Product Technical Specification
1.2.
Physical Dimensions
AirPrime HL77xx modules are compact, robust, fully shielded modules with the following dimensions:
Length: 23 mm
•
Width: 22 mm
•
•
Thickness: 2.5 mm
•
Weight: 2.6 g
Note:
Dimensions specified above are typical values.
1.3.
General Features
The table below summarizes the AirPrime HL77xx modules' features.
Table 2.
General Features
Feature
Physical
Electrical
RF
SIM interface
Application interface
41110555
Description
•
Small form factor (146-pad solderable LGA pad) – 23mm x 22mm x 2.5mm
(nominal)
Metal shield can.
•
RF connection pads (RF main interface)
•
Baseband signals connection
•
Single or double supply voltage (VBATT and VBATT_PA) – 3.2V – 4.5V
HL7718 (Mono-band LTE):
LTE B13
•
HL7748 (Tri-band LTE):
LTE B2
•
LTE B4
•
LTE B12
•
HL7749 (Dual-band LTE):
LTE B3
•
LTE B28
•
Only 1.8V support for USIM1
•
SIM extraction / hot plug detection
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SIM/USIM support
•
Conforms with ETSI UICC Specifications.
•
Supports SIM application tool kit with proactive SIM commands
•
•
NDIS NIC interface support (Windows 7, Windows 8, Linux)
•
MBIM support
•
Multiple non-multiplexed USB channel support
•
Dial-up networking
•
USB selective suspend to maximize power savings
•
CMUX multiplexing over UART
•
AT command interface – 3GPP 27.007 standard, plus proprietary extended
AT commands
Rev 1.0
Introduction
November 01, 2017
11