HP CL2100 G3 807S User And Maintenance Manual page 80


Be careful not to touch the CPU pins

When installing the CPU, remember to place the side with triangle point onto the triangle on the
board

Correctly installing the CPU is not enough. You must also consider the heat radiation; if the CPU
temperature is too high, it might affect the system performance. The heat sink is used for the CPU heat
radiation. When you install heat sink, observe the following guidelines:
When you install the heat sink:

Align the heat sink so the sticker label faces the memory module

Secure the heat sink with the screw
DIMM handling and installation guidelines
CAUTION:
the system board connector.
DIMM population order and configuration is critical in maximizing performance for the system.
When handling a DIMM, observe the following guidelines:

Avoid electrostatic discharge.

Always hold DIMMs by the side edges only.

Avoid touching the connectors on the bottom of the DIMM.

Never wrap your fingers around a DIMM.

Avoid touching the components on the sides of the DIMM.

Never bend or flex the DIMM.
When installing a DIMM, observe the following guidelines:

Before seating the DIMM, open the DIMM slot and align the DIMM with the slot. Some servers require
the use of a DIMM tool to open the slots.

To align and seat the DIMM, use two fingers to hold the DIMM along the side edges.

To seat the DIMM, use two fingers to apply gentle pressure along the top of the DIMM.
SAS/SATA and SSD drive guidelines
When adding drives to the server, observe the following general guidelines:

Drives must be the same capacity to provide the greatest storage space efficiency when drives are
grouped together into the same drive array.

Drives in the same logical volume must be of the same type.
Failure to properly handle DIMMs can cause damage to DIMM components and
Diagnostic flowcharts 80