Features - TYAN TN200-B7108 Service Engineer's Manual

1.3

Features

TYAN TN200-B7108 (B7108T200X4-220PV3HR)
System
Front Panel
External Drive Bay (per
blade)
System Cooling
Configuration (per blade)
Processor (per blade)
Chipset (per blade)
Memory (per blade)
Form Factor
Chassis Model
Dimension (D x W x H)
Motherboard
Gross Weight
Board Dimension
Blade Dimension (D x
W x H)
Feature
Net weight
Buttons
I/O Ports
Type / Q'ty
HDD backplane
support
Supported HDD
Interface
FAN
Supported CPU
Series
Socket Type / Q'ty
Thermal Design
Power (TDP) wattage
System Bus
PCH
Supported DIMM Q'ty (8)+(8) DIMM slots
DIMM Type / Speed
19
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2U Rackmount
TN200
H3.42" x W17.43" x D34.02"
(H86.8mm x W442.8mm x
D864mm)
(4) S7108GMR (4 blades in one
chassis)
38 kg (84 lbs)
L521.1 x W171 x H2.4mm
H40.7mm x W171mm x L521.1mm
Four blades in one chassis
30 kg (66.5 lbs)
(4) ID w/ LED, (4) PWR w/ LED
(4) Display ports
(2 x USB2.0 + 1 x D-SUB VGA ports
w/ via cable, per port )
3.5" Hot-Swap, (3),
*Total (12) devices
(12) SAS 12Gb/s, SATA 6.0Gb/s
SATA 6Gb/s
(4) 8cm fans
Intel Xeon Processor Scalable
Families
LGA3647/ (2)
Max up to 125W
Up to 10.4/9.6 GT/s with Intel
UltraPath Interconnect (UPI)
support
Intel C621
Up to 512GB RDIMM/ 1,024GB
LRDIMM/ 2,048GB LRDIMM 3DS
*Follow latest Intel DDR4 Memory