A
AC Input, 35
Ambient Temperature of PC, 38
applications, precautions, ix
ASCII, 32
B
Backplane
Expansion I/O, 14
I/O Expansion, 16
mounting Units to, 22 , 28
Bleeder Resistor, 50
Block, Terminal, 34
C
Cable
power, 40
twisted pair, 41
Clearance, Between PC Racks, 38
Conditions, Installation, 38
Conduit, 41
Connections
I/O Units, 33
PC, 30
control components, 2
Cooling, PC, 38
CPU, 10 , 11 , 22
and Memory Packs, 19 , 25
and RAM Packs, 19
and ROM Packs, 20
Backplane, 10
connector, 11
core of PC, 22
Power Supply, 10 , 12
Rack, 10
CPU Rack, 23
connecting to another Backplane, 24
Current
input leakage, 50
output leakage, 51
output surge, 51
Current Consumption, 30
Cycle Time, 5
D
DC Input Units, 34
Duct, Wiring, 40
E
Electrical Noise, 52
Index
Electrostatic Charge, 38
Emergency Stop, 50
Environment, Installation, 38
EPROM Chip, mounting to ROM PAck, 25
Examples, wiring, 34
Expansion I/O Backplane, 14
Expansion I/O Power Supply, 27
Expansion I/O Rack, 10 , 14 , 24
Expansion I/O Racks, mounting Units to, 28
F
Factory Computer, 2
Fan, cooling, 38
G
Grounding, 44
Grounding During PC Installation, 40
H
High Power Equipment, and PC installation, 41
Humidity, 38
I
I/O Connections, 33
I/O Control Unit, 16 , 24
I/O Interface Unit, 16 , 24
I/O Points, 23 , 24
I/O Power Supply, 14
I/O Unit, 10 , 23
Link, power consumption, 32
mounting, 27
mounting to Backplane, 23
power consumption, 30
Remote, power consumption, 32
shapes, 16
Ashape, 16
Bshape, 17
Cshape, 17
Dshape, 18
Eshape, 18
Special, power consumption, 32
I/O Unit 3G2A5−PS213−E, 13
I/O Unit 3G2A5−PS223−E, 13
Inductive Load Surge Suppressor, 52
Input Devices, 4
Input Leakage Current, 50
Installation
Environment, 38
Memory Pack to the CPU, 25
installation, precautions, ix
107