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Manuals
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Intel Manuals
Motherboard
3200
Thermal/mechanical design manual
Intel 3200 Thermal/Mechanical Design Manual
Chipset
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Contents
Table of Contents
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Table of Contents
Table of Contents
1 Introduction
Design Flow
Definition of Terms
Thermal Design Process
Reference Documents
2 Packaging Technology
MCH Package Dimensions (Top View)
MCH Package Height
MCH Package Dimensions (Bottom View)
Non-Critical to Function Solder Joints
Package Mechanical Requirements
Package Height
3 Thermal Specifications
Thermal Design Power (TDP)
Thermal Specification
4 Thermal Simulation
5 Thermal Metrology
MCH Case Measurement
Supporting Test Equipment
Thermocouple Attach Support Equipment
Thermal Calibration and Controls
IHS Groove
Omega Thermocouple
FCBGA7 Chipset Package Reference Groove Drawing
IHS Groove on the FCBGA7 Chipset Package on the Live Board
Thermocouple Attach Procedure
The Live Board on the Fixture Plate
Inspection of Insulation on Thermocouple
Bending the Tip of the Thermocouple
Extending Slightly the Exposed Wire over the End of Groove
Securing Thermocouple Wire with Kapton* Tape Prior to Attach
Detailed Thermocouple Bead Placement
Placing Thermocouple Bead into the Bottom of the Groove
Measuring Resistance between Thermocouple and IHS
Cutting Solder
Solder Block Setup
Observing the Solder Melting
Remove Excess Solder
Remove Excess Solder
Thermocouple Placed into Groove
Fill Groove with Adhesive
Finished Thermocouple Installation
6 Reference Thermal Solution
Operating Environment
Heatsink Performance
Mechanical Design Envelope
Thermal Solution Assembly
Reference Heatsink Measured Thermal Performance Vs. Approach Velocity
Extruded Heatsink Profiles
Design Concept for Reference Thermal Solution
Heatsink Extrusion Profiles
Retention Mechanism Responding in Shock and Vibration
Thermal Interface Material
Honeywell PCM45F* TIM Performance as a Function of Attach Pressure
Reference Thermal Solution Assembly Process
Reference Thermal Solution Assembly Process - Heatsink Sub-Assembly (Step 1)
Reliability Guidelines
Reference Thermal Solution Assembly Process - Heatsink Assembly (Step 2)
Reference Thermal Solution Environmental Reliability Guidelines
A Thermal Solution Component Suppliers
Heatsink Thermal Solution
B Mechanical Drawings
Intel® 3210 and 3200 Chipset Package Drawing
Intel® 3210 and 3200 Chipset Motherboard Component Top-Side Keep-Out Restrictions
Intel® 3210 and 3200 Chipset Motherboard Component Back-Side Keep-Out Restrictions
Intel® 3210 and 3200 Chipset Reference Thermal Solution Assembly
Intel® 3210 and 3200 Chipset Reference Thermal Solution - Heatsink Drawing
Intel® 3210 and 3200 Chipset Reference Thermal Solution - Spring Preload Clip
Intel® 3210 and 3200 Chipset Reference Thermal Solution - Fastener Nut
Intel® 3210 and 3200 Chipset Reference Thermal Solution - Bracket (1 of 2)
Intel® 3210 and 3200 Chipset Reference Thermal Solution - Bracket (2 of 2)
B-1 Intel® 3210 and 3200 Chipset Package Drawing
B-2 Intel® 3210 and 3200 Chipset Motherboard Component Top-Side Keep-Out Restrictions
B-3 Intel® 3210 and 3200 Chipset Motherboard Component Back-Side Keep-Out Restrictions
B-4 Intel® 3210 and 3200 Chipset Reference Thermal Solution Assembly
B-5 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Heatsink Drawing
B-6 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Spring Preload Clip
B-7 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Fastener Nut
B-10 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Backplate Assembly
B-11 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Backplate
B-12 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Insulator
B-13 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Flush Mount Stud
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®
Intel
3210 and 3200 Chipset
Thermal/Mechanical Design Guide
November 2007
Reference Number: 318465 Revision: 001
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