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Table 5. Model feature codes and options (continued)
Feature code
Note:
1. CP - Central Processor
2. IFL - Integrated Facility for Linux
3. ICF - Integrated Coupling Facility
4. SAP - System Assist Processor
5. zAAP - IBM System z Application Assist Processor
6. zIIP - IBM System z Integrated Information Processor
|
7. IFP - Integrated Firmware Processor
Additionally, as shown in Figure 5 on page 26 and Figure 6 on page 27:
v Internal batteries (for emergency backup power) are placed in the topmost positions in both frames. (In
the front ONLY on the A frame.)
v The system processor is located in the cage below the battery position in the A frame.
v For radiator-cooled models, the processor cooling components are located below the processor in the
front of the A frame, and from the top of the frame to the top of the I/O cage in the rear of the A
frame.
For water-cooled models, the processor cooling components are located at the bottom of the A frame
below the I/O cage, and from the top of the frame to the top of the I/O cage in the rear of the A
frame.
v The system power supply is contained in the top of the Z frame, below the battery positions.
v Input/Output features are installed in Input/Output (I/O) cage, I/O drawers, and PCIe I/O drawers.
For radiator-cooled models:
– An I/O cage or an I/O drawer and PCIe I/O drawers are installed in the empty space at the bottom
of the A frame, and
– I/O drawers and PCIe I/O drawers are installed in the area below the bulk power supply in the Z
frame.
For water-cooled models:
– An I/O cage or an I/O drawer and PCIe I/O drawers are installed in the empty space above the
water-cooling equipment in the A frame, and
– I/O drawers and PCIe I/O drawers are installed in the area below the bulk power supply in the Z
frame.
Description - number of processor books
I/O connectors
Chapter 3. Models and physical specifications
Level 01f
25
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