Epu-4562/4462 Thermal Characterization; Table 25: Epu-4562/4462 Thermal Testing Setup - VersaLogic Blackbird VL-EPU4562 Hardware Reference Manual

EPU-4562/4462 Thermal Characterization

The EPU-4562/4462 board underwent the following thermal characterization tests:
Test Scenario 1: Core i5 EPU-4562-EBP – active and passive thermal characterization.
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Test Scenario 2: Core i7 EPU-4562-ECP – active and passive thermal characterization.
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The table below describes the thermal testing setup for the board.
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Table 25: EPU-4562/4462 Thermal Testing Setup

Hardware
configuration
BIOS
Operating system
Test software
Test environment
Note: This device connects through a VersaLogic VL-CBR-4005B paddleboard.
The test results reflect the test environment within the temperature chamber used. The airflow of
this particular chamber is about 0.5 linear meters per second (~100 linear feet per minute).
Thermal performance improves by increasing the airflow beyond 0.5 linear meters per second.
The system power dissipation is primarily dependent on the application program; that is, its use
of computing or I/O resources. The stress levels used in this testing are at the top of the range of
a typical user's needs.
VL-EPU-4562/4462 Reference Manual
EPU-4562/4462 (Blackbird) dual/quad core CPU with:
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16 GB of DDR4 DRAM
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HDW-417 (passive heat sink)
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HDW-418 (heat sink fan)
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One VGA display device (connected through the LVDS interface), one
display for monitor
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Two SATA hard disk drives
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Two RS-232 ports in loopback configuration
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One VersaLogic VL-MPEe-E3 Mini PCIe Gigabit Ethernet module
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Two active Ethernet ports in loopback configuration
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Two USB 2.0 ports in loopback configuration (Note)
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USB keyboard and mouse (Note)
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ID string: VER2A000
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Passive thermal trip point setting: 105 ºC
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Critical thermal trip point setting: 111 ºC
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Microsoft Windows* 10 Enterprise
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Passmark BurnIn* Test v8.1 b1018
- CPU utilization ~90%

Intel Thermal Analysis Tool* (TAT) v5.0.1026
- Primarily used to read the CPU core temperature

Thermal chamber
Thermal Considerations
68