HP Pavilion 15 Maintenance And Service Manual page 67

4. Remove the heat sink (2).
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Replacement thermal material is included with
the heat sink and system board spare part kits.
Discrete memory: Thermal paste is used on the heat sink (1), (3) and associated system board components
(2), (4). Thermal pads are used on the heat sink (5), (7) and associated system board components (6), (8).
UMA memory: Thermal paste is used on the heat sink (1) and the processor (2).
Component replacement procedures 57