Intel Core2 Duo E6000 Series Manuals

Manuals and User Guides for Intel Core2 Duo E6000 Series. We have 2 Intel Core2 Duo E6000 Series manuals available for free PDF download: Design Manual

Intel Core2 Duo E6000 Series Design Manual (148 pages)

Design Guidelines

Brand: Intel | Category: Computer Hardware | Size: 5.75 MB

Table of Contents
3
Revision History
9
Introduction
11
Document Goals and Scope
11
- Importance of Thermal Management
  11
- Document Goals
  11
- Document Scope
  12
References
13
Definition of Terms
13
Processor Thermal/Mechanical Information
15
Mechanical Requirements
15
- Processor Package
  15
- Figure 2-1. Package IHS Load Areas
  15
- Heatsink Attach
  17
Thermal Requirements
18
Heatsink Design Considerations
21
- Heatsink Size
  22
- Heatsink Mass
  22
- Package IHS Flatness
  23
- Thermal Interface Material
  23
System Thermal Solution Considerations
24
System Integration Considerations
25
Thermal Metrology
27
Characterizing Cooling Performance Requirements
27
- Example
  28
- Figure 3-1. Processor Thermal Characterization Parameter Relationships
  28
Processor Thermal Solution Performance Assessment
29
Local Ambient Temperature Measurement Guidelines
29
Figure 3-2. Locations for Measuring Local Ambient Temperature, Active ATX Heatsink
31
Figure 3-3. Locations for Measuring Local Ambient Temperature, Passive Heatsink
31
Processor Case Temperature Measurement Guidelines
32
Thermal Management Logic and Thermal Monitor Feature
33
Processor Power Dissipation
33
Thermal Monitor Implementation
33
Appendix Alga775 Socket Heatsink Loading
75
Appendix B Heatsink Clip Load Metrology
81
Appendix C Thermal Interface Management
87
- Bond Line Management
  87
- Interface Material Area
  87
- Interface Material Performance
  87
Appendix D Case Temperature Reference Metrology
89
Appendix E Legacy Fan Speed Control
109
Appendix F Balanced Technology Extended (BTX) System Thermal Considerations
121
Figure 7-45. System Airflow Illustration with System Monitor Point Area Identified
122
Figure 7-46. Thermal Sensor Location Illustration
123
Table 7-6. Fan Electrical Performance Requirements
125
Appendix G Fan Performance for Reference Design
125
Figure 7-47. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height
128
Figure 7-48. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height
128
Figure 7-49. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height
128
Figure 7-61. Intel D60188-001 Reference Solution Assembly
128
Figure 7-62. Intel D60188-001 Reference Solution Heatsink
128
Figure 7-63. Intel E18764-001 Reference Solution Assembly
128
Appendix Hmechanical Drawings
128
Appendix I Intel Enabled Reference Solution Information
146

Intel Core2 Duo E6000 Series Design Manual (126 pages)

Mechanical Design Guidelines

Brand: Intel | Category: Computer Hardware | Size: 3.42 MB

Table of Contents
3
1 Introduction

9
- Document Goals and Scope
  9
  - Importance of Thermal Management
    9
  - Document Goals
    9
  - Document Scope
    10
- References
  11
- Definition of Terms
  11
2 Processor Thermal/Mechanical Information

13
- Mechanical Requirements
  13
  - Processor Package
    13
  - Figure 2-1. Package IHS Load Areas
    13
  - Heatsink Attach
    15
    
    General Guidelines
    15
    
    Heatsink Clip Load Requirement
    15
    
    Additional Guidelines
    16
- Thermal Requirements
  16
- Heatsink Design Considerations
  19
  - Heatsink Size
    20
  - Heatsink Mass
    20
  - Package IHS Flatness
    21
  - Thermal Interface Material
    21
- System Thermal Solution Considerations
  22
- System Integration Considerations
  23
3 Thermal Metrology

25
4 Thermal Management Logic and Thermal Monitor Feature

31
- Processor Power Dissipation
  31
- Thermal Monitor Implementation
  31
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information

39
6 ATX Thermal/Mechanical Design Information

51
7 Intel® Quiet System Technology (Intel® QST)

63
Appendix Alga775 Socket Heatsink Loading

69
Appendix B Heatsink Clip Load Metrology

75
Appendix C Thermal Interface Management

81
- Bond Line Management
  81
- Interface Material Area
  81
- Interface Material Performance
  81
Appendix D Case Temperature Reference Metrology

83
Appendix E Balanced Technology Extended (BTX) System Thermal Considerations

103
- Figure 7-38. System Airflow Illustration with System Monitor Point Area Identified
  104
- Figure 7-39. Thermal Sensor Location Illustration
  105
Appendix F Fan Performance for Reference Design

107
- Table 7-3. Fan Electrical Performance Requirements
  107
Appendix G Mechanical Drawings

109

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Intel Core2 Duo E6000 Series Manuals

Intel Core2 Duo E6000 Series Design Manual (148 pages)

Table of Contents

Intel Core2 Duo E6000 Series Design Manual (126 pages)

Table of Contents

1 Introduction

2 Processor Thermal/Mechanical Information

3 Thermal Metrology

4 Thermal Management Logic and Thermal Monitor Feature

5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information

6 ATX Thermal/Mechanical Design Information

7 Intel® Quiet System Technology (Intel® QST)

Appendix Alga775 Socket Heatsink Loading

Appendix B Heatsink Clip Load Metrology

Appendix C Thermal Interface Management

Appendix D Case Temperature Reference Metrology

Appendix E Balanced Technology Extended (BTX) System Thermal Considerations

Appendix F Fan Performance for Reference Design

Appendix G Mechanical Drawings

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