Supermicro X9DRW-CF31 User Manual page 17

System
Management
Dimensions
Note 1: CPU Maximum Thermal Design Power (TDP) is subject to chassis
and heatsink cooling restrictions. For proper thermal management, please
check the chassis and heatsink specifications for proper CPU TDP sizing.
Note 2: For IPMI Configuration Instructions, please refer to the Embedded
IPMI Configuration User's Guide available @http://www.supermicro.com/
support/manuals/.
Note 3: For SAS support, be sure to use the SMC-Proprietary Mezzanine
Card with the LSI 3108 SAS controller installed. Install the Mezzanine Card
on the AOM PCIE 3.0 x16 slot (J10) for SAS 3.0 support. Refer to Section
1-10 and Section 2-6 for more information.
Note 4: For the latest CPU/memory updates, please refer to our website at
http://www.supermicro.com/products/motherboard.
Note 5: Supercap (PN: BTR-TFM8G-LSICVM02) is optional and needs to
be purchased from Supermicro separately.
•
CPU Thermal Design Power (TDP): support up to
135W (See Note 1 below)
Fan Control
•
Fan status monitoring with firmware thermal man-
agement via IPMI 2.0
•
Low noise fan speed control
LED Indicators
•
System/CPU Overheat LED
•
Suspend-state LED
System Management
•
UID/Remote UID LED
•
PECI (Platform Environment Configuration Interface)
2.0 support
•
System resource alert via SuperDoctor® 5
•
Dual Cooling Zones
•
Thermal Monitor 2 (TM2) support
•
PECI (Platform-Environment Configuration Interface)
support
•
SuperDoctor® 5, Watch Dog, NMI
•
Chassis Intrusion Header and Detection
•
12.30" (L) x 13.10" (W) (312.42 mm x 332.74 mm)
1-9
Chapter 1: Overview