Table Of Contents - Intel G35 Express Chipset Design Manuallines

Contents
1 Introduction .....................................................................................................7
1.1 Terminology ..........................................................................................8
1.2 Reference Documents .............................................................................9
2 Product Specifications......................................................................................11
2.1 Package Description..............................................................................11
2.1.1
2.2 Package Loading Specifications...............................................................12
2.3 Thermal Specifications ..........................................................................13
2.4 Thermal Design Power (TDP)..................................................................13
2.4.1
2.4.2
2.4.3
2.4.4
2.5 Non-Critical to Function Solder Balls........................................................15
3 Thermal Metrology ..........................................................................................17
3.1 Case Temperature Measurements ...........................................................17
3.1.1
3.2 Airflow Characterization ........................................................................19
4 Reference Thermal Solution..............................................................................21
4.1 Operating Environment .........................................................................21
4.1.1
4.1.2
4.2 Reference Design Mechanical Envelope ....................................................23
4.3 Thermal Solution Assembly....................................................................23
4.4 Environmental Reliability Requirements ...................................................25
Appendix A Enabled Suppliers ...........................................................................................27
Appendix B Mechanical Drawings .......................................................................................29
Thermal and Mechanical Design Guidelines
Non-Grid Array Package Ball Placement ......................................11
Definition ...............................................................................13
Methodology...........................................................................14
Specifications .........................................................................14
T Limit ..........................................................................14
CONTROL
Thermocouple Attach Methodology.............................................17
ATX Form Factor Operating Environment ....................................21
Balanced Technology Extended (BTX) Form Factor Operating
Environment...........................................................................22
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