Download Print this page
Infineon Technologies IR3899 User Manual

Infineon Technologies IR3899 User Manual

Supirbuck international ior rectifier

Advertisement

Quick Links

SupIRBuck
USER GUIDE FOR IR3899 EVALUATION BOARD
DESCRIPTION
The
IR3899
is
a
converter,
providing
performance and flexible solution in a small
4mm X 5 mm Power QFN package.
Key features offered by the IR3899 include
internal Digital Soft Start/Soft Stop, precision
0.5Vreference
voltage,
thermal protection, programmable switching
frequency, Enable input, input under-voltage
lockout for proper start-up, enhanced line/
load regulation with feed forward, external
frequency
synchronization
clocking, internal LDO
up.

BOARD FEATURES

V
= +12V (+ 13.2V Max)
in
• V
= +1.2V @ 0- 9A
out
F
=400KHz
s
L= 1.0uH
C
= 4x10uF (ceramic 1206) + 1X330uF (electrolytic)
in
C
=6x47uF (ceramic 0805)
out
9/18/2012
TM
1.2Vout
synchronous
buck
a
compact,
high
,
Power
Good
with
smooth
and pre-bias start-
IRDC3899-P1V2
Output
over-current protection
implemented by sensing the voltage developed
across the on-resistance of the synchronous
rectifier
MOSFET
performance and the current limit is thermally
compensated.
This user guide contains the schematic and bill
of materials for the IR3899 evaluation board.
The guide describes operation and use of the
evaluation board itself. Detailed
information for IR3899 is available in the
IR3899 data sheet.
function
for
optimum cost
application
is
and
1

Advertisement

loading
Need help?

Need help?

Do you have a question about the IR3899 and is the answer not in the manual?

Questions and answers

Subscribe to Our Youtube Channel

Summary of Contents for Infineon Technologies IR3899

  • Page 1: Board Features

    4mm X 5 mm Power QFN package. performance and the current limit is thermally compensated. Key features offered by the IR3899 include internal Digital Soft Start/Soft Stop, precision This user guide contains the schematic and bill 0.5Vreference voltage,...
  • Page 2 VOUT+ and VOUT-. The inputs and output connections of the board are listed in Table I. IR3899 has only one input supply and internal LDO generates Vcc from Vin. If operation with external Vcc is required, then R15 can be removed and external Vcc can be applied between Vcc+ and Vcc- pins. Vin pin and Vcc/LDOout pins should be shorted together for external Vcc operation.
  • Page 3 IRDC3899-P1V2 Connection Diagram Vout Enable VDDQ Top View Vref Sync S-Ctrl AGnd PGood Vsns Vcc+ Vcc- Bottom View Fig. 1: Connection Diagram of IR3899/98/97 Evaluation Boards 9/18/2012...
  • Page 4 IRDC3899-P1V2 Fig. 2: Board Layout-Top Layer Single point connection between AGnd and PGnd Fig. 3: Board Layout-Bottom Layer 9/18/2012...
  • Page 5 IRDC3899-P1V2 Fig. 4: Board Layout-Mid Layer 1 Fig. 5: Board Layout-Mid Layer 2 9/18/2012...
  • Page 6 IRDC3899-P1V2 9/18/2012...
  • Page 7: Bill Of Materials

    Thick Film, 0603,1/10W,1% Panasonic ERJ-3EKF20R0V Thick Film, 0603,1/10W,1% 60.4K Panasonic ERJ-3EKF6042V Thick Film, 0603,1/10W R10 R13 R14 R15 R50 Panasonic ERJ-3GEY0R00V Thick Film, 0603,1/10W,1% R17 R18 49.9K Panasonic ERJ-3EKF4992V Thick Film, 0603,1/10W,1% 7.5K Panasonic ERJ-3EKF7501V IR3899 PQFN 4x5mm IR3899MPBF 9/18/2012...
  • Page 8 IRDC3899-P1V2 TYPICAL OPERATING WAVEFORMS Vin=12.0V, Vo=1.2V, Io=0-9A, Room Temperature, no airflow Fig. 8: Start up at 9A Load, Fig. 7: Start up at 9A Load , Ch , Ch , Ch :Vcc , Ch , Ch :Enable good Good Fig. 10: Output Voltage Ripple, 9A load Fig.
  • Page 9 IRDC3899-P1V2 TYPICAL OPERATING WAVEFORMS Vin=12.0V, Vo=1.2V, Io=0-9A, Room Temperature, no air flow Fig. 13: Transient Response, 0A to 3A step Ch4-Iout 9/18/2012...
  • Page 10 IRDC3899-P1V2 TYPICAL OPERATING WAVEFORMS Vin=12.0V, Vo=1.2V, Io=0-9A, Room Temperature, no air flow Fig. 14: Bode Plot at 9A load shows a bandwidth of 78.13KHz and phase margin of 55.5 degrees 9/18/2012...
  • Page 11 IRDC3899-P1V2 TYPICAL OPERATING WAVEFORMS Vin=12.0V, Vo=1.2V, Io=0-9A, Room Temperature, no air flow Io [A] Fig.15: Efficiency versus load current Io [A] Fig.16: Power loss versus load current 9/18/2012...
  • Page 12 IRDC3899-P1V2 THERMAL IMAGES Vin=12.0V, Vo=1.2V, Io=0-9A, Room Temperature, No Air flow Fig. 17: Thermal Image of the board at 9A load Test point 1 is IR3899 Test point 2 is inductor 9/18/2012...
  • Page 13 IRDC3899-P1V2 PCB METAL AND COMPONENT PLACEMENT Evaluations have shown that the best overall performance is achieved using the substrate/PCB layout as shown in following figures. PQFN devices should be placed to an accuracy of 0.050mm on both X and Y axes. Self-centering behavior is highly dependent on solders and processes, and experiments should be run to confirm the limits of self-centering on specific processes.
  • Page 14 IRDC3899-P1V2 SOLDER RESIST IR recommends that the larger Power or Land Area pads are Solder Mask Defined (SMD.) This allows the underlying Copper traces to be as large as possible, which helps in terms of current carrying capability and device cooling capability. When using SMD pads, the underlying copper traces should be at least 0.05mm larger (on each edge) than the Solder Mask window, in order to accommodate any layer to layer misalignment.
  • Page 15: Stencil Design

    IRDC3899-P1V2 STENCIL DESIGN Stencils for PQFN can be used with thicknesses of 0.100-0.250mm (0.004-0.010"). Stencils thinner than 0.100mm are unsuitable because they deposit insufficient solder paste to make good solder joints with the ground pad; high reductions sometimes create similar problems. Stencils in the range of 0.125mm-0.200mm (0.005-0.008"), with suitable reductions, give the best results.
  • Page 16: Package Information

    IRDC3899-P1V2 PACKAGE INFORMATION Figure 21: Package Dimensions IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 This product has been designed and qualified for the Industrial market Visit us at www.irf.com for sales contact information Data and specifications subject to change without notice.06/11 9/18/2012...