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Sierra Wireless AirPrime MC7330 Product Technical Specification & Customer Design Manuallines

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Product Technical Specification
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AirPrime MC7330
4114225
Rev 10
Proprietary and Confidential
Contents subject to change

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  • Page 1 Product Technical Specification & Customer Design Guidelines AirPrime MC7330 4114225 Rev 10 Proprietary and Confidential Contents subject to change...
  • Page 3 Notice totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used in...
  • Page 4 This product may contain technology developed by or for Sierra Wireless Inc. ® This product includes technology licensed from QUALCOMM This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents licensed from InterDigital Group and MMP Portfolio Licensing.
  • Page 5 Preface Revision Release date Changes number September 2013 Updated operating temperature details, added DC bias on GNSS connector, removed GPS_DISABLE_N, updated pins 11,30,32,33,45,47,49,51, added SYSTEM_RESET_N detail and PCM/I2S Audio Interface detail. September 2013 Introduction wording. Updated humidity spec. April 2014 Updated voltage levels and/or pin type (WAKE_N, USIM_DATA, WAN_LED_N), current consumption, ANT_CTRL/GPIO and GPIO/DPR pin definitions.
  • Page 6 Product Technical Specification & Customer Design Guidelines Proprietary and Confidential - Contents subject to change 4114225...

  • Page 7: Table Of Contents

    Contents Introduction ........... . 15 Supported RF bands .
  • Page 8 Radiated sensitivity measurement....... . 44 Sierra Wireless’ sensitivity testing and desensitization investigation . . . 44 Sensitivity vs.
  • Page 9 Contents Power interface ..........55 Power ramp-up .
  • Page 10 Sierra Wireless documents ........
  • Page 11 List of Tables Table 1-1: Supported RF bands ........15 Table 1-2: Modem features .
  • Page 12 Product Technical Specification & Customer Design Guidelines Table 5-6: Power-on timing parameters (double enumeration)... . . 56 Table 5-7: Power-on timing parameters (single enumeration) ... . . 56 Table 5-8: Dynamic power control of SAR backoff state.
  • Page 13 List of Figures Figure 3-1: System block diagram ........24 Figure 3-2: Expanded RF block diagram .
  • Page 14 Product Technical Specification & Customer Design Guidelines Proprietary and Confidential - Contents subject to change 4114225...

  • Page 15: Introduction

    1: Introduction The Sierra Wireless MC7330 PCI Express Mini Card is a compact, lightweight, wireless LTE- and UMTS-based modem. The MC7330 provides LTE, DC-HSPA+, HSPA+, HSDPA, HSUPA, WCDMA, GSM, GPRS, EDGE, and GNSS connectivity for networking, and M2M applications over several radio frequency bands.

  • Page 16: Application Interface Features

    Product Technical Specification & Customer Design Guidelines • Temperature · Operating temperature range (Class A): -30°C to +70°C · Operating temperature range (Class B): -40°C to +85°C Important: The internal module temperature must be kept below 100°C. For best perfor- mance, the internal module temperature should be kept below 85°C.

  • Page 17: Modem Features

    Introduction Modem features Table 1-2: Modem features • LTE/DC-HSPA+/HSPA+/HSPA/UMTS (WCDMA)/EDGE/ GPRS operation • Multiple (up to 16) cellular packet data profiles • Traditional modem COM port support for AT commands • USB suspend/resume • Sleep mode for minimum idle power draw •...

  • Page 18: Short Message Service (Sms) Features

    Product Technical Specification & Customer Design Guidelines • Dedicated bearer · Network-initiated dedicated bearer · UE-initiated dedicated bearer • Multiple PDN connections (IPv4 and IPv6 combinations), subject to operating system support. (For example, not supported in Windows 8.) • Connected mode intra-LTE mobility •...

  • Page 19: Accessories

    1. Manufacturers/part numbers are for reference only and are subject to change. Choose connectors that are appropriate for your own design. Ordering information To order, contact the Sierra Wireless Sales Desk at +1 (604) 232-1488 between 8 AM and 5 PM Pacific Time. Rev 10 Mar.15...

  • Page 20: Integration Requirements

    Product Technical Specification & Customer Design Guidelines Integration requirements Sierra Wireless provides, in the document suite, guidelines for successful Mini Card integration and offers integration support services as necessary. When integrating the MC7330 PCI-Express Mini Card, the following items need to...

  • Page 21: Standards Compliance

    2: Standards Compliance The MC7330 Mini Card complies with the mandatory requirements described in the following standards. The exact set of requirements supported is network operator-dependent. Table 2-1: Standards compliance Technology Standards • 3GPP Release 9 • UMTS 3GPP Release 5 •...
  • Page 22 Product Technical Specification & Customer Design Guidelines Proprietary and Confidential - Contents subject to change 4114225...

  • Page 23: Electrical Specifications

    3: Electrical Specifications The system block diagram in Figure 3-1 on page 24 represents the MC7330 module integrated into a host system. The module includes the following interfaces to the host: Power • —Supplied to the module by the host. W_DISABLE_N •...

  • Page 24: Figure 3-1: System Block Diagram

    Product Technical Specification & Customer Design Guidelines WTR_XO_A0 BLOCK RF + GRFC_GPIO EBI2 (NAND) External NAND and 2GB NAND D0_EN EBI1 1GB RAM CXO_EN XO_OUT_D0_EN PM8018 (DDR DRAM) PMIC_SSBI SSBI_PMIC SSBI PM_MDM_IRQ_N GPIO81 PM_MDM_INT_N MDM9215 VPH/ VBAT USIM W_DISABLE_N WAKE_N WAN_LED_N DPR/GPIO4 ANT_CTRL0/GPIO1...

  • Page 25: Host Interface Pin Assignments

    Electrical Specifications TX_MB1 PRX_MB1 Main Antenna Connector TX_MB4 B5 / B6 / B19 / GSM850 RX B5 / B6 / B19 TX_LB4 GSM850/900 TX_LB2 GSM850/900 GSM1800/1900 TX_MB2 GSM1800/1900 PRX_MB3 B5 / B6 / B19 / GSM850 RX PRX_LB3 GSM900 GSM900 PRX_LB2 GSM1800 / GSM1900 GSM1800 / GSM1900...

  • Page 26: Table 3-1: Connector Pin Assignments

    Product Technical Specification & Customer Design Guidelines Note: The following table describes the internal structure of the module. Table 3-1: Connector pin assignments Voltage levels (V) Direction Active Signal name Description to module state type WAKE_N Wake host Output 0.10 Power supply Input Power...
  • Page 27 Electrical Specifications Table 3-1: Connector pin assignments (Continued) Voltage levels (V) Direction Active Signal name Description to module state type VCC_MSM18_DIG 1.8V reference Output Power 1.75 1.80 1.85 voltage output USIM_CLK SIM Clock Output 0.45 High 2.40 (3V SIM) 2.85 (3V SIM) 1.35 (1.8V SIM) 1.90 (1.8V SIM) No connect...
  • Page 28 Product Technical Specification & Customer Design Guidelines Table 3-1: Connector pin assignments (Continued) Voltage levels (V) Direction Active Signal name Description to module state type I2C_DATA I2C serial bus Input High 1.17 1.80 2.10 data Input Low -0.3 0.63 Output High 1.35 1.80 1.90...
  • Page 29 Electrical Specifications Table 3-1: Connector pin assignments (Continued) Voltage levels (V) Direction Active Signal name Description to module state type DPR/ (DPR) Input High 1.17 1.80 2.10 GPIO4 Dynamic power control Input -0.30 0.63 (GPIO4) Input High 1.17 1.80 2.10 General purpose I/O Input Low...

  • Page 30: Power Supply

    • Data rate: Full-speed (12 Mbps)/High-speed (480 Mbps) • Module enumeration: · Windows: Modem or COM ports, using host Windows drivers · Linux: /dev/ttyUSBn devices for Linux systems with the Sierra Wireless driver installed • USB-compliant transceivers • Selective suspend mode •...

  • Page 31: Usb High/Full Speed Throughput Performance

    Electrical Specifications USB high/full speed throughput performance This device has been designed to achieve optimal performance and maximum throughput using USB high speed mode. Although the device may operate with a full speed host, throughput performance will be on an “as is” basis and needs to be characterized by the OEM.

  • Page 32: Figure 3-3: Sim Application Interface

    Product Technical Specification & Customer Design Guidelines USIM_PWR 4.7uF 0.1uF (Optional. Locate near the SIM socket) 15 k - 30 k Located near SIM socket (Optional. Locate near the (C1) SIM socket) 47 pF, 51  USIM_CLK (C3) USIM_DATA (C7) USIM_RST AirPrime (C2)

  • Page 33: Sim Implementation

    Electrical Specifications SIM implementation When designing the remote SIM interface, you must make sure that SIM signal Note: For interface design integrity is not compromised. requirements, refer to: (2G) 3GPP TS 51.010-1, Some design recommendations include: section 27.17, or • Total impedance of the VCC and GND connections to the SIM, measured at (3G) ETSI TS 102 230 the module connector, should be less than 1 ...

  • Page 34: Control Interface (Signals)

    (Support Note: Host support for WAKE_N for this signal is firmware-dependent. Contact your Sierra Wireless account WAKE_N is optional. representative to determine specific availability.) The host must provide a 5 k–100 k pullup resistor that considers total line capacitance (including parasitic capacitance) such that when WAKE_N is deasserted, the line will rise to 3.3 V (Host power rail) in <...

  • Page 35: W_Disable_N - Wireless Disable

    The module drives the LED output according to [9] PCI Express Mini Card Note: Host support for Electromechanical Specification Revision 1.2. WAN_LED_N is optional. Note: The LED configuration is customizable. Contact your Sierra Wireless account repre- sentative for details. Rev 10 Mar.15 Proprietary and Confidential - Contents subject to change...

  • Page 36: System_Reset_N-Reset Input

    Product Technical Specification & Customer Design Guidelines Current limiting Resistor WAN_LED_N MiniCard Figure 3-7: Example LED SYSTEM_RESET_N—Reset Input SYSTEM_RESET_N has an internal 1.8 V internal pull up. Set this signal to Note: Host support for active low to reset the device. Note that the minimum pulse width is 250 ms. SYSTEM_RESET_N is optional.

  • Page 37: Table 3-7: Pcm Timing

    Electrical Specifications The PCM interface implementation details include: • Modes: Master and slave • Sampling rates: 8 kHz, 16 kHz • Audio compression formats: Linear, µ-law, A-Law • Padding: Disabled, enabled • Bits per frame: 8, 16, 32, 64, 128, 256 •...

  • Page 38: Table 3-8: I2S Master Transmitter Timing

    Product Technical Specification & Customer Design Guidelines Table 3-7: PCM Timing (Continued) Parameter Description Unit T(sync_offset) PCM_SYNC offset time to PCM_CLK falling T(sudin) PCM_DIN setup time before falling edge of PCM_CLK T(hdin) PCM_DIN hold time after falling edge of PCM_CLK T(pdout) Delay from PCM_CLK rising to PCM_DOUT valid...

  • Page 39: Antenna Control

    Electrical Specifications Antenna control The MC7330 Mini Card provides three output signals that may be used for host Note: Host support for designs that incorporate tunable antennas. For details, see [2] AirPrime MiniCard antenna control signals is MC73xx/MC8805 AT Command Reference (Doc# 4114486). optional.
  • Page 40 Product Technical Specification & Customer Design Guidelines Proprietary and Confidential - Contents subject to change 4114225...

  • Page 41: Rf Specifications

    4: RF Specifications The MC7330 includes three connectors for use with host-supplied antennas: • Main RF connector—Rx/Tx path • GNSS connector 1—Dedicated GNSS • Diversity/MIMO/GNSS connector 2—Diversity, MIMO, or GNSS The module does not have integrated antennas. Main RF connector GNSS connector 1 Diversity / MIMO / GNSS connector 2...

  • Page 42: Antenna And Cabling

    Product Technical Specification & Customer Design Guidelines Antenna and cabling When selecting the antenna and cable, it is critical to RF performance to optimize antenna gain and cable loss. Note: For detailed electrical performance criteria, see Appendix A: Antenna Specification on page 69.

  • Page 43: Ground Connection

    RF Specifications Ground connection When connecting the module to system ground: • Prevent noise leakage by establishing a very good ground connection to the module through the host connector. • Connect to system ground using the two mounting holes at the top of the module (shown in Figure 4-1 on page 41).

  • Page 44: Device-Generated Rf Interference

    To determine the extent of any receiver performance desensitization due to self- generated noise in the host device, over-the-air (OTA) or radiated testing is required. This testing can be performed by Sierra Wireless or you can use your own OTA test chamber for in-house testing.

  • Page 45: Sensitivity Vs. Frequency

    Sales Desk (see Contact Information on page Note: Sierra Wireless has the capability to measure TIS (Total Isotropic Sensitivity) and TRP (Total Radiated Power) according to CTIA's published test procedure. Sensitivity vs. frequency Sensitivity is defined as the input power level in dBm that produces a BER (Bit Error Rate) of 2% (GSM) or 0.1% (UMTS).

  • Page 46: Conducted Rx Sensitivity / Tx Power

    Product Technical Specification & Customer Design Guidelines 2. Bandwidth for which a relaxation of the specified UE receiver sensitivity requirement (Clause 7.3 of 3GPP TS 36.521-1 v9.4.1) is allowed. Table 4-3: WCDMA frequency band support Band Frequencies Band 1 Tx: 1920–1980 MHz WCDMA 2100 Rx: 2110–2170 MHz Band 5...

  • Page 47: Table 4-6: Conducted Rx (Receive) Sensitivity-Umts Bands

    RF Specifications Table 4-6: Conducted Rx (Receive) sensitivity — UMTS bands Conducted Rx sensitivity (dBm) UMTS bands Primary / Secondary Primary Secondary (Typical) (Typical) (Worst case) Band 1 (UMTS 2100) -111.7 -111.6 -106.7 0.1% BER Band 5 (UMTS 850) -112.3 -111.9 -104.7 12.2 kbps...

  • Page 48: Gnss Specifications

    Product Technical Specification & Customer Design Guidelines Table 4-8: Conducted Tx (Transmit) power tolerances (Continued) Conducted Parameter Notes transmit power UMTS Band 1 (IMT 2100 12.2 kbps) Band 5 (UMTS 850 12.2 kbps)  +23 dBm 1 dB Connectorized (Class 3) Band 6 (UMTS 800 12.2 kbps) Band 19 (UMTS 850 12.2 kbps) GSM / EDGE...
  • Page 49 RF Specifications 2. Acquisition sensitivity is the lowest GNSS signal level for which the device can still detect an in-view satellite 50% of the time. Rev 10 Mar.15 Proprietary and Confidential - Contents subject to change...
  • Page 50 Product Technical Specification & Customer Design Guidelines Proprietary and Confidential - Contents subject to change 4114225...

  • Page 51: Power

    5: Power Power consumption Power consumption measurements in the tables below are for the MC7330 Mini Card module connected to the host PC via USB. The module does not have its own power source and depends on the host device for power. For a description of input voltage requirements, see Power supply on page Table 5-1: Averaged standby DC power consumption...

  • Page 52: Table 5-2: Averaged Call Mode Dc Power Consumption

    Product Technical Specification & Customer Design Guidelines Table 5-2: Averaged call mode DC power consumption Current Description Notes Unit • 68/23 Mbps—0 dBm Tx power • 10 MHz bandwidth • MIMO operation • 68/23 Mbps—20 dBm Tx power • 10 MHz bandwidth •...

  • Page 53: Module Power States

    Power Table 5-3: Miscellaneous DC power consumption Current / Voltage Signal Description Unit Notes / configuration High speed USB connection, C = 50 pF USB active current on D+ and D- signals • Assumes power supply turn on time > 100µs Inrush current 2500 •...

  • Page 54: Power State Transitions

    Product Technical Specification & Customer Design Guidelines Table 5-4: Module power states (Continued) State Details •     Sleep Normal state of module between calls or data connections • Module cycles between wake (polling the network) and sleep, at network provider- determined interval.

  • Page 55: Power Interface

    Power current_vcc < VOLT_LO_WARN Normal mode current_temp > TEMP_HI_WARN Low supply voltage warning Normal mode current_vcc > VOLT_LO_NORM High temperature warning current_temp < TEMP_HI_NORM current_vcc > VOLT_LO_NORM current_temp <= TEMP_HI_NORM current_vcc < VOLT_LO_CRIT current_temp > TEMP_HI_CRIT Low power mode current_vcc > VOLT_HI_CRIT Handled by Power Off mode Host cuts power to VCC line...

  • Page 56: Transmit Power Waveform (Gsm)

    Product Technical Specification & Customer Design Guidelines Table 5-6: Power-on timing parameters (double enumeration) Parameter Typical (s) Maximum (s) t_pwr_on_seq 0.43 t_USB_active 0.25 t_USB_suspend Table 5-7: Power-on timing parameters (single enumeration) Parameter Typical (s) Maximum (s) t_pwr_on_seq USB enumeration The unit supports single and double USB enumeration with the host: •...

  • Page 57: Power Supply Noise

    Power Power supply noise Noise in the power supply can lead to noise in the RF signal. The power supply ripple limit for the module is no more than 200 mVp-p 1 Hz to 100 kHz. This limit includes voltage ripple due to transmitter burst activity. Additional decoupling capacitors can be added to the main VCC line to filter noise into the device.
  • Page 58 Product Technical Specification & Customer Design Guidelines Proprietary and Confidential - Contents subject to change 4114225...

  • Page 59: Software Interface

    Windows and Linux SDKs (including API and drivers) USB interface The device supports the Qualcomm QMI interface. Please contact your Sierra Wireless account representative for QMI interface documentation. MTU size (Windows 7) The MTU (Maximum Transmission Unit) size is configured using a driver installer command line option: MTUSize=<value>...
  • Page 60 Product Technical Specification & Customer Design Guidelines Proprietary and Confidential - Contents subject to change 4114225...

  • Page 61: Mechanical And Environmental Specifications

    7: Mechanical and Environmental Specifi- cations The MC7330 module complies with the mechanical and environmental specifications in Table 7-1. Final product conformance to these specifications depends on the device implementation. Table 7-1: Mechanical and environmental specifications Mode Details Temperature Operational Class A : -30ºC to +70ºC (3GPP compliant)

  • Page 62: Device Views

    Product Technical Specification & Customer Design Guidelines Table 7-1: Mechanical and environmental specifications (Continued) Mode Details (Electrostatic discharge Operational The RF port (antenna launch and RF connector) complies with (See Electrostatic the IEC 61000-4-2 standard: discharge (ESD) • Electrostatic Discharge Immunity: Test: Level3 page 64.) Contact Discharge: ±6 kV Air Discharge: ±8 kV...

  • Page 63: Labeling

    Note: The displayed label is an example only. The production label will vary by SKU. The MC7330 label is non-removable and contains: • Sierra Wireless logo and product name Rev 10 Mar.15 Proprietary and Confidential - Contents subject to change...

  • Page 64: Electrostatic Discharge (Esd)

    Product Technical Specification & Customer Design Guidelines • IMEI number in Code-128 barcode format • number (when required) • Factory Serial Number (FSN) in alphanumeric format • Manufacturing date code (incorporated into FSN) • Licensed vendor logo • Applicable certification marks/details (e.g. FCC ID, CE information, etc. Example shows FCC ID.) Note: The MC7330 supports partner-specific label requirements.
  • Page 65 Mechanical and Environmental Specifications Specific areas requiring heat dissipation are shown in Figure 7-4: • RF—Top and bottom faces of module near RF connectors. Likely to be the hottest area. • Baseband—Top and bottom faces of module, below the RF area. To enhance heat dissipation: •...
  • Page 66 Product Technical Specification & Customer Design Guidelines Proprietary and Confidential - Contents subject to change 4114225...

  • Page 67: Regulatory Compliance And Industry Certifications

    (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well- constructed network, the Sierra Wireless modem should not be used...
  • Page 68 Product Technical Specification & Customer Design Guidelines In an aircraft, the MC7330 modem MUST BE POWERED OFF. Otherwise, the MC7330 modem can transmit signals that could interfere with various onboard systems and may be dangerous to the operation of the aircraft or disrupt the cellular network.

  • Page 69: Antenna Specification

    • Includes mismatch losses, losses in the matching circuit, and antenna losses, excluding cable loss. • Sierra Wireless recommends using antenna efficiency as the primary parameter for evaluating the antenna system. Peak gain is not a good indication of antenna performance when integrated with a host device (the antenna does not provide omni-directional gain patterns).
  • Page 70 Product Technical Specification & Customer Design Guidelines Table A-1: Antenna requirements (Continued) Parameter Requirements Comments Radiation patterns of Ant1 Nominally Omni-directional and Ant2 radiation pattern in azimuth plane. • Envelope correlation < 0.4 on 869–894 MHz band coefficient between Ant1 •...

  • Page 71: Recommended Gnss Antenna Specifications

    Antenna Specification Recommended GNSS antenna specifications Table A-2: GNSS standalone antenna requirements Parameter Requirements Comments • Frequency range Narrow-band GPS: 1575.42 MHz ±2 MHz minimum • Wide-band GPS and GLONASS: 1565–1606 MHz recommended • Field of view (FOV) Omni-directional in azimuth •...
  • Page 72 Note: Additional testing, including active performance tests, mechanical, and accelerated life tests can be discussed with Sierra Wireless’ engineering services. Contact your Sierra Wireless representative for assistance. Proprietary and Confidential - Contents subject to change...

  • Page 73: Design Checklist

    B: Design Checklist This chapter provides a summary of the design considerations mentioned throughout this guide. This includes items relating to the power interface, RF integration, thermal considerations, cabling issues, and so on. Note: This is NOT an exhaustive list of design considerations. It is expected that you will employ good design practices and engineering principles in your integration.
  • Page 74 Product Technical Specification & Customer Design Guidelines Table B-1: Hardware integration design considerations (Continued) Suggestion Section where discussed SIM implementation on Keep very low capacitance traces on the USIM_DATA and USIM_CLK page 33 signals. Ground connection on page 43 To minimize noise leakage, establish a very good ground connection between the module and host.

  • Page 75: Testing

    Acceptance testing Note: Acceptance testing is typically performed for each shipment received. When you receive a shipment from Sierra Wireless, you should make sure it is suitable before beginning production. From a random sampling of units, test that: •...

  • Page 76: Acceptance Test Requirements

    Regulatory Compliance and Industry Certifications on page When you produce a host device with a Sierra Wireless AirPrime embedded module, you must obtain certifications for the final product from appropriate regulatory bodies in the jurisdictions where it will be distributed.

  • Page 77: Production Testing

    Testing • GCF (Global Certification Forum—www.globalcertificationforum.org) outside of North America • PTCRB (PCS Type Certification Review Board—www.ptcrb.com) in North America Production testing Note: Production testing typically continues for the life of the product. Production testing ensures that, for each assembled device, the module is installed correctly (I/O signals are passed between the host and module), and the antenna is connected and performing to specifications (RF tests).

  • Page 78: Production Test Procedure

    7. Make sure your modem is connected and running, and then establish contact with the module: · Windows systems: Use a terminal emulation/communications program ® such as Microsoft HyperTerminal to connect to the Sierra Wireless modem (see listings in Step a. Start HyperTerminal. Proprietary and Confidential - Contents subject to change 4114225...
  • Page 79 Testing File > Connection Description b. Select . The Connection Description dialog box appears. i. Type Sierra in the Name box and click . The Connect To dialog box appears. ii. Click without changing any of the displayed information. The Connect dialog box appears.

  • Page 80: Umts (Wcdma/Gsm) Rf Transmission Path Test

    Product Technical Specification & Customer Design Guidelines 15. Test standalone GNSS functionality—See GNSS RF receive path test on page Downloading and configuring minicom for Linux systems Note: This procedure is for Ubuntu systems. If you are using a different Linux distribution, use the appropriate commands for your system to download minicom.
  • Page 81 Testing Table C-1: Test settings — UMTS transmission path (Continued) Test Mode 850 MHz 900 MHz 1800 MHz 1900 MHz 2100 MHz category Band # GSM850 EGSM900 DCS1800 PCS1900 Band ID Tx Channel a. Channel values shown are at the center of the corresponding bands. To test the DUT’s transmitter path: 1.

  • Page 82: Umts (Wcdma/Gsm) Rf Receive Path Test

    Product Technical Specification & Customer Design Guidelines AT!DASTXOFF (Turn off the transmitter.) 3. Test limits—Run ten or more good DUTs through this test procedure to obtain a nominal output power value.  · Apply a tolerance of 5 to 6 dB to each measurement (assuming a good setup design).
  • Page 83 Testing To test the DUT’s receive path: 1. Set up the signal generator: Note: This procedure describes steps using the Agilent 8648C signal generator—the Rohde & Schwarz SML03 is shown for reference only. a. Set the amplitude to: · -80 dBm (WCDMA mode) ·...

  • Page 84: Lte Rf Receive Path Test

    Product Technical Specification & Customer Design Guidelines · Monitor these limits during mass-production ramp-up to determine if further adjustments are needed. Note: The value measured from the DUT is significantly influenced by the test setup and DUT design (host RF cabling loss, antenna efficiency and pattern, test antenna efficiency and pattern, and choice of shield box).
  • Page 85 Testing To test the DUT’s receive path (or diversity path, while connected to the diversity antenna): 1. Set up the signal generator: Note: This procedure describes steps using the Agilent 8648C signal generator—the Rohde & Schwarz SML03 is shown for reference only. a.

  • Page 86: Gnss Rf Receive Path Test

    Product Technical Specification & Customer Design Guidelines GNSS RF receive path test The GNSS receive path uses either the dedicated GNSS connector or the shared Diversity/MIMO/GNSS connector. To test the GNSS receive path: 1. Inject a carrier signal at -110dBm, frequency 1575.52 MHz into the GNSS Rx path at the connector.

  • Page 87: Suggested Testing Equipment

    Sierra Wireless offers assistance to OEMs with the testing process, if required. Rev 10 Mar.15 Proprietary and Confidential - Contents subject to change...

  • Page 88: Extended At Commands For Testing

    Product Technical Specification & Customer Design Guidelines Extended AT commands for testing Sierra Wireless provides the [2] AirPrime MiniCard MC73xx/MC8805 AT Command Reference (Doc# 4114486), which describes proprietary AT commands that may help in hardware integration design and testing (these commands are NOT intended for use by end users).
  • Page 89 Testing Table C-4: Extended AT commands Command Description !DALGTXAGC Return Tx AGC value and transmitter parameters (LTE) !DAOFFLINE Place modem offline !DASBAND Set the frequency band (UMTS/GSM) !DASCHAN Set the modem channel (frequency) (UMTS/GSM) !DASLNAGAIN Set the LNA (Low Noise Amplifier) gain state !DASPDM Set the PDM (Pulse Duration Modulation) value !DASTXOFF...
  • Page 90 Product Technical Specification & Customer Design Guidelines Proprietary and Confidential - Contents subject to change 4114225...

  • Page 91: Packaging

    D: Packaging Sierra Wireless AirPrime Mini Cards are shipped in sealed boxes. The standard packaging (see Figure 4-1), contains a single tray with a capacity of 100 modules. (Note that some SKUs may have custom packaging—contact Sierra Wireless for SKU-specific details.) In the standard packaging, Mini Cards are inserted, system connector first, into the bottom portion (T1) of a two-part tray.
  • Page 92 Product Technical Specification & Customer Design Guidelines Proprietary and Confidential - Contents subject to change 4114225...

  • Page 93: References

    [3] PCI Express Mini Card Dev Kit Quick Start Guide (Doc# 2130705) [4] AirCard/AirPrime USB Driver Developer’s Guide (Doc# 2130634) Industry/other documents The following non-Sierra Wireless references are not included in your documentation package: [5] FCC Regulations - Part 15 - Radio Frequency Devices [6] IEC-61000-4-2 level 3 [7] IEC-61000-4-2 level (Electrostatic Discharge Immunity Test) [8] Mobile Station (MS) Conformance Specification;...
  • Page 94 Product Technical Specification & Customer Design Guidelines Proprietary and Confidential - Contents subject to change 4114225...

  • Page 95: Technology Overview

    F: Technology Overview LTE (Long Term Evolution) is a 4th-generation wireless standard. 3GPP Release 8 specification outlines the features and requirements. Key features include. • Peak data rate: · 100 Mbps DL within 20 MHz bandwidth (Peak DL data rate in 10 MHz bandwidth: 70 Mbps (approx.) for Cat 3 device) ·...

  • Page 96: Hspa

    Product Technical Specification & Customer Design Guidelines HSPA HSPA is a third generation (3G) evolution of WCDMA that combines two extensions to UMTS—HSDPA (High Speed Downlink Packet Access) and HSUPA (High Speed Uplink Packet Access). HSPA+ HSPA+ is an enhanced version of HSPA (High Speed Packet Access), as defined by the 3rd Generation Partnership Project (3GPP) Release 7 UMTS Specification for Mobile Terminated Equipment.

  • Page 97: Table F-1: Egprs Power Backoff

    Technology Overview • EGPRS—Multislot class 12 (with backoff. See Table F-1 on page 97)—Four Rx slots (maximum), four Tx slots (maximum), five active slots total • All standardized coding schemes (GMSK—CS 1 to CS 4, EDGE—MCS1 to MCS9) Table F-1: EGPRS power backoff Power Backoff (dB) Power Mode...
  • Page 98 Product Technical Specification & Customer Design Guidelines Proprietary and Confidential - Contents subject to change 4114225...

  • Page 99: Acronyms

    G: Acronyms Table G-1: Acronyms and definitions Acronym or term Definition 3GPP 3rd Generation Partnership Project 8PSK Octagonal Phase Shift Keying Automatic Gain Control A-GPS Assisted GPS Application Programming Interface Bit Error Rate—A measure of receive sensitivity BLER Block Error Rate bluetooth Wireless protocol for data exchange over short distances CDMA Development Group—a consortium of companies that develop and...
  • Page 100 Product Technical Specification & Customer Design Guidelines Table G-1: Acronyms and definitions (Continued) Acronym or term Definition Distributed Shared Memory Device Under Test EDGE Enhanced Data rates for GSM Evolution EIRP Effective (or Equivalent) Isotropic Radiated Power Electromagnetic Compatibility Electromagnetic Interference Effective Radiated Power Electrostatic Discharge Federal Communications Commission...
  • Page 101 Acronyms Table G-1: Acronyms and definitions (Continued) Acronym or term Definition HSPA+ Enhanced HSPA, as defined in 3GPP Release 7 and beyond HSUPA High Speed Uplink Packet Access Hertz = 1 cycle/second Industry Canada Intermediate Frequency IMEI International Mobile Equipment Identity IP Multimedia Subsystem—Architectural framework for delivering IP multimedia services.
  • Page 102 Product Technical Specification & Customer Design Guidelines Table G-1: Acronyms and definitions (Continued) Acronym or term Definition OMA DM Open Mobile Alliance Device Management—A device management protocol. ‘Over the air’ (or radiated through the antenna) Power Amplifier packet A short, fixed-length block of data, including a header, that is transmitted as a unit in a communications network.
  • Page 103 Acronyms Table G-1: Acronyms and definitions (Continued) Acronym or term Definition An LTE signaling interface for SMS (“SMS over SGs”) System Information Block Subscriber Identity Module. Also referred to as USIM or UICC. SIMO Single Input Multiple Output—smart antenna technology that uses a single antenna at the transmitter side and multiple antennas at the receiver side.
  • Page 104 Product Technical Specification & Customer Design Guidelines Table G-1: Acronyms and definitions (Continued) Acronym or term Definition Wide Area Network WCDMA Wideband Code Division Multiple Access (also referred to as UMTS) WLAN Wireless Local Area Network Zero Intermediate Frequency Proprietary and Confidential - Contents subject to change 4114225...
  • Page 105 Index Numerics block diagram expanded RF, 25 system, 24 3D gain, average bottom view, 62 gain 3D average (GNSS), 71 3GPP compliance GSM/GPRS/EDGE, 21 LTE, 21 cable loss UMTS, 21 antenna, maximum, 41 capacitors with SIM, 33 with XIM_DATA / XIM_CLK, 33 carrier/operator testing, 87...
  • Page 106 Product Technical Specification & Customer Design Guidelines EDGE host interface overview, 96 assignments, 25 bands supported, 15 HSDPA connector, required, 19 bands supported, 15 electrical specifications, 23 HSPA electrostatic discharge specifications, 62 overview, 96 electrostatic discharge. See ESD HSPA+ envelope correlation coefficient, 70 overview, 96 environmental...
  • Page 107 Index PSS, 17 mean effective gain, 70 mean effective gain imbalance, 70 mechanical specifications, 61– 64 interface, 59 MIB, 17 QPST (QUALCOMM Product Support Tool), 59 MIMO support, 15 QUALCOMM Product Support Tool (QPST), 59 minicom quality assurance tests, 86 downloading and installing, 80 QXDM...
  • Page 108 Product Technical Specification & Customer Design Guidelines sensitivity testing conducted, RF parameter, 46, 47 overview, 75 defined, 45 acceptance tests, 75 radiated measurement, overview, 44 assistance provided by Sierra Wireless, 87 testing, overview, 44 certification tests, 76 shielding equipment, suggested, 87 module, compliance, 41 interoperability and operator/carrier...
  • Page 109 Index ZIF (Zero Intermediate Frequency), 43 Rev 10 Mar.15 Proprietary and Confidential - Contents subject to change...

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