Nvidia Jetson Orin NX Design Manual page 34

Parameter
Serpentine
Min bend angle
Dimension
Min A Spacing
Min B, C Length
Min Jog Width
Additional Component Placement Order
AC Cap
Value on TX – Min/Max
Value on RX (connector case) – Min/Max
Location (max length to adjacent
discontinuity)
Voiding
ESD (On-chip protection diode can withstand 2kV HMM. External ESD is optional. Designs should include ESD footprint as a
stuffing option)
Max Junction capacitance (IO to GND)
Gen1
Gen2
Footprint
Location (max length to adjacent
discontinuity)
Common-mode Choke
(Not recommended – only used if absolutely required for EMI issues). See Chapter 17 for details on CMC if implemented.
FPC (Additional length of Flexible Printed Circuit Board)
The FPC routing should be included for PCB trace calculations (max length, etc.)
Characteristic Impedance
Loss characteristic
Connector
SMT Connector GND Voiding
Connector used must be USB-IF certified
General: See Chapter 17 for guidelines related to serpentine routing, routing over voids and noise coupling
PRELIMINARY INFORMATION
NVIDIA Jetson Orin NX
Requirement Units
135 deg (a)
4x Trace width
1.5x
3x
Chip ̶ AC capacitor (TX only) ̶ common mode choke ̶ ESD ̶ Connector
See Figure 7-6.
100/265 nF
297/363 nF
8 mm
GND/PWR void under/above cap is
preferred
pF
0.8
0.35
Pad should be on the net – not trace
stub
8 mm
Same as PCB
Strongly recommend being the same
as the PCB or better
GND plane under signal pad should be voided. Size of void should be the same
size as the pad.
USB and PCIe
Notes
S1 must be taken care
in order to consider
Xtalk to adjacent pair.
See Figure 7-7.
100nF recommended. Only required for
TX pair when routed to connector.
Optional. 330 nF recommended if
placed.
Discontinuity is connector, via, or
component pad
Voiding is required if AC cap size is 0603
or larger
Gen1: SEMTECH RClamp0524p
Gen2: TPD4E02B04DQA
Figure 7-8.
See
Discontinuity is connector, via, or
component pad
If worse than PCB, the PCB and FPC
length must be re-estimated
DG-10931-001_v0.1 | 26