Internal Construction Of The Device - Siemens SIMATIC IPC647E Operating Instructions Manual

Product description

1.5 Internal construction of the device

1.5 Internal construction of the device
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Power supply, single or redundant
4 x memory module slots
Drive cage
Guide rail for long expansion cards
Heat sink; connected to heat transport via 2 heat pipes with heat sink of the processor
Motherboard
Retainer for expansion modules
Heat exchanger of the processor
Bus board with expansion card slots
Operating Instructions, 11/2018, A5E45589180-AA
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SIMATIC IPC647E