Page 1 HPE Cloudline CL5200 Gen9 Server User and Maintenance Guide Abstract This document is for the person who installs, administers, and troubleshoots servers and storage systems. Hewlett Packard Enterprise assumes you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels.
Page 2 © Copyright 2018 Hewlett Packard Enterprise Development LP Notices The information contained herein is subject to change without notice. The only warranties for Hewlett Packard Enterprise products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. Hewlett Packard Enterprise shall not be liable for technical or editorial errors or omissions contained herein.
Page 3: Table Of Contents
Contents Contents ..............................3 Component identification .......................... 7 Front panel components ............................7 Front panel LEDs and buttons ..........................8 Rear panel components ............................9 Rear panel LEDs and buttons ..........................10 System board components ............................. 11 DIMM slots ................................12 Memory module population rules ........................
Page 4 Installing a processor........................... 39 Memory modules ..............................40 Removing the memory module........................40 Installing the memory module........................41 Riser boards ................................42 Removing the riser board ..........................42 Installing the riser board ..........................43 Host Bus Adapter (HBA) cards ..........................44 Installing the HBA card ..........................
Page 5 Cabling ..............................86 Internal system cable routing ..........................86 Storage cable connection ............................88 Storage node ............................... 88 External miniSAS connection ..........................89 CL5200 one-node configuration ........................89 CL5200 two-node configuration........................89 Software and configuration utilities ......................90 HPE BMC ................................90 Web GUI introduction ..........................
Page 6 Japanese Voluntary Control Council for Interference (VCCI) statement .............. 129 Global notice for Class A equipment ........................129 CCC Class A notice .............................. 129 Declarations of Conformity ........................... 129 Taiwanese Class A warning statement ........................ 129 MSIP warning ............................... 129 Notice for Korea ..............................
Page 7: Component Identification
Component identification Front panel components CL5200 one-node configuration Item Description Compute node 1 Storage node 1 Compute node blank Storage node 2 Component identification 7...
Page 8: Front Panel Leds And Buttons
CL5200 two-node configuration Item Description Compute node 1 Storage node 1 Compute node 2 Storage node 2 Front panel LEDs and buttons NOTE: The SFP OCP card compute node model was used for the following procedure. Other models may differ. Item Description Status...
Page 9: Rear Panel Components
Rear panel components Item Description PSU2 Fan control board module FCB dedicated management port FCB serial console port PSU1 System fan 8086 (5) Component identification 9...
Page 10: Rear Panel Leds And Buttons
Rear panel LEDs and buttons Item Description Status PSU status Solid green = PSU working well Off = PSU has failed FCB status LED Solid green = Health Solid yellow =  A fan(s) speed is 0  A fan(s) is not present ...
Page 11: System Board Components
System board components Item Description PCIe x16 slot Processor 0 Memory module (16) Processor 1 Power connector (2) SATA connector Mezzanine connector USB 3.0 (2) VGA port Power button Component identification 11...
Page 12: Dimm Slots
DIMM slots DIMM slots are numbered sequentially (1 through 8). Use the population order below for spare replacement. Memory module population rules DIMM Slot # One CPU 1 DIMM 2 DIMMs 4 DIMMs 8 DIMMs Two CPUs 2 DIMMs 4 DIMMs 6 DIMMs 8 DIMMs 16 DIMMs...
Page 13: Dimm Label Identification
DIMM label identification To determine DIMM characteristics, see the label attached to the DIMM. Item Description Status Capacity 8 GB 16 GB 32 GB 64 GB 128 GB Rank 1R = Single rank 2R = Dual rank 4R = Quad rank 8R = Octal rank Data width on DRAM x4 = 4-bit...
Page 14: Fan Bay Numbering
Storage node Fan bay numbering Component identification 14...
Page 15: Operations
Operations Power up the server NOTE: Before powering up the system, make sure the compute and storage nodes are connected using external miniSAS cables. To power up the server, use one of the following methods:  Press the Power On/Standby button. ...
Page 16: Setup
Setup Safety and regulatory compliance For important safety, environmental, and regulatory information, see Safety and Compliance Information for Server, Storage, Power, Networking, and Rack Products, available at the Hewlett Packard Enterprise website http://www.hpe.com/support/Safety-Compliance-EnterpriseProducts. Optimum environment When installing the server in a rack, select a location that meets the environmental standards described in this section.
Page 17: Temperature Requirements
Temperature requirements To ensure continued safe and reliable equipment operation, install or position the system in a well-ventilated, climate-controlled environment. The recommended ambient operating temperature (TMRA) for most server products is 5°C (41°F) to 35°C (95°F). The temperature in the room where the rack is located must not exceed 35°C (95°F). CAUTION: To reduce the risk of damage to the equipment when installing third-party options: ...
Page 18: Rack Warnings
Connecting a DC power cable to a DC power source WARNING: To reduce the risk of electric shock or energy hazards:  This equipment must be installed by trained service personnel, as defined by the NEC and IEC 60950-1, Second Edition, the standard for Safety of Information Technology Equipment.
Page 19: Identifying The Contents Of The Server Shipping Carton
WARNING: To reduce the risk of personal injury or damage to the equipment, adequately stabilize the rack before extending a component outside the rack. Extend only one component at a time. A rack may become unstable if more than one component is extended. WARNING: When installing a server in a telco rack, be sure that the rack frame is adequately secured at the top and bottom to the building structure.
Page 20: Installing The Operating System
Installing the operating system This server does not ship with provisioning media. To operate properly, the server must have a supported operating system. Attempting to run an unsupported operating system can cause serious and unpredictable results. To install an operating system, insert the operating system CD into a USB-attached DVD-ROM drive (user provided) and reboot the node.
Page 21: Hardware Options Installation
Hardware options installation Introduction If more than one option is being installed, read the installation instructions for all the hardware options and identify similar steps to streamline the installation process. WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
Page 22: Installing The Compute Node
Installing the compute node Installing the redundant compute node To install the redundant compute node: Loosen the thumb screws to unlock the compute node blank. Pull the latch down to unlock the node from the chassis. Using the latch, pull the compute node blank out to remove it. Hardware options installation 22...
Page 23: Removing The Redundant Compute Node
Align the compute node with the bay in the chassis and slide it in. Press the compute node to seat correctly in place. Grasp the latch and lift up until the thumb screw is seated over the compute node. The thumb screw is over the screw hole when seated correctly.
Page 24 Align the compute node blank with the bay in the chassis and slide it in. Press the compute node blank to seat correctly in place. Grasp the latch and lift up until the thumb screw is seated over the node blank. The thumb screw is over the screw hole when seated correctly.
Page 25: Storage Nodes
Storage nodes NOTE: The CL5200 one-node configuration model was used for the following procedure. Other models may differ. Opening the storage node To open the storage node: Power down the server and detach all power cabling from the power supplies. Loosen the thumb screws to unlock the storage node.
Page 26: Closing The Storage Node
Closing the storage node To close the storage node: Once the storage node is fully extended, the rails lock in place to prevent accidental removal. Press the unlock lever, as shown the following figure, to allow the storage node to slide into the chassis. Press the storage node into the chassis until it is flush in the bay.
Page 27: Removing The Storage Node
Removing the Storage Node WARNING: Only remove one storage node at a time to prevent damage or injury. To remove the storage node: Open the storage node (on page 25). Disconnect the power and signal cables. Slide the storage node out of the chassis. Remove all the 3.5”...
Page 28 With all HDD assemblies removed, press the release lever to allow the inner rail to slide out of the outer rail. Remove the storage nodes. Hardware options installation 28...
Page 29: Installing The Storage Node
Installing the storage node WARNING: Only install one storage node at a time to prevent damage or injury. To install the storage node: Align the storage nodes with the outer rail. Install the storage nodes. Connect the power and signal cables. Hardware options installation 29...
Page 30 Install all the 3.5” HDD assemblies (on page 58). Press the release lever to unlock the inner rail from the outer rail, then slide the storage node into the chassis. Close the storage node (on page 26). Hardware options installation 30...
Page 31: 2.5" Hard Disk Drives
2.5” hard disk drives Removing the 2.5” hard disk drive assembly To remove the 2.5” hard disk drive assembly: Remove the compute node (on page 21). Pull the handle to rotate the HDD cage. Remove the HDD assembly from the HDD cage. Installing the 2.5”...
Page 32: Removing The 2.5" Hard Disk Drive Module
Removing the 2.5” hard disk drive module To remove the 2.5” hard disk drive module: Remove the compute node (on page 21). Remove the 2.5” HDD assembly (on page 31). Pry the HDD bracket and remove the HDD. Hardware options installation 32...
Page 33: Installing The 2.5" Hard Disk Drive Module
Installing the 2.5” hard disk drive module To install the 2.5” hard disk drive module: Pry the HDD bracket and align the screw holes on the HDD with the pins on the HDD bracket. The connector is facing the rear of the HDD bracket. Install the HDD to the HDD bracket.
Page 34: Air Baffles
Air baffles Removing the air baffle CAUTION: To avoid damaging server components, do not use force when removing the air duct. To remove the air baffle: Remove the compute node (on page 21). Locate the air baffle. Remove the screws securing the air baffle to the chassis. Gently lift the baffle out of the chassis.
Page 35: Installing The Air Baffle
Installing the air baffle CAUTION: To avoid damaging server components, do not use force when removing the air duct. Ensure all DIMM latches are locked to avoid damaging the components. To install the air baffle: To position the air baffle, see the following figure. Lower the air baffle in the chassis.
Page 36: Heat Sinks
Heat sinks Passive heat sinks cool processors. To achieve optimal cooling performance, the underside of the heat sink must be properly attached to the processor with TIM. The mechanical performance of the heat sink is designed to meet the requirements of Intel processors. The heat sink is necessary to maintain chipset temperature at or below temperature limits.
Page 37: Installing The Heat Sink
Installing the heat sink NOTE: Heat sink designs may differ between CPU0 and CPU1. To install the heat sink: Apply thermal compound evenly on the top of the CPU. Remove the protective cover from the underside of the heat sink. Place the heat sink on top of the CPU, until it is seated in place.
Page 38: Processors
Processors Removing the processor CAUTION: ESD protection must be worn during the procedure to avoid damaging the components. To remove the processor: Remove the compute node (on page 21). Remove the heat sink (on page 36). Press downward and outward on the right processor locking lever to release it. Press downward and outward on the left processor locking lever, pulling it fully open.
Page 39: Installing A Processor
Lift the processor out of the socket. Repeat the procedure for the additional processor. Installing a processor CAUTION: ESD protection must be worn during the procedure to avoid damaging the components. To install the processor: Align the gold triangle identifying pin 1 of the processor with the triangular cutout of the socket and the key-indent on the socket.
Page 40: Memory Modules
Lower the processor load plate over the processor. Push the left processor locking lever down and then latch it into the locked position. The protective plastic cover pops out as the latch is engaged. Push the right processor locking lever down and latch it into the locked position. Repeat the procedure for the additional processor.
Page 41: Installing The Memory Module
Installing the memory module The system board includes sixteen (four memory channels per processor) DIMM slots for the installation of DDR4 1600/1866/2133/2400 MHz memory. To install the memory module: Pull the locking latches of the DIMM slot outward. Place the memory module into the socket so the notch and obstruction are aligned. Press the edge connector of the memory module into the slot.
Page 42: Riser Boards
Riser boards NOTE: The SFP OCP card compute node model was used for the following procedure. Other models may differ. Removing the riser board To remove the riser board: Remove the compute node (on page 21). Remove the screw securing the riser assembly to the chassis. Remove the riser assembly from the system board.
Page 43: Installing The Riser Board
Installing the riser board To install the riser board: Install the riser board to the riser bracket. Install and secure the screw to the riser bracket. Align the connector on riser bracket assembly with the connector on the system board. Connect the riser assembly to the system board connector.
Page 44: Host Bus Adapter (Hba) Cards
Host Bus Adapter (HBA) cards NOTE: The SFP OCP card compute node model was used for the following procedure. Other models may differ. Installing the HBA card To install the HBA card: Remove the compute node (on page 21). Remove the riser assembly from the system board. Remove the screw securing the bracket blank to the riser bracket.
Page 45 Orient the HBA card with the riser guide slot and push in the direction of the arrow until the HBA card is secure in the HBA card connector. Install the HBA assembly. Gently press down to seat it in place. Secure the HBA assembly to the chassis with the screws.
Page 46: Removing The Hba Card
Removing the HBA card To remove the HBA card: Remove the compute node (on page 21). Remove the screws securing the HBA assembly to the chassis. Remove the HBA assembly from the chassis. Remove the screw securing the riser bracket to the HBA card. Remove the HBA card from the riser board.
Page 47: Ocp Mezzanine Cards
OCP mezzanine cards NOTE: The 10G OCP mezzanine card was used for the following procedure. Other models may differ. Installing the OCP mezzanine card To install the OCP mezzanine card: Remove the compute node (on page 21). Remove the riser board (on page 42). Remove the screw securing the bracket blank to the chassis.
Page 48: Removing The Ocp Mezzanine Card
Align the marks on the mezzanine card with the pins on the system board. Secure the mezzanine card to the system board with the screws. Install the riser board (on page 43). Install the compute node (on page 22). Removing the OCP mezzanine card To remove the OCP mezzanine card: Remove the compute node (on page 21).
Page 49: Rj45 Ocp Mezzanine Cards
RJ45 OCP mezzanine cards Installing the RJ45 OCP mezzanine card To install the RJ45OCP mezzanine card: Remove the compute node (on page 21). Remove the riser board (on page 42). Remove the screw securing the bracket blank to the chassis. Align the marks on the mezzanine card with the pins on the system board.
Page 50: Removing The Rj45 Ocp Mezzanine Card
Removing the RJ45 OCP mezzanine card To remove the RJ45 OCP mezzanine card: Remove the compute node (on page 21). Remove the riser board (on page 42). Remove the screws securing the mezzanine card to the system board. Remove the mezzanine card. Hardware options installation 50...
Page 51: Interposer Boards
Interposer boards Removing the interposer board To remove the interposer board: Remove the compute node (on page 21). Disconnect the cabling from the interposer board. Remove the screws securing the interposer board to the chassis. Remove the interposer board. Hardware options installation 51...
Page 52: Installing The Interposer Board
Installing the interposer board To install the interposer board: Align the screw holes on the interposer board with the standoffs on the chassis. Secure the interposer board to the chassis with the screws. Connect the cabling from the system board and HDD assembly to the interposer board. Install the compute node (on page 22).
Page 53: Installing The Supercap
Pull up on the latch to unlock the battery cage from the chassis. Slide the battery cage and remove it from the chassis. Installing the SuperCap To install the SuperCap: Align the holes on the battery cage with the standoffs on the chassis. Install the battery cage making sure the standoffs are correctly seated and the battery cage is level.
Page 54 Install the SuperCap into the battery cage. Connect the SuperCap cable. Install the compute node (on page 22). Hardware options installation 54...
Page 55: System Boards
System boards NOTE: The SFP OCP card compute node model was used for the following procedure. Other models may differ. Removing the system board To remove the system board: Remove the compute node (on page 21). Remove the air baffle (on page 34). Remove the memory modules (on page 40).
Page 56: Installing The System Board
Installing the system board To install the system board: Align the I/O ports on the system board with the slots on the rear of the chassis. Lower and slide the system board into the chassis. Install and secure the screws to the system board. Connect the cabling to the system board.
Page 57: 3.5" Hard Disk Drives
3.5” hard disk drives Removing the 3.5” hard disk drive assembly To remove the 3.5” hard disk drive assembly: Open the storage node (on page 25). Press and slide the release button. The latch pops up. Lift up the HDD tray handle to open. Remove the HDD assembly from the chassis.
Page 58: Installing The 3.5" Hard Disk Drive Assembly
Installing the 3.5” hard disk drive assembly To install the 3.5” hard disk drive assembly: Align the HDD assembly with the connector on the HDD backplane. Install the HDD assembly. Gently press down on both ends of the HDD assembly to ensure it is seated in the HDD backplane. Close the storage node (on page 26).
Page 59: Removing The 3.5" Hard Disk Drive Module
Removing the 3.5” hard disk drive module To remove the 3.5” hard disk drive module: Open the storage node (on page 25). Remove all the 3.5” HDD assemblies (on page 57). Pry the latch on the HDD cage to release the HDD. Remove the HDD from the HDD cage.
Page 60: Installing The 3.5" Hard Disk Drive Module
Installing the 3.5” hard disk drive module To install the 3.5” hard disk drive module: Pry the HDD bracket and align the marks on the HDD with the pins on the HDD cage. Close the latch to secure the module. Install all the 3.5”...
Page 61: Hard Disk Drive Backplanes
Hard disk drive backplanes Removing the hard disk drive backplane NOTE: HDD backplane designs may differ between middle HDD 1 and HDD backplane 2. To remove the HDD backplane: Open the storage node (on page 25). Remove all the 3.5” HDD assemblies (on page 57). Remove the SAS expander card (on page 63).
Page 62: Installing The Hard Disk Drive Backplane
Installing the hard disk drive backplane NOTE: HDD backplane designs may differ between middle HDD 1 and HDD backplane 2. To install the HDD backplane: Align each HDD backplane in the chassis. Make sure the connectors are facing up, as shown in the following figure.
Page 63: Sas Expander Cards
SAS expander cards Removing the SAS expander card To remove the SAS expander card: Open the storage node (on page 25). Remove all the 3.5” HDD assemblies (on page 57). Remove the screws securing the expander bracket. Remove the expander bracket. Loosen the thumb screws.
Page 64: Installing The Sas Expander Card
Remove the expander card. Installing the SAS expander card To install the SAS expander card: Align the expander board with the connector on the chassis. Hardware options installation 64...
Page 65 Secure the card with the thumb screws. Install the expander bracket. Secure the expander bracket to the chassis with the screws. Install all the 3.5” HDD assemblies (on page 58). Close the storage node (on page 26). Hardware options installation 65...
Page 66: Fan Control Boards
Fan control boards Removing the fan control board To remove the fan control board: Loosen the thumb screws to unlock the fan control board assembly. Pull the thumb screws to open the latches. Using the latches, pull the fan control board out to remove it. Remove the screws securing the fan control board to the fan control board bracket.
Page 67: Installing The Fan Control Board
Installing the fan control board To install the fan control board: Align the I/O ports on the fan control board with the fan control board bracket. Install the fan control board. Securing the fan control board to the fan control board bracket with the screws. Align the fan control board assembly with the bay in the chassis and slide it in.
Page 68: Fan Modules
Fan modules Removing the fan module Installing a fan module Hardware options installation 68...
Page 69: Power Supply Units
Power supply units Removing a power supply unit Installing a power supply unit Hardware options installation 69...
Page 70: Middle Plane Covers
Middle plane covers Removing the middle plane cover Installing the middle plane cover Hardware options installation 70...
Page 71: Cable Chains
Cable chains Removing a cable chain To remove a cable chain: Remove the middle plane cover (on page 70). Disconnect the cable routing. Release the cable chain from the end of the storage node. Open the storage node (on page 25). Slide the storage node out of the chassis.
Page 72 Remove the cable chain assembly from the chassis. Remove the screws securing the cable cover to the cable chain assembly. Slide the cable cover out of the cable chain assembly. Hardware options installation 72...
Page 73: Installing A Cable Chain
Remove the screws securing the cable chain and the paddle board to the cable chain bracket. Remove the cable chain and the paddle board. Remove the cables from the cable chain. Installing a cable chain To install a cable chain: Remove the middle plane cover (on page 70).
Page 74 Install the cable clips at both ends of the cable chain. Install the cable chain and the paddle board on the cable chain bracket. Secure the cable chain and the paddle board to the cable chain bracket with screws. Hardware options installation 74...
Page 75 Place the power and signal cables on the top side of the cable chain. Slide the cable cover on the cable chain assembly. Secure the cable cover to the cable chain assembly with a screw. Align the cable chain assembly with the bay on the chassis and slide it in. Hardware options installation 75...
Page 76 Secure the latch to lock the cable chain on the chassis. Slide the storage node into the chassis. Close the storage node (on page 26). Align the screw holes on the end of cable chain with the pins on the rear side of storage node. Attach the cable chain to the storage node.
Page 77: Middle Plane Boards
Middle plane boards Removing the middle plane board To remove the middle plane board: Remove the middle plane cover (on page 70). Remove the cable chain (on page 71). Remove the fan control board assembly (on page 66). Remove the fan modules (on page 68). Remove the power supply unit (on page 69).
Page 78: Installing The Middle Plane Board
Remove the screws securing the middle plane board to the middle plane bracket. Remove the middle plane board. Installing the middle plane board To install the middle plane board: Align the middle plane board with the middle plane bracket. Secure the middle plane board to the middle plane bracket with the screws. Hardware options installation 78...
Page 79 Install the middle plane assembly into the chassis. Secure the middle plane assembly with the screws. Install the power supply unit (on page 69). Install the fan modules (on page 68). Install the fan control board assembly (on page 67). Install the cable chain (on page 73).
Page 80: Rackmount Rails
Rackmount rails NOTE: The CL5200 one-node configuration model was used for the following procedure. Other models may differ. Removing a chassis from a rack WARNING: Due to the weight of the device, two individuals are required to remove a system from the rack cabinet.
Page 81 Loosen the thumb screws to unlock the chassis. Pull out the chassis from the rack. Hardware options installation 81...
Page 82: Installing A Chassis On A Rack
Installing a chassis on a rack To install the chassis: Install the rackmount rails (on page 84). Align the chassis with the rack. Make sure the chassis is positioned correctly and the rear side of the chassis is facing the back of the rack cabinet. Tighten the thumb screws to lock the chassis.
Page 83: Removing The Rackmount Rail
Align the holes on the rear bracket and the holes on the rack. Secure the rear bracket to the rack with the screws. Connect the cabling to the rear side of the system. Open the storage nodes (on page 25). Install all the 3.5”...
Page 84: Installing The Rackmount Rail
Remove the screws securing the rackmount rail to the rack. Remove the rackmount rail. Repeat the procedure for the additional rackmount rail. Installing the rackmount rail To install the rackmount rail: Install the front side of the rail first. Secure the rail to the rack post with the screws. Extend the rear of the rail until the rear rail brackets are flush with the rear rack post.
Page 85: Powering On And Selecting Boot Options
Install the cage nuts on the rack. Repeat the procedure for the additional rackmount rail. Powering on and selecting boot options Connect the RJ45 Ethernet cable (BMC). Log in to the Chassis Manager WCSCLI, execute set bladeon –I <blade index> command. During the initial boot: To modify the BIOS default settings, press F2 and DEL when prompted from the start-up sequence to enter the BIOS setup utility.
Page 86: Cabling
Cabling Internal system cable routing WARNING: When installing the DIMM on DIMM slot A1, first release the miniSAS HD connector to prevent damage to the cable. The server internal cable routing is listed in the following figure and table: SFP OCP card compute node Item Signal Cable Connects...
Page 87 Item Signal Cable Connects 6pin power cable Between the interposer board and the system board 12pin power cable Between the interposer board and the system board SATA power and signal cable Between the interposer board and the 2.5” HDD assembly RJ45 OCP card compute node Item Signal Cable...
Page 88: Storage Cable Connection
Item Signal Cable Connects Between the interposer board and the system board 6pin power cable Between the interposer board and the system board 12pin power cable SATA power and signal cable Between the interposer board and the 2.5” HDD assembly Storage cable connection Storage node The following figure describes the connection between the cable chain, the middle plane board, and the...
Page 89: External Minisas Connection
External miniSAS connection NOTE: Before powering up the system, make sure the compute and storage nodes are connected using external miniSAS cables. CL5200 one-node configuration Item Signal Cable Connects Between the compute node 1 port 0 and the storage node 1 port 0 External SAS cable Between the compute node 1 port 1 and the storage node 2 port 0 External SAS cable...
Page 90: Software And Configuration Utilities
Software and configuration utilities HPE BMC BMC is a remote server management processor embedded on the system boards of the servers. BMC enables the monitoring and controlling of servers from remote locations. HPE BMC management is a powerful tool that provides multiple ways to configure, update, monitor, and repair servers remotely. BMC (Standard) comes preconfigured on HPE servers without an additional cost or license.
Page 91: Web Browsers
Web browsers iBMC FW supports either Microsoft Internet Explorer (Windows platform) or Firefox (Linux platform). The embedded web serve provides full access. The web GUI is accessible via the HTTP protocol or via the encrypted HTTPS protocol. To log in to the web GUI, enter the BMC FW IP address into a web browser. An example of using the HTTP protocol is http://10.141.104.176.
Page 92 Updating BMC under Linux using Yafuflash To update BMC under Linux using Yafuflash: Log into Linux. Open the terminal. Copy the BMC FW package to the /root/Desktop directory using the command: cp file_name.zip /root/Desktop Change the directory using the / root/Desktop, command: cd /root/Desktop Uncompressed the BMC FW package using the command: upzip file_name.zip...
Page 93 Updating BMC via a web GUI To update BMC using the web GUI: Log into the web GUI using a web browser. Select the Maintenance menu and click the Firmware Update button. Then click Enter Update Mode. Software and configuration utilities 93...
Page 94 Select the BMC FW image file. Software and configuration utilities 94...
Page 95 Click Upload. If the file is a valid file, all other sessions are terminated, and the image upload begins. If the upload fails, a message displays with a notification to upload another file. For a successful upload, the current firmware version and the version of the new file are displayed, as well as the Version Compare Flash and Full Flash checkboxes, and Proceed and Cancel buttons.
Page 96: Hpe Cloudline Support Services
Click Proceed to begin the firmware update process and to view the status of the update. When the update is completed, the embedded software automatically reboots. HPE Cloudline Support Services HPE Packaged Support Services Created for service providers, HPE Cloudline Support Services are a selection of hardware support feature designed to help keep your IT staff focused on your business, not on repair and maintenance activities.
Page 97: Proactive Notifications
Service feature highlights  Remote problem diagnosis and support  Optional service feature: Scheduled onsite hareware repair  Optional service feature: Replacement parts and materials For more information, see the Hewlett Packard Enterprise website Proactive notifications 30 to 60 days in advance, Hewlett Packard Enterprise sends notifications to subscribed customers on upcoming: ...
Page 98 POST error message There are three methods of treating the event/errors detected during POST:  Log to SMBIOS  Log to SEL  Shown on-screen during POST SMBIOS event log SMBIOS Event Log Description POST memory resize Smbios 0x07 Log area reset Smbios 0x16 System boot Smbios 0x17...
Page 99 Entering the pop-up boot menu To enter the pop-up boot menu, press F7 during system boot when the Press <F7> to enter Popup Boot Menu message displays. The pop-up boot menu screen displays as shown in the following figure. Entering PXE boot To access PXE boot: Set Network as the first boot device in BIOS setup menu.
Page 100 BIOS maintenance This section provides information about upgrading the BIOS, clearing the BIOS password, clearing CMOS, BIOS recovery, and a BIOS jumper description. Upgrading the BIOS using UEFI shell The flash memory update utility loads a fresh copy of the BIOS into flash ROM. This utility only updates the BIOS region.
Page 101 /OAD Delete Oem Activation key /A Oem Activation file /ME Program ME Entire Firmware Block /MEUF Program ME Ignition Firmware Block /CLNEVNLOG Clear Event Log /CAPSUKE Override Secure Flash policy to Capsule /RECOVERY Override Secure Flash policy to Recovery /REBOOT Reboot after programming /SHUTDOWN Shutdown after programming ...
Page 102 There are two methods to clear the CMOS:  Clear the CMOS jumper.  Remove the CMOS battery when the system is in AC OFF status. Important: After clearing the CMOS, the BIOS setup default is restored, but the password set by the user is still preserved.
Page 103: Ras Features
BIOS jumpers This section provides information about the BIOS. See the following table to locate the BIOS maintenance jumpers. Item Jumper Description Jumper Adjustment Clear password 1-2 (Default): Normal operation 2-3: Password clear Clear CMOS 1-2 (Default): Normal RTC reset 2-3: Clear RTC registers ME firmware 1-2 (Default): Normal operation...
Page 104: Intel Qpi Ras Features
Intel QPI RAS features Options BIOS default SMI QPI Lane Failover Enabled/Disabled Configurable: No 8 Bit CRC/16 Bit rolling CRC CRC Mode Configurable: No QPI Link level retry (Register) Enabled/Disabled QPI Error Reporting (Register) Enabled/Disabled Memory RAS features Options BIOS default ADDR/CMD Parity and Retry (Register) Enabled/Disabled PPR Type...
Page 105: Iio Sub-System Ras Features
Options BIOS default Leaky bucket low bit Configurable: No Leaky bucket high bit Configurable: No Spare Interrupt SMI/CMCI/Error Pin Configurable: No IIO Sub-system RAS features Options BIOS default Pcie Ecrc Auto/Enabled/Disabled Configurable: No Enabled/Disabled PCI-E Completion Timeout Configurable: No Intel VT for Directed I/O (VT-d) Enabled/Disabled Configurable: Yes Hot Plug Capable...
Page 106 Options BIOS default EMCA CMCI-SMI Morphing Enabled/Disabled Configurable: No EMCA MCE-SMI Morphing Enabled/Disabled Configurable: No WHEA Support Enabled/Disabled Configurable: No McBankErrorInjectionSupport Enabled/Disabled Configurable: No Mca Bank Warm Boot Clear Enabled/Disabled Errors Configurable: No FRB-2 Timer Enabled/Disabled Configurable: Yes FRB-2 Timer timeout 3 minutes/4 minutes/5 minutes/6 minutes Configurable: Yes FRB-2 Timer Policy...
Page 107: Updating Fan Control Board Firmware Online
Updating fan control board firmware online Please update BMC first and get the latest Yafuflash. Put Yafuflash tool and the FCB image in the same folder. Execute command: ./Yafuflash_64_R11_6_V01 -cd -d 0x08 xxxxxxx_Online.bin. “Yafuflash_64_R11_6_V01” is the update tool, “xxxxxxx_Online.bin” is the FCB image. Software and configuration utilities 107...
Page 108: Updating Expander Board Firmware
Updating expander board firmware The methods to update expander fw on Linux, incluing RHEL and ubuntu based, are the same. Now take the method to update FW to v0004 for an example to illustrate the steps. Updating expander board firmware using Linux To update expander board firmware using Linux: Log into Linux.
Page 109 Update separate FW: Execute the following command to update boot loader, boot configuration, firmware and initial string images for expander: sudo ./fw_tool.sh -f <Image> <Device ID>. Update merged FW. Excute following command “./ fw_tool.sh –f ../FW_Images/online_merged/Lego-Firmware_Image_Merged_v0.0.0.4_20160517.bin”. Follow step1~step5 to update the firmware of another expander in same chassis. To avoid runtime version compatibility issues, please reset after updating the whole expander images for two storage nodes.
Page 110: Checking The Fw Version
Checking the FW version Checking the BIOS version using Linux Log into Linux. Open the terminal. Execute the dmidecode –t 0 command to display the BIOS version, as shown in the following figure. Software and configuration utilities 110...
Page 111: Checking The Bios Version Using The Bios Setup Utility
Checking the BIOS version using the BIOS setup utility Log into the BIOS setup utility. Use the arrow keys to select the Main menu to display the BIOS version, as shown in the following figure. Checking the BMC version using Linux Log into Linux.
Page 112: Checking The Bmc Version Using The Web Gui
Checking the BMC version using the web GUI Log into the web GUI. Click Maintenance, then Firmware Information to enter Firmware Information page, as shown in the following figure. Checking fan control board firmware version with Linux If the firmware version is v0002A, execute the following command: ipmitool raw 0x30 0x01. Checking expander version using Linux/ Ubuntu The methods to check expander FW on Linux, incluing RHEL and ubuntu based, are the same .
Page 113 Execute the following command to get runtime firmware versions of the expander: sg_ses -p 1 /dev/sg42. Software and configuration utilities 113...
Page 114: Checking The Event Log
Checking the event log Checking the system event log using Linux remote desktop To check the system event log using Linux Log into Linux. Open the terminal. Execute the ipmitool -I lanplus –H BMCIP –U admin –P password sel list command to check the system event log.
Page 115: Checking The Event Log Using The Bios Setup Utility
Checking the event log using the BIOS setup utility System Event Logs To check the event log using the BIOS setup utility: Enter the BIOS setup utility, and then select the Server Mgmt menu. Software and configuration utilities 115...
Page 116 Use the arrow keys to select View System Event Log, and then press Enter. The “System Event Log” displays. Software and configuration utilities 116...
Page 117 SMBIOS Enter the BIOS setup, and then select the GPNV Logs menu. Use the arrow keys to select View SMBIOS Event Log, and then press Enter. The “SMBIOS Event Log” displays. Software and configuration utilities 117...
Page 118: Illustrated Parts Catalog
Illustrated parts catalog System components Hewlett Packard Enterprise continually improves and changes product parts. For complete and current supported parts information, see the Hewlett Packard Enterprise PartSurfer website: http://www.hpe.com/info/partssurfer CL5200 one-node configuration Item Description Spare part number Customer self repair Middle plane module P04036-001 Mandatory...
Page 119 CL5200 two-node configuration Item Description Spare part number Customer self repair Middle plane module P04036-001 Mandatory Power supply units 854755-001 Mandatory Fan control board module P09616-001 Mandatory Fan modules 854756-001 Mandatory 4U chassis Compute node (2) Cable chain assembly (2) Storage node (2) Illustrated parts catalog 119...
Page 120: Compute Node
Compute node SFP OCP card compute node Item Description Spare part number Customer self repair SuperCap Air baffle Interposer board 854770-001 Mandatory HBA assembly 876122-001 Mandatory 2.5” HDD assembly 40G OCP mezzanine card/10G OCP mezzanine card System board 868081-001 Mandatory Compute node chassis Illustrated parts catalog 120...
Page 121 RJ45 OCP card compute node Item Description Spare part number Customer self repair SuperCap Air baffle Interposer board 854770-001 Mandatory HBA assembly 876122-001 Mandatory 2.5” HDD assembly RJ45 OCP mezzanine card System board 868081-001 Mandatory Compute node chassis Illustrated parts catalog 121...
Page 122: Storage Node
Storage node Item Description Spare part number Customer self repair SAS expander board 3.5” HDD assembly 4U storage chassis HDD backplane 2 HDD backplane 1 Illustrated parts catalog 122...
Page 123: Other Components
Other components Item Description Spare Part Customer self repair Number (on page 159) Mandatory SPS-Heatsink for Processor 1 850080-001 Mandatory SPS-Heatsink for Processor 2 850081-001 Mandatory SPS-CableKit: MiniSAS/External (250/560mm) 876563-001 Mandatory SPS-Cable Kit:MB, PWR, SATA, SIGNAL, SAS 854775-001 Mandatory SPS-Cable Kit:MB, PWR, SATA, SIGNAL, SAS 854775-001 Mandatory SPS-Cable Kit:MB, PWR, SATA, SIGNAL, SAS...
Page 124: Troubleshooting
Troubleshooting Troubleshooting preparation Pre-diagnostic WARNING: To avoid potential problems, ALWAYS read the warnings and cautionary information in the server documentation before removing, replacing, reseating or modifying system components. IMPORTANT: Refer to the server documentation for information on procedures, hardware options, software tools and operating systems supported by the server. Follow the following pre-diagnostic steps before system troubleshooting process: Review the important safety information.
Page 125: Prepare The Server For Diagnosis
Record exactly when the problem happens (include the date and time).If it happens more than once, keep a list of all symptoms for each occurrence.  What events preceded the failure? After which steps does the problem occur?  What has been changed since the time the server was working? ...
Page 126: Disassembling The Server Down To The Minimum Hardware Configuration
Disassembling the server down to the minimum hardware configuration During the troubleshooting process, it might be necessary to setup the server to the minimum hardware configuration. A minimum configuration consists of only the components needed to boot the server and successfully complete POST.
Page 127: Battery Replacement
Battery replacement If the server no longer automatically displays the correct date and time, you might need to replace the battery that provides power to the real-time clock. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pent oxide, or an alkaline battery pack.
Page 128: Warranty And Regulatory Information
Warranty and regulatory information Safety and regulatory compliance For safety, environmental, and regulatory information, see Safety and Compliance Information for Server, Storage, Power, Networking, and Rack Products, available at the HPE website (http://www.hpe.com/support/Safety-Compliance-EnterpriseProducts). USA FCC Supplier Declaration of Conformity notice For questions regarding this product, go to the Hewlett Packard Enterprise Support Center website: http://www.hpe.com/support/hpesc For questions regarding this FCC declaration, contact Hewlett Packard Enterprise by telephone or...
Page 129: Japanese Voluntary Control Council For Interference (Vcci) Statement
Japanese Voluntary Control Council for Interference (VCCI) statement Global notice for Class A equipment Operation of this equipment in a residential environment could cause radio interference. CCC Class A notice The following statement is applicable to products shipped to China and marked with “Class A” on the product’s compliance label.
Page 130: Notice For Korea
Notice for Korea A 급 기기（업무용 방송통신기자재）：RRA statement for Class A 이 기기는 업무용 한장에서 사용할 묵작으로 작합상병가굘 받은 기기로서 가장용 할장에서 사용하는 장우 전바간섭의 우려가 있습니다. Notices for Eurasian Economic Union Manufacturer and Local Representative Information Manufacturer information: Hewlett Packard Enterprise 6280 America Center Drive, San Jose, CA 95002 Local representative information Russian: ...
Page 131: Safety
Safety Before installing this product, read the Safety Information. Antes de instalar este produto, leia as Informações de Segurança. 在安装本产品前，请仔细阅读安全信息（安全信息）。安裝本產品之前，請先閱讀「安全資訊」。 Læs sikkerhedsforskrifterne, før du installerer dette produkt. Lees voordat u dit product installeert eerst de veiligheidsvoorschriften. Ennen kuin asennat tämän tuotteen, lue turvaohjeet kohdasta Safety Information. Avant d'installer ce produit, lisez les consignes de sécurité.
Page 132: Important Safety And Compliance Information
Important safety and compliance information Be sure to read all caution and warning statements in this documentation before performing any procedure in this user and maintenance guide. To avoid potential problems, ALWAYS read the warnings, cautionary and safety information that comes with server documentation before removing, replacing, reseating or modifying system components.
Page 133: Sicherheitsvorkehrungen
Sicherheitsvorkehrungen Überwachen Sie folgende Sicherheitsvorkehrungen wenn Sie die Anlage aufbauen.  Folgen Sie allen Warnungen und Anweisungen die auf der Anlage stehen.  Stellen Sie sicher dass die Spannung und Frequenz der Stromquelle der Spannung und Frequenz auf dem Etikett mit den elektrischen Nennwerten auf der Anlage entspricht. ...
Page 134: Safety Instructions
設備已掉落或損壞。設備有明顯的損壞跡象。切勿將本設備放在溫度超過 70°C（158°F）的環境下；否則可能會損壞設備。 Safety Instructions Please read these safety instructions carefully. Please keep this Manual for later reference. Please disconnect this equipment from AC outlet before cleaning. Don’t use liquid or sprayed detergent for cleaning. Use moist sheet or cloth for cleaning. For pluggable equipment, the socket-outlet must be installed near the equipment and must be easily accessible.
Page 135: Инструкция По Технике Безопасности
Öffnungen in der Anlage sind für die Luftzirkulation und schützen die Anlage vor Überhitzung. Verdecken Sie die Öffnungen nicht. Stellen Sie sicher dass die Stromspannung der Stromquelle der Nennspannung entspricht. Legen Sie das Stromkabel auf eine Weise dass niemand darauf treten oder darüber stolpern kann. Legen Sie keine Gegenstände auf das Stromkabel.
Page 136 УСТРОЙСТВО РАБОТАЮЩИМ. ТАКАЯ ТЕМПЕРАТУРА МОЖЕТ ПОВРЕДИТЬ УСТРОЙСТВО. 符號設備上標注的下列符號，表示可能存在的危險狀況。本符號表示存在危險的能量電路或電擊危險。由合格人員進行所有維修。警告：不要打開本外殼，以減少電擊損傷危險。由合格人員進行所有維護、升級和維修。危險注意：有人身損傷和設備損壞的風險。遵循指示。注意：下面的標籤顯示附近有銳利的邊緣、角落或接頭。注意：下面的標籤顯示附近有熱表面。熱表面。避免接觸。表面熱，如果接觸，可能會導致人身損傷。警告：為減少熱元件造成的損傷風險，在接觸之前，讓表面冷卻。注意：本符號顯示存在電擊危險。該區域不包含使用者或現場有用的零件。不得因任何理由打開。警告：不要打開本外殼，以減少電擊損傷危險。注意：此圖示顯示附近有運轉設備，可能造成人身傷害。注意：替換鋰電池時，只能使用 HP Part Number XXXXX 或製造商所建議之相等類型電池。如果您的系統具備裝鋰電池的模組，僅以一樣的製造商所製造的相同模組類別替換。未正確使用、處理或丟棄鋰電池可能會爆炸。請勿：  丟或浸泡在水中  加溫超過 100°C (212°F)  修理或拆卸  根據當地法令或法規丟棄電池。 Warranty and regulatory information 136...
Page 137: Symbols
注意：安裝雷射產品（如 CD-ROM、DVD、光纖裝置或傳輸器）時，請注意下列事項：  請勿移除蓋子。移除雷射產品的蓋子將導致產品曝照于有害雷射輻射。裝置內部無有用的零件。  任何非本文提到的控制使用、修改或程式表現將導致有害輻射曝照。有些雷射產品內含 3A 或 3B 等級雷射二極體。請注意下列事項。打開時會有雷射輻射。勿凝視光束、直接用光學儀器看，並避免直接曝照於光束中。危險一級雷射產品 Laser Klasse 1 Luokan 1 Laserlaite 危險 Appareil A` Laser de Classe 1 注意：請勿在機架式裝置上面放任何物品。注意事項：此伺服器適合使用 IT 配電系統，在任何配電故障條件下，最大相間電壓是 240V。 Symbols The following symbols may be placed on the equipment to indicate the presence of potential hazardous condition.
Page 138: Symbole
CAUTION: When replacing the lithium battery, use only the HP spare battery designated for this product. If your system has a module containing a lithium battery, replace it only with the same module type made by the same manufacturer. The battery contains lithium and can explode if not properly used, handled, or disposed of.
Page 139 Verletzungen durch Elektroschock zu verringern. VORSICHT: Dieses Symbol weist auf nahe gelegene bewegende Teile hin. VORSICHT: Wenn Sie die Lithium Batterie austauschen nutzen Sie ausschließlich HP Teilenummer XXXXX oder einen gleichwertigen durch den Hersteller empfohlenen Batterietyp. Wenn Ihr System über ein Lithium Batterie enthaltendes Modul verfügt, ersetzen Sie es ausschließlich durch ein Modul desselben Herstellers.
Page 140: Предупреждающие Символы
поражения электрическим током. ВНИМАНИЕ: Этот символ указывает на наличие поблизости опасных двигающихся частей. ВНИМАНИЕ: Во время замены литиевого аккумулятора используйте только HP номер компонента ХХХХХХ или другой похожий тип аккумулятора, рекомендованный производителем. Если у Вашей системы есть часть, в которой используется литиевый...
Page 141: 安全聲明
ВНИМАНИЕ: Пожалуйста обратите внимание на следующие пункты при использовании лазерной продукции (например CD-ROM, DVD приводы, волоконно-оптические устройства или передатчики):  Не снимайте крышку с устройства. При снятии крышки с лазерной продукции человек может подвергнуться опасному лазерному излучению. Внутри лазерного устройства нет...
Page 142: Safety Statements
電源、電話和通信電線的電流是有害的。為了避免電擊危險：  雷暴期間，不得連接或斷開連接的任何電線或不得執行本產品的安裝、維護或重新危險配置。  所有電源線連接到適當連接且接地的插座。  將連接本產品的任何設備連接到適當的有線插座。  在可能的情況下，只用一隻手連接或斷開信號電線。  如有火、水或結構性破壞證據，不得打開任何設備。  在你打開設備蓋之前，斷開連接的電源線、電信系統、網路和數據機，除非安裝和配置程式另有指示。  安裝、移動或打開本產品或連接設備的蓋子時，按下表所述連接和斷開電線。斷開：連接：關閉所有電器。關閉所有電器。首先，從插座拔下電源線。首先，連接設備的所有電線。拆除連接器的信號電線。連接連接器的信號電線。拆除設備的所有電線。將電源線連接到插座。打開設備。注意：設備上的電源控制按鈕和供電裝置上的電源開關不會關閉給設備提供的電流。設備也可能有多條電源線。拆除該設備的所有電流裝置,確保斷開連接電源的所有電源線。注意：不得移除供電裝置或有以下標籤的任何零件的蓋子。有此標籤的任何元件的內部存在危險電壓、電流和能量水準。這些元件內部沒有有用的零件。如果您懷疑其中一個零件有問題，請聯繫服務人員。在一定條件下，分支電路超載可能造成火災和電擊危險。為了避免這些危害，確保您的系統電力要求不超過分支電路保護要求。參考您的設備電氣規範提供的資訊。危險 Safety statements READ THIS IMPORTANT SAFETY INFORMATION SECTION. RETURN TO THIS MANUAL FOR REFERENCE.
Page 143 CAUTION: Do not connect the server to any other type of power system to reduce the risk of electric shock. WARNING: This server is suitable for use on an IT power distribution system whose maximum phase-to-phase voltage is 240 V under any distribution fault condition. Electrical current from power, telephone, and communication cables is hazardous.
Page 144: Sicherheitshinweise
Sicherheitshinweise LESEN SIE DEN WICHTIGEN ABSCHNITT SICHERHEITSHINWEISE. KEHREN SIE ZUR BEZUGNAHME AUF DIESEN BEREICH ZURÜCK. LESEN SIE DEN ABSCHNITT VOR INSTANDHALTUNG. VORSICHT: Laserlaufwerktechnik Das optische Empfängermodul dieses Servers ist ein Klasse 1 Laserprodukt. Umgebungsbetrieb Diese Anlage kann nicht über einer Umgebungstemperatur von 40 Grad Celsius betrieben werden.
Page 145: Информация О Безопасности
VORSICHT: Die Betriebstaste auf dem Gerät und dem Netzteil schaltet nicht die Stromversorgung zum Gerät ab. Das Gerät kann über mehr als ein Stromkabel verfügen. Um die gesamte Stromversorgung vom Gerät zu trennen stellen Sie sicher, dass alle Stromkabel von der Stromquelle getrennt sind. VORSICHT: Hazardous voltage, current, and energy levels are present inside any component that has this label attached.
Page 146 Электрический ток от источника питания, телефона и других линий связи представляют опасность для системы. Чтобы избежать поражения электротоком: опасность  Не проводите установку, обслуживание, изменение конфигурации системы, а также отключение и подключение каких-либо проводов во время грозы.  Подключите все провода питания к розетке с правильной подводкой и заземлением.
Page 147: 警告和注意事項
警告和注意事項警告：只有經過授權且訓練有素的技術人員應該試圖維修該設備。詳細介紹所有故障排除和維修程式，以便只進行子元件/模組層級維修。因為各控制板和模組的複雜性，任何人不得試圖進行元件級維修或修改任何印刷線路板。不當維修可能產生安全隱患。警告：為了減少人身傷害或損壞設備的風險，以確保：  水準調節腳擴展到地板。  機架的全部重量擱在水準調節腳上。  如果安裝單機架，穩定腳連接到機架。  多機架安裝在一起。  一次只擴展一個元件。如果因任何理由擴展多個元件，機架可能會變得不穩定。警告：為了減少電擊或損壞設備的危險：  不要禁用電源線接地插頭。接地插頭是一個重要的安全特性。  電源線插入易於插入的接地插座。  拔掉供電裝置的電源線，切斷設備的電源。  電源線不得置於過道或被緊臨物品擠壓的線路上。須特別注意插頭、插座和從伺服器擴展的電線點。警告：為了減少人身傷害或損壞設備的風險：  遵守當地的職業健康和安全要求和處理指南。  獲得足夠的幫助，以便在安裝或拆除時提起和穩定機殼。  伺服器不穩定，未固定在欄杆。  在機架安裝伺服器時，拆除電源和其他可移動的模組，以降低產品的整體重量。注意：為使系統適當通風，伺服器的前後間隙至少為 7.6 釐米（3.0 英寸）。注意：伺服器設計成電接地（接地）。交流電源線只有插入正確接地的交流電插座，以確保電源操作。 Warnings and cautions WARNING: Only authorized trained technicians should attempt to repair this equipment.
Page 148: Warnungen Und Vorsichtsmaßnahmen
WARNING: To reduce the risk of electric shock or damage to the equipment:  Do not disable the power cord grounding plug. The grounding plug is an important safety feature.  Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all times.
Page 149: Предупреждения И Меры Предосторожности
WARNUNG: Um das Risiko von Verletzungen an Personen oder Schäden an Anlage zu verringern, stellen Sie Folgendes sicher:  Beachten Sie die örtlichen Anforderungen und Richtlinien zur Sicherheit am Arbeitsplatz beim Umgang mit Geräten.  Lassen Sie sich beim Anheben und Stabilisieren des Gehäuses während des Ein- bzw. Ausbaus in geeigneter Weise unterstützen.
Page 150: 靜電放電
ПРЕДУПРЕЖДЕНИЕ: Чтобы минимизировать риск получения травм или повреждения оборудования:  Соблюдайте местные требования охраны труда и техники безопасности, а также руководства для ручных операций.  Получите необходимую помощь для подъема и стабилизации корпуса во время установки или перемещения.  Сервер остается неустойчивым, если он не прикреплен к направляющим. ...
Page 151: Electrostatic Discharge
Electrostatic discharge Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conducer may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.
Page 152: Электростатический Разряд
Um elektrostatische Schäden zu vermeiden:  Vermeiden sie Handkontakt bei Transport und Lagerung durch die Verwendung von statisch sicheren Behältern.  Lassen Sie elektrostatisch empfindliche Teile in den Behältern bis Sie die Statik freien Arbeitsplätze erreicht haben.  Stellen Sie die Teile auf eine geerdete Oberfläche bevor Sie diese von den Behältern entfernen. ...
Page 153 Для предотвращения повреждения от статического электричества:  Не допускайте контакта руками при транспортировке и хранении продукта в антистатической упаковке.  Держите части чувствительные к электростатическому электричеству в их упаковке, пока они не прибудут в свободную от статического электричества среду.  Положите...
Page 154: Electrostatic Discharge
Electrostatic discharge Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you must follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.
Page 155: Rohs
RoHS 型號（型式）：HPE Cloudline CL5200 Gen9 設備名稱：伺服器/Server Type designation (Type) Equipment name 限用物質及其化學符號 Restricted substances and its chemical symbols 單元多溴二苯醚六價鉻多溴聯苯 Unit 鉛 Lead 汞 Mercury 鎘 Cadmium Polybrominated Hexavalent Polybrominated diphenyl ethers (Pb) (Hg) (Cd) chromium biphenyls (PBDE) (PBB) 傳輸線和線材...
Page 156: Specifications
Specifications Environmental specifications Specification Value — Temperature range* 10°C to 35°C (50°F to 95°F) Operating -30°C to 60°C (-22°F to 140°F) Non-operating — Relative humidity (noncondensing)  Operating Minimum to be the higher (more moisture) of -12°C (10.4°F) dew point or 8% relative humidity ...
Page 157: Support And Other Resources
Support and other resources Accessing Hewlett Packard Enterprise Support  For live assistance, go to the Contact Hewlett Packard Enterprise Worldwide website: http://www.hpe.com/assistance  To access documentation and support services, go to the Hewlett Packard Enterprise Support Center website: http://www.hpe.com/support/hpesc ...
Page 158: Accessing Updates
Hewlett Packard Enterprise Support Center More Information on Access to Support Materials page: www.hpe.com/support/AccessToSupportMaterials IMPORTANT: Access to some updates might require product entitlement when accessed through the Hewlett Packard Enterprise Support Center. You must have an HP Passport set up with relevant entitlements. Websites ...
Page 159: Customer Self Repair
Customer self repair Hewlett Packard Enterprise products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period Hewlett Packard Enterprise (or Hewlett Packard Enterprise service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, Hewlett Packard Enterprise will ship that part directly to you for replacement.
Page 160: Documentation Feedback
Documentation feedback Hewlett Packard Enterprise is committed to providing documentation that meets your needs. To help us improve the documentation, send any errors, suggestions, or comments to Documentation Feedback (mailto:docsfeedback@hpe.com). When submitting your feedback, include the document title, part number, edition, and publication date located on the front cover of the document. For online help content, include the product name, product version, help edition, and publication date located on the legal notices page.

HP Cloudline CL5200 Gen9 User And Maintenance Manual

Quick Links

Troubleshooting

Related Manuals for HP Cloudline CL5200 Gen9

Summary of Contents for HP Cloudline CL5200 Gen9

Table of Contents