Thermal Specifications, Restrictions, And Conditions; Vl-Epu-4562/4462 Reference Manual; Overall Restrictions And Conditions; Heat Plate Only Restrictions And Conditions - VersaLogic Blackbird VL-EPU4562 Hardware Reference Manual

Thermal Specifications, Restrictions, and Conditions

Graphical test data is in the section titled EPU-4562/4462 Thermal Characterization, beginning
on page 68. Refer to that section for the details behind these specifications. These specifications
are the thermal limits for using the EPU-4562/4462 with one of the defined thermal solutions.
Due to the unknown nature of the entire thermal system, or the performance requirement of the
application, VersaLogic cannot recommend a particular thermal solution. This information is
intended to provide guidance in the design of an overall thermal system solution.

Table 24: Absolute Minimum and Maximum Air Temperatures

Board
4562/4462
VL-EPU-
EBP
4562/4462
VL-EPU-
ECP

Overall Restrictions and Conditions:

Ranges shown assume less than 90% CPU utilization.

Keep the maximum CPU core temperature below 100ºC.

The ambient air surrounding the EPU-4562/4462 needs to be maintained at 85 ºC or below.

This includes the space between the two main boards as well as the space beneath an
installed Mini PCIe expansion board. A recommended overall airflow of 100 linear feet per
minute (LFM) / 0.5 linear meters per second (LMS) addresses this requirement. If this air
flow is not provided, other means must be implemented to keep the adjacent air at 85 ºC or
below.

Heat Plate Only Restrictions and Conditions:

The heat plate must be kept below 90 °C. This applies to a heat plate mounted directly to

another surface as well as when the HDW-408 heat pipe block is used.

Heat Sink Only Considerations:

At 85°C air temperature and 90% CPU utilization, there will be little if any thermal margin

to a CPU core temperature of 100 °C or the passive trip point (see test data). If this is the use
case, consider adding a fan or other additional airflow.

Heat Sink with Fan Considerations:

The heat sink and fan combination cools the CPU when it is running in high temperature

environments, or when the application software is heavily utilizing the CPU or video
circuitry. The fan assists in cooling the heat sink and provides additional air movement
within the system.
Integrator's Note: The ambient air surrounding the EPU-4562/4462 needs to be

maintained at 85 °C or below.

VL-EPU-4562/4462 Reference Manual

With Heat Plate
-40 ° to +85 °C
-40 ° to +85 °C
With Heat Sink With Heat Sink + Fan
(HDW-417) (HDW-417 + HDW-418)
-40 ° to +85 °C
-40 ° to +85 °C
Thermal Considerations
-40 ° to +85 °C
-40 ° to +85 °C
67