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1.
Introduction
This document is the Product Technical Specification for the AirPrime HL7519 Embedded Module. It
defines the high level product features and illustrates the interfaces for these features. This document
is intended to cover the hardware aspects of the product, including electrical and mechanical.
The AirPrime HL7519 belongs to the AirPrime HL Series from Essential Connectivity Module family.
These are industrial grade Embedded Wireless Modules that provide data connectivity on wireless
networks (as listed in Table 1 Supported Bands/Connectivity).
The HL7519 supports a large variety of interfaces such as USB 2.0, UART, GPIOs, and dual SIM to
provide customers with the highest level of flexibility in implementing high-end solutions.
Table 1.
Supported Bands/Connectivity
RF Band
LTE B2
LTE B4
LTE B13
1.1.
Common Flexible Form Factor (CF
The AirPrime HL7519 belongs to the Common Flexible Form Factor (CF
family consists of a series of WWAN modules that share the same mechanical dimensions (same
width and length with varying thicknesses) and footprint. The CF
solution to a series of problems faced commonly in the WWAN module space as it:
Accommodates multiple radio technologies (from 2G to LTE advanced) and band groupings
Supports bit-pipe (Essential Module Series) and value add (Smart Module Series) solutions
Offers electrical and functional compatibility
Provides Direct Mount as well as Socketability depending on customer needs
1.2.
Physical Dimensions
AirPrime HL7519 module is a compact, robust, fully shielded module with the following dimensions:
Length: 23 mm
Width: 22 mm
Thickness: 2.5 mm
Weight: 3.5 g
Note:
Dimensions specified above are typical values.
TBC
Transmit band (Tx)
1850 to 1910 MHz
1710 to 1755 MHz
777 to 787 MHz
Rev 1.0
Receive band (Rx)
1930 to 1990 MHz
2110 to 2155 MHz
746 to 756 MHz
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)
) family of modules. This
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form factor provides a unique
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July 28, 2015
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