Recommended Oscillating Conditions; Handling Precaution - Philips CEM2100/00 Service Manual

22. Electrical Characteristics

22.8 Handling Precaution

22.7 Recommended Oscillating Conditions

Note 1: To ensure stable oscillation, the resonator position, load capacitance, etc. must be appropriate. Because these factors are
greatly affected by board patterns, please be sure to evaluate operation on the board on which the device will actually be
mounted.
Note 2: The product numbers and specifications of the resonators by Murata Manufacturing Co., Ltd. are subject to change. For
up-to-date information, please refer to the following URL:
http://www.murata.com/
22.8 Handling Precaution
- The solderability test conditions for lead-free products (indicated by the suffix G in product name) are shown
below.
1. When using the Sn-37Pb solder bath
2. When using the Sn-3.0Ag-0.5Cu solder bath
-
When using the device (oscillator) in places exposed to high electric fields such as cathode-ray tubes, we recommend elec-
trically shielding the package in order to maintain normal operating condition.
XIN
C
1
(1) High-frequency Oscillation
Solder bath temperature = 230 °C
Dipping time = 5 seconds
Number of times = once
R-type flux used
Solder bath temperature = 245 °C
Dipping time = 5 seconds
Number of times = once
R-type flux used
Note:
The pass criteron of the above test is as follows:
Solderability rate until forming ≥ 95 %
XOUT XTIN
C C
2 1
(2) Low-frequency Oscillation
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T5CL8
XTOUT
C
2