Intel G35 Express Chipset Design Manuallines page 4

Figures
Figure 1. GMCH Non-Grid Array ........................................................................12
Figure 2. Nominal Package Height ....................................................................13
Figure 3. Non-Critical to Function Solder Balls .....................................................15
Figure 4. 0° Angle Attach Methodology (top view, not to scale)..............................18
Figure 5. 0° Angle Attach Heatsink Modifications (generic heatsink side and
Figure 6. Airflow andTemperature Measurement Locations ....................................19
Figure 7. Processor Heatsink Orientation to Provide Airflow to GMCH Heatsink
Figure 8. Processor Heatsink Orientation to Provide Airflow to GMCH Heatsink
Figure 9. ATX GMCH Heatsink - Installed on Board...............................................24
Figure 10. Balanced Technology Extended (BTX) GMCH Heatsink - Installed on Board25
Figure 11. GMCH Package Drawing ....................................................................30
Figure 12. GMCH Keep-Out Restrictions for ATX Platforms.....................................31
Figure 13. GMCH Keep-Out Restrictions for Balanced Technology Extended (BTX)
Figure 14. GMCH Reference Heatsink for ATX Platforms - Sheet 1..........................33
Figure 15. GMCH Reference Heatsink for ATX Platforms - Sheet 2..........................34
Figure 16. GMCH Heatsink for ATX Platforms - Anchor .........................................35
Figure 17. GMCH Reference Heatsink for ATX Platforms - Ramp Retainer Sheet 1 ....36
Figure 18. GMCH Reference Heatsink for ATX Platforms - Ramp Retainer Sheet 2 ....37
Figure 19. GMCH Reference Heatsink for ATX Platforms - Wire Preload Clip .............38
Figure 20. GMCH Reference Heatsink for Balanced Technology Extended (BTX)
Figure 21. GMCH Reference Heatsink for Balanced Technology Extended (BTX)
Tables
Table 1. Package Loading Specifications............................................................12
Table 2. Thermal Specifications .......................................................................14
Table 3. ATX Reference Thermal Solution Environmental Reliability Requirements
Table 4. Balanced Technology Extended (BTX) Reference Thermal Solution
Table 5. ATX Intel Reference Heatsink Enabled Suppliers for Intel
Table 6. Balanced Technology Extended (BTX) Intel
Table 7. Supplier Contact Information ..............................................................28
4
bottom view shown, not to scale) ......................................................18
on an ATX Platform ............................................................................22
on a Balanced Technology Extended (BTX) Platform ................................23
Platforms ........................................................................................32
Platforms .......................................................................................39
Platforms - Clip ..............................................................................40
(Board Level) ...................................................................................25
Environmental Reliability Requirements (System Level) ..........................26
Express Chipset ................................................................................27
Enabled Suppliers for Intel
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Reference Heatsink
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G35 Express Chipset ..................................27
Thermal and Mechanical Design Guidelines
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G35