Table of Contents
Advertisement
3.
Measurement
3.1
Performing Measurements
3.1.1
Leeb Testing Procedure (except Leeb U)
Select automatic compensation for impact direction "Automatic", see
chapter "3.2.1 Controls". If "Automatic" is not allowed, set the impact
direction ( ). The Equotip Leeb Impact Devices DL doesn't sup-
port automatic mode. The impact direction must be selected manually.
Select the appropriate material group, hardness scales and number of
impacts per measurement series. For more information see chapter "4.
Settings". Conduct impacts by cycling through "load, position and trig-
ger" mechanism:
2. Position the support ring on the test
3. To trigger an impact, press the
Figure 4:
Leeb Testing Procedure
© 2016 Proceq SA
1. Load the impact device – while not in
contact with the test piece – by hold-
ing it firmly with one hand and sliding
the loading tube with the other hand
until contact is grabbed by the clutch.
piece. Take particular care to fully
position the support ring on the test
piece, but not coinciding with a previ-
ous test indentation.
trigger button to release the impact
body. To perform another impact,
repeat this cycle.
After the last of the impacts is performed, the hardness average and fur-
ther statistics of the measurement series are displayed.
NOTE! Make sure the loading tube is allowed to slowly return
back to the starting position. Do take care so the loading
tube does not spring back uncontrolled, which may result in
permanent device damage.
NOTE! If possible, follow the standard practice of Leeb re-
bound hardness testing as described in the standards DIN
50156-1 (metallic materials), ASTM A956 (steel, cast steel and
cast iron only), or other applicable standards. If these are not
available, the user is recommended to average a minimum of
n = 3 impacts at an indentation distance of 3 to 5 mm (0.12
to 0.20") for each location of the sample that shall be tested.
NOTE! Do not carry out an impact in an area that has already
been deformed by another impact. Also, do not load the device
when it is already positioned in the new test location, since the
material under the device may be affected through prior stress,
and the catch chuck of the device may get damaged.
Table of Contents
7
Hide quick links:
Advertisement
Table of Contents
