Hardware Assembly; Figure 34. Hardware Assembly With Heat Plate Down - VersaLogic Blackbird VL-EPU4562 Hardware Reference Manual

Installing VersaLogic Thermal Solutions
The following thermal solution accessories are available from VersaLogic:
VL-HDW-401 Thermal Compound Paste – used to mount the heat sink to the heat plate

VL-HDW-417 Passive Heat Sink – mounts to standard product.

VL-HDW-418 Fan Assembly – Cooling fan for the HDW-417 passive heatsink. Operates at

+12 V and includes an EPU-4562/4462 compatible connector
VL-HDW-408 Heat Pipe Block – mounts to heat plate


Hardware Assembly

There are two basic assembly methods:
Heat plate down (in relation to the enclosure)

Heat plate up

These assembly methods are shown in Figure 35 and Figure 36 respectively.
Heat Plate Down
The figure below (a representative image of a similar VersaLogic product) shows the assembly.
Use this assembly method if you are attaching the Blackbird to a larger thermal solution such as a
metal chassis/enclosure.

Figure 34. Hardware Assembly with Heat Plate Down

A thermal interface compound must be applied to the heat plate to thermally bond it to the
mounting plate or other surface to which the Blackbird is mounted. Spread the compound thinly
and evenly across the entire heat plate surface before mounting. The compound is supplied in the
VL-CKR-BLACKBIRD cable kit or sold separately as part number VL-HDW-401.
VL-EPU-4562/4462 Reference Manual
Thermal Considerations
71