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Design and Environmental Specifications
8.
Design and Environmental Specifications
8.1
Intel
Workstation Board S5000XVN Design Specifications
®
The operation of the workstation board at conditions beyond those shown in the following table
may cause permanent damage to the system. Exposure to absolute maximum rating conditions
for extended periods may affect system reliability.
Operating Temperature
Non-Operating Temperature
DC Voltage
Shock (Unpackaged)
Shock (Packaged)
<20 pounds
20 to <40 pounds
40 to <80 pounds
80 to <100 pounds
100 to <120 pounds
120 pounds
Vibration (Unpackaged)
Note:
1
Chassis design must provide proper airflow to avoid exceeding the Dual-Core Intel
sequence maximum case temperature.
Disclaimer Note: Intel Corporation workstation boards contain a number of high-density VLSI
and power delivery components that need adequate airflow to cool. Intel ensures through its
own chassis development and testing that when Intel server building blocks are used together,
the fully integrated system will meet the intended thermal requirements of these components. It
is the responsibility of the system integrator who chooses not to use Intel developed workstation
building blocks to consult vendor datasheets and operating parameters to determine the amount
of air flow required for their specific application and environmental conditions. Intel Corporation
cannot be held responsible, if components fail or the workstation board does not operate
correctly when used outside any of their published operating or non-operating limits.
56
Table 36. Workstation Board Design Specifications
Intel order number: D66403-006
Intel® Workstation Board S5000XVN TPS
1
0º C to 55º C
(32º F to 131º F)
-40º C to 70º C (-40º F to 158º F)
± 5% of all nominal voltages
Trapezoidal, 50 G, 170 inches/sec
36 inches
30 inches
24 inches
18 inches
12 inches
9 inches
5 Hz to 500 Hz 3.13 g RMS random
®
®
Xeon
processor 5000
Revision 1.5
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