SECTION 1
SPECIFICATIONS
SECTION 2
INSIDE VIEWS
SECTION 3
DISASSEMBLY INSTRUCTIONS
SECTION 4
4 - 1
RECEIVER CIRCUITS ......................................................................................................... . ................... 4 - 1
4 - 2
PLL CIRCUITS ........................................................................................................................................ 4 - 4
4 - 3
POWER SUPPLY CIRCUITS .................................................................................................................. 4 - 5
4 - 4
CPU PORT ALLOCATIONS .................................................................................................................... 4 - 6
SECTION 5
5 - 1
PREPARATION BEFOR SERVICING ............................................................................ . ........................ 5 - 1
5 - 2
PLL ADJUSTMENTS .............................................................................................................................. 5 - 3
5 - 3
5 - 4
SOFTWARE ADJUSTMENTS ................................................................................................................ 5 - 7
SECTION 6
SECTION 7
MECHANICAL PARTS AND DISASSEMBLY
SECTION 8
SEMI-CONDUCTOR INFORMATION
SECTION 9
BOARD LAYOUTS
9 - 1
MAIN UNIT .............................................................................................................................................. 9 - 1
SECTION 10
SECTION 11
11 - 1
MAIN UNIT ............................................................................................................................................ 11 - 1
TABLE OF CONTENTS
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