device. You can also use a MAX II device or a Altera Corporation...
  • Page 8 2 of the Configuration Handbook. This datasheet includes a table that lists serial configuration device support for Stratix III devices. If the uncompressed file size is too large for a specific device density, the table indicates that it includes the compression feature to reduce the file size.
  • Page 9 Stratix III device. The time required by a Stratix III device to decompress a configuration file is less than the time needed to transmit the configuration data to the device.
  • Page 10 (PS) configuration schemes. The design security feature is also available in remote update with fast AS configuration mode. The design security feature is not available when you are configuring your Stratix III device using FPP with an enhanced configuration device or JTAG configuration schemes.
  • Page 11 Quartus II Handbook. Programming Files To store the Stratix III data in configuration devices, you can generate additional files or convert the default SRAM Object File (.sof) data into a different file format to program a configuration device. You can set up the software to generate additional programming files during compilation in the Device and Pin Options dialog box.
  • Page 12 Early System In systems that contain a Stratix III device, the FPGA typically plays a large role in the overall system and affects the rest of the system design. Planning...
  • Page 13 IP Selection Altera and its third-party IP partners offer a large selection of off-the-shelf IP cores optimized for Altera devices. You can easily implement these parameterized blocks of IP in your design, reducing your system implementation and verification time, and allowing you to concentrate on adding proprietary value.
  • Page 14 Application Note 469: Stratix III Design Guidelines pins may not be enough, because of internal signal accessibility and I/O pin accessibility on the device. First, select your preferred debugging tool(s) described in“On-Chip Debugging Tools” and then refer to “Planning Guidelines for Debugging Tools,” on page...
  • Page 15 Application Note 469: Stratix III Design Guidelines ■ Virtual JTAG Megafunction—The sld_virtual_jtag megafunction enables you to build your own system-level debugging infrastructure, including both processor-based debugging solutions and debugging tools in software for system-level debugging. This megafunction can be instantiated directly in your HDL code to provide one or more transparent communication channels to access parts of your FPGA design using the JTAG interface of the device.
  • Page 16 Application Note 469: Stratix III Design Guidelines you make certain changes to SignalTap II settings. Using incremental compilation with the SignalTap II Embedded Logic Analyzer greatly reduces the compilation time required for debugging. SignalProbe and the Logic Analyzer Interface require I/O pins for debugging.
  • Page 17 Power consumption in FPGA devices is dependent on the logic design. This dependence can make power estimation challenging during the early board specification and layout stages. The Altera PowerPlay Early Power Estimator (EPE) spreadsheet allows you to estimate power utilization before the design is complete by processing information about...
  • Page 18: Table Of Contents

    Stratix III devices offer hot socketing, which is also known as hot plug-in or hot swap, and power sequencing support without the use of any external devices. You can insert or remove a Stratix III device or a board in a system during system operation without causing undesirable effects to the running system bus or the board inserted into the system.
  • Page 19: Power Pin Connections

    Design Guide. Power Pin Connections The Stratix III selectable core voltage gives you the option of using a power-saving 0.9-V core voltage V or the standard 1.1-V core voltage . In either case, a 1.1-V supply is required for the PLL and periphery...
  • Page 20 For a list of the supply voltages required for the Stratix III device and their recommended operation conditions, refer to the DC & Switching...
  • Page 21: Configuration Pin Connections

    Configuring Stratix III Devices chapter in the Stratix III Handbook. For more details about Stratix III I/O pins, refer to the Stratix III Device Pinout Files at www.altera.com and the Stratix III Pin Connection Guidelines.
  • Page 22 To disable the JTAG state machine during power-up, the TCK pin should be pulled low to ensure that an unexpected rising edge does not occur on TCK. Altera recommends pulling the TCK pin low and the TMS pin high through resistors.
  • Page 23 The operating voltage supplied to the Altera download cable by the target board through the 10-pin header determines the operating voltage level of the download cable. The dedicated JTAG pins for all Stratix III devices reside in bank 1A and they are powered by V .
  • Page 24: Board-Related Quartus Ii Settings

    Device-Wide Output Enable Pin Stratix III devices support an optional chip-wide output enable that allows you to override all tri-states on device I/O. When this DEV_OE pin is driven low, all I/O pins are tri-stated; when this pin is driven high, all pins behave as programmed.
  • Page 25: Signal Integrity Considerations

    Application Note 469: Stratix III Design Guidelines Unused Pins To allow flexibility in board design, you can specify the state of unused pins as one of the following five states in the Quartus II software: as inputs that are tri-stated, as outputs that drive ground, as outputs that drive an unspecified signal, as input tri-stated with bus-hold, or as input tri-stated with weak pull-up.
  • Page 26 Differential I/O standards typically require a termination resistor between the two signals at the receiver. The termination resistor must match the differential load impedance of the signal line. Stratix III devices provide an optional differential on-chip resistor when using LVDS. Note that certain dedicated clock input pairs do not support differential termination.
  • Page 27: Board-Level Simulation And Advanced I/O Timing Analysis

    I/O resources to maximize utilization and prevent issues related to signal integrity is important. Good clock management systems are also crucial to the performance of an FPGA design. Stratix III devices offer a hierarchical clock structure and multiple PLLs with advanced features to provide a complete clock management solution.
  • Page 28: Making Fpga Pin Assignments

    Application Note 469: Stratix III Design Guidelines This section details the following topics: ■ “Making FPGA Pin Assignments,” on page 28 ■ “Early Pin Planning and I/O Assignment Analysis,” on page 29 ■ “I/O Features and Pin Connections,” on page 30 ■...
  • Page 29: And

    Starting FPGA pin planning early improves the confidence in early board layouts, reduces the chance of error, and improves the design’s overall time to market. You can create a preliminary pin-out for an Altera FPGA using the Quartus II Pin Planner before the source code is designed.
  • Page 30: I/O Features And Pin Connections

    Quartus II Fitter for the final sign-off of pin assignments. I/O Features and Pin Connections Stratix III I/Os are designed for ease of use and rapid system integration, while simultaneously providing high bandwidth. Independent modular I/O banks with a common bank structure for vertical migration lend efficiency and flexibility to the high speed I/O.
  • Page 31 Quartus II software automatically places the corresponding negative pin. Selectable I/O Standards and Flexible I/O Banks Stratix III I/O pins are arranged in groups called modular I/O banks. Depending on the device density, the number of I/O banks ranges from 16 to 24 banks.
  • Page 32 , VREF, and CCIO CCPD board VTT. Also, refer to the Stratix III I/O banks figure that shows the location of each I/O bank and what each bank supports. The figures describing the number of I/Os in each bank provide bank information specific to each device density.
  • Page 33 Connect the unidirectional read data-strobes or clocks to Stratix III DQS pins and use any available DQ or DQS pins (in the same I/O bank as the data pins) for the unidirectional write data-strobes or clocks.
  • Page 34 Dual-Purpose and Special Pin Connections Stratix III devices allow I/O flexibility with dual-purpose configuration pins. You can use dual-purpose configuration pins as general I/O after device configuration is complete. Select the desired setting for each of the dual-purpose pins on the Dual-Purpose Pins tab of the Device and Pin Options dialog box.
  • Page 35 Dedicated circuitry for a CRC error detection feature is built into Stratix III devices that can optionally check for single event upsets (SEUs) continuously and automatically. To take advantage of the SEU mitigation features, use the appropriate megafunction for CRC error detection. Use the CRC_ERROR or CRITICAL ERROR pin to flag errors.
  • Page 36 Application Note 469: Stratix III Design Guidelines Table 2. Stratix III I/O Features (Part 2 of 3) Feature Usage Guidelines and More Information Programmable Programmable current-strength control Ensure that the output buffer current Current available for certain I/O standards. Can mitigate...
  • Page 37: Clock And Pll Selection

    Application Note 469: Stratix III Design Guidelines Table 2. Stratix III I/O Features (Part 3 of 3) Feature Usage Guidelines and More Information Bus Hold Weakly holds the signal on an I/O pin at its If the bus-hold feature is enabled, you last-driven state until the next input signal is cannot use the programmable pull-up option.
  • Page 38 DPA block, horizontal I/O pins, and internal logic can drive the PCLK networks. These PCLKs have higher skew compared to GCLK and RCLK networks and can be used instead of general purpose routing to drive signals into and out of the Stratix III device. Altera Corporation...
  • Page 39: Pll Design Guidelines

    Use these features to select different clock input signals, or power-down clock networks to reduce power consumption, without using any combinational logic in your design. In Stratix III devices, the clock enable signals are supported at the clock network level instead of at the PLL output counter level, so you can turn off a clock even when a PLL is not being used.
  • Page 40 Phase-Locked Loops Megafunction User Guide (ALTPLL). Clock Feedback Mode Stratix III PLLs support up to six different clock feedback modes: Source-synchronous mode, No-compensation mode, Normal mode, Zero-delay buffer (ZDB) mode, External-feedback mode, and LVDS compensation. Each mode compensates for different clock networks and delays, so that the clocks are aligned differently.
  • Page 41: Simultaneous Switching Noise

    Application Note 469: Stratix III Design Guidelines to sweep PLL output frequencies and adjust the output-clock phase dynamically. You can also use this feature to adjust clock-to-out (t delays in real time by changing the PLL output clock phase shift. This approach eliminates the need to regenerate a configuration file with the new PLL settings.
  • Page 42 Application Note 469: Stratix III Design Guidelines ■ Use lower drive strengths for high-switching I/Os. The default drive strength setting might be higher than your design requires. Refer to “Stratix III I/O Features,” on page ■ Use differential I/O standards and lower-voltage standards for high-switching I/Os.
  • Page 43 Application Note 469: Stratix III Design Guidelines Altera recommends that you use the most recent version of third-party synthesis tools, because tool vendors are continuously adding new features, fixing tool issues, and enhancing performance for Altera devices. Your synthesis tool might offer the capability to create a Quartus II project and pass constraints such as the EDA tool setting, device selection, and timing requirements that you specified in your synthesis project.
  • Page 44 Megafunctions include the library of parameterized modules (LPM) and Altera device-specific megafunctions. You can also take advantage of Altera and third-party IP and reference designs to save design time, as described in “IP Selection,” on page The Quartus II MegaWizard Plug-In Manager provides an easy user interface to customize megafunctions.
  • Page 45 Register Power-Up Levels and Control Signals Stratix III devices support an optional chip-wide reset that enables you to override all clears on all device registers, including the registers of the memory blocks (but not the memory contents itself). When this DEV_CLRn pin is driven low, all registers are cleared or reset to 0.
  • Page 46 Application Note 469: Stratix III Design Guidelines time. It also avoids the possibility that an asynchronous reset signal is released at or near the active clock edge of a flip-flop, in which case the output of the flip-flop could go to a metastable unknown state.
  • Page 47 Partitioning your design is optional, but these benefits are important for large Stratix III designs. The bottom-up design flows are not supported for HardCopy migrations. If you migrate to a HardCopy III ASIC, use the...
  • Page 48 Application Note 469: Stratix III Design Guidelines For more information about using the incremental compilation flows in the Quartus II software, as well as important guidelines for creating design partitions and a design floorplan, refer to the Quartus II Incremental Compilation for Hierarchical and Team-Based Design chapter in volume 1 of the Quartus II Handbook.
  • Page 49 Application Note 469: Stratix III Design Guidelines Resource Balancing It is often important to plan and balance resource utilization. When performing incremental compilation, the software synthesizes each partition separately with no data about the resources used in other partitions. Therefore, synthesis can overuse device resources in the individual partitions, and the design may not fit in the target device when the partitions are merged.
  • Page 50 Application Note 469: Stratix III Design Guidelines you to view connections between regions, estimate physical timing delays on the chip, and move regions around the device floorplan. When you have compiled the full design, you can also view logic placement and locate areas of routing congestion to improve the floorplan assignments.
  • Page 51 For Stratix III devices, a device with low logic utilization does not have the lowest ALM utilization possible. In addition, a design that is reported as close to 100% full might still have space for extra logic.
  • Page 52 Application Note 469: Stratix III Design Guidelines Quartus II Messages Each stage of the compilation flow generates messages, including informational notes, warnings, and critical warnings. Review these messages to check for any design problems. Ensure that you understand the significance of any warning messages, and make changes to the design or settings if required.
  • Page 53 Ensure that the input I/O times are not violated when data is provided to the Stratix III device. You can use the report_datasheet command to generate a datasheet report that summarizes the I/O timing characteristics of the entire design.
  • Page 54 Physical synthesis optimizations make placement-specific changes to the netlist that improve results for a specific Altera device. You can specify Physical synthesis for performance or Physical synthesis for fitting options. These options typically increase compilation time significantly but can provide significant improvements to the QoR with push-button optimizations.
  • Page 55 Application Note 469: Stratix III Design Guidelines target design performance or area improvements with multiple compilations. You can also set the Optimization Goal to Optimize for Speed or Optimize for Area using the Advanced tab in the DSE window. For more information, refer to the...
  • Page 56 Altera also provides the ModelSim-Altera simulator with Quartus II license subscriptions, which enables you to take advantage of advanced testbench capabilities and other features. In addition, the Quartus II EDA Netlist Writer can generate timing netlist files to support other third-party simulation tools such as Synopsys VCS and Cadence NC-Sim.
  • Page 57 Stratix III temperature-sensing diode for thermal management. For specific architectural features that help reduce power consumption,...
  • Page 58 AN 448: Stratix III Power Management Design Guide. Power Optimization To reduce dynamic power consumption in Stratix III devices, you can use various design and software techniques to optimize your design. Power optimization in the Quartus II software depends on accurate power analysis results.
  • Page 59 Application Note 469: Stratix III Design Guidelines Device and Design Power Optimization Techniques This section lists several design techniques that can reduce power consumption. The results of these techniques are different from design to design. For more details and additional design techniques to reduce power...
  • Page 60 The Quartus II software offers power-optimized synthesis and fitting to reduce core dynamic power. Power-driven compilation works in conjunction with Programmable Power Technology in the Stratix III silicon. The default setting is Normal compilation. You can choose Extra effort for additional power optimizations that might impact the design’s maximum achievable performance.
  • Page 61 Stratix III devices include a temperature sensing diode (TSD) with embedded analog-to-digital converter (ADC) circuitry, so you do not require an external temperature sensing chip on the board. The Stratix III TSD can self-monitor the device junction temperature and be used with external circuitry for activities such as controlling air flow to the FPGA.
  • Page 62 ■ Clock Control Block Megafunction User Guide (ALTCLKCTRL) ■ Clock Networks and PLLs in Stratix III Devices chapter in volume 1 of the Stratix III Device Handbook ■ Configuring Stratix III Devices chapter in volume 1 of the Stratix III Device Handbook ■...
  • Page 63 Signal Integrity with Third-Party Tools chapter in volume 3 of the Quartus II Handbook ■ Section I. Simulation in volume 3 of the Quartus II Handbook ■ sld_virtual_jtag Megafunction User Guide ■ Stratix III Device Family Overview chapter in volume 1 of the Stratix III Device Handbook Altera Corporation...
  • Page 64 Application Note 469: Stratix III Design Guidelines ■ Stratix III Device I/O Features chapter in volume 1 of the Stratix III Device Handbook ■ Stratix III Device Pinout Files ■ Stratix III Pin Connection Guidelines ■ Design Security in Stratix III Devices chapter in volume 1 of the Stratix III Device Handbook ■...
  • Page 65 Application Note 469: Stratix III Design Guidelines Design Checklist This checklist provides a summary of the guidelines described in this document. Use the checklist to verify that you have followed the guidelines for each stage of your design. Project Name: Date: “Device Selection,”...
  • Page 66 “Board Design Considerations,” on page 18 Done Design voltage supply power ramps to be monotonic. Design board for power-up: Stratix III output buffers are tri-stated until device is configured, and configuration pins drive out. Set POR time to ensure power supplies are stable.
  • Page 67 Application Note 469: Stratix III Design Guidelines Run a thick trace (at least 20 mils) from the power supply to each V pin. C C A _ P L L Connect all V power pins to the quietest digital supply on the board.
  • Page 68 Application Note 469: Stratix III Design Guidelines Perform board-level simulation using IBIS models (when available). Configure board trace models for Quartus II advanced I/O timing analysis. “I/O and Clock Planning,” on page 27 Done Use the Quartus II Pin Planner to make pin assignments.
  • Page 69 Application Note 469: Stratix III Design Guidelines Use on-chip termination features to save board space. Check that the required termination scheme is supported for all pin locations. (Column I/O banks and certain differential clock pairs do not support RD termination).
  • Page 70 Application Note 469: Stratix III Design Guidelines “Design and Compilation,” on page 42 Done Specify your third-party synthesis tool and use the correct supported version. Use synchronous design practices. Pay attention to clock signals. Use the Quartus II Design assistant to check design reliability.
  • Page 71 Review TimeQuest Timing Analyzer reports after compilation to ensure there are no timing violations. Ensure that the input I/O times are not violated when data is provided to the Stratix III device. Perform Early Timing Estimation if you want timing estimates before running a full compilation.

Table of Contents