Outline; Package Components - Renesas Emulation Probe M306V8T-EPB User Manual

M306V8T-EPB User's Manual

1. Outline

This chapter describes the package components, the system configuration, the specifications of the emulator functions and the
operating environment.

1.1 Package Components

The M306V8T-EPB package consists of the following items. When unpacking it, check to see if your M306V8T-EPB contains
all of these items.
Table 1.1 Package components
M306V8T-EPB emulation probe
M306V8T-PTC (pre-mounted) converter board for 116-pin 0.65-mm-pitch LQFP
NQPACK116SB, YQPACK116SB and YQ-GUIDE(x4)
for connecting the M306V8T-PTC and user system
OSC-3 (16MHz) oscillator circuit board
OSC-2 oscillator circuit bare board
Network registers for ports P0--P5 pullup (51kΩ x 8)
Hardware tool user registration FAX sheet (English)
Hardware tool user registration FAX sheet (Japanese)
M306V8T-EPB User's Manual (this manual)
M306V8T-EPB User's Manual (Japanese)
M306V8T-EPB Supplementary Document (English)
M306V8T-EPB Supplementary Document (Japanese)
* Please keep the M306V8T-EPB's packing box and cushion material in your place for reuse at a later time when sending your
product for repair or other purposes. Always use these packing box and cushion material when transporting this product.
* If there is any question or doubt about the packaged product, contact your local distributor.
* NQPACK116SB, YQPACK116SB and YQ-GUIDE are trademarks of Tokyo Eletech Corporation. For purchasing or
technical information, contact your local distributor.
REJ10J0777-0100 Rev.1.00 2005.08.01
Item
1. Outline
Quantity
1
1
1
1
1
6
1
1
1
1
1
1
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