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Intel Manuals
Controller
G45
Thermal/mechanical design manuallines
Intel G45 Thermal/Mechanical Design Manuallines
Chipset
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Contents
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Table of Contents
Table of Contents
1 Introduction
Terminology
Reference Documents
2 Product Specifications
Package Description
Non-Grid Array Package Ball Placement
Figure 1. (G)MCH Non-Grid Array
Package Loading Specifications
Thermal Specifications
Figure 2. Package Height
Table 1. Package Loading Specifications
TDP Prediction Methodology
Pre-Silicon
Post-Silicon
Thermal Design Power (TDP)
Definition
Table 2. Thermal Specifications
Thermal Specifications
Non-Critical to Function Solder Balls
TCONTROL Limit
Figure 3. Non-Critical to Function Solder Balls
3 Thermal Metrology
Case Temperature Measurements
Thermocouple Attach Methodology
Figure 4. 0° Angle Attach Methodology (Top View, Not to Scale)
Figure 5. 0° Angle Attach Heatsink Modifications
Airflow Characterization
Figure 6. Airflow &Temperature Measurement Locations
4 Reference Thermal Solution
Operating Environment
Figure 7. Cross-Cut Dimension Change of PWSHS Reference Design
ATX Form Factor Operating Environment
Table 3. (G)MCH Heatsink Boundary Condition Summary in ATX Platforms
Figure 8. ATX Boundary Conditions
Figure 10. Processor Heatsink Orientation to Provide Airflow to (G)MCH
Figure 9. Side View of ATX Boundary Conditions
Balanced Technology Extended (BTX) Form Factor Operating Environment
Table 4. (G)MCH Heatsink Boundary Condition Summary in BTX Platforms
Reference Design Mechanical Envelope
Thermal Solution Assembly
Figure 11. Processor Heatsink Orientation to Provide Airflow to (G)MCH Heatsink on a Balanced Technology Extended (BTX) Platform
Figure 12. Design Concept for ATX (G)MCH Heatsink - Installed on Board
Figure 13. Design Concept for Balanced Technology Extended (BTX) (G)MCH
Environmental Reliability Requirements
Table 5. ATX Reference Thermal Solution Environmental Reliability Requirements
Table 6. Balanced Technology Extended (BTX) Reference Thermal Solution Environmental Reliability Requirements (System Level)
Appendix A Enabled Suppliers
Table 7. ATX Intel Reference Heatsink Enabled Suppliers for (G)MCH
Table 8. BTX Intel Reference Heatsink Enabled Suppliers for (G)MCH
Table 9. Supplier Contact Information
Appendix B Mechanical Drawings
Figure 14. (G)MCH Package Drawing
Figure 15. (G)MCH Component Keep-Out Restrictions for ATX Platforms
Figure 16. (G)MCH Component Keep-Out Restrictions for Balanced Technology Extended (BTX) Platforms
Figure 17. (G)MCH Reference Heatsink for ATX Platforms - Sheet 1
Figure 18. (G)MCH Reference Heatsink for ATX Platforms - Sheet 2
Figure 19. (G)MCH Reference Heatsink for ATX Platforms - Anchor
Figure 20. (G)MCH Reference Heatsink for ATX Platforms - Ramp Retainer Sheet 1
Figure 24. (G)MCH Chipsets Reference Heatsink for Balanced Technology Extended (BTX) Platforms - Clip
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Intel
4 Series Chipset
Thermal and Mechanical Design Guidelines
September 2008
Document Number: 319972-004
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