Xilinx Spartan-6 FPGA Series Design And Pin Planning Manual page 71

Table A-2: Recommended PCB Design Rules (mm) for BGA Packages
Notes:
1. Component land pad diameter refers to the pad opening on the component side (solder mask defined).
Table A-3: Recommended PCB Design Rules (mm) for CSP Packages
Notes:
1. Component land pad diameter refers to the pad opening on the component side (solder mask defined).
Spartan-6 FPGA PCB Design and Pin Planning
UG393 (v1.1) April 29, 2010
Recommended PCB Design Rules for BGA and CSP Packages
Design Rule
Component land pad diameter (SMD)
Solder land (L) diameter
Opening in solder mask (M) diameter
Solder (ball) land pitch (e)
Line width between via and land (w)
Distance between via and land (D)
Via land (VL) diameter
Through hole (VH) diameter
The space between the NSMD pad and the solder mask, as well as the actual signal trace widths,
depend on the capability of the PCB vendor. PCB costs increase as the line width and spaces become
smaller.
Design Rule
Component land pad diameter (SMD)
Solder land (L) diameter
Opening in solder mask (M) diameter
Solder (ball) land pitch (e)
Line width between via and land (w)
Distance between via and land (D)
Via land (VL) diameter
Through hole (VH) diameter
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FT(G)256
(1)
0.40
0.40
0.50
1.00
0.13
0.70
0.61
0.300
CSG225
CSG324
CSG484
(1)
0.40
0.37
0.47
0.80
0.13
0.56
0.51
0.25
FG(G)484
FG(G)676
FG(G)900
0.45
0.40
0.50
1.00
0.13
0.70
0.61
0.300
CPG196
0.30
0.27
0.35
0.50
0.13
0.35
0.27
0.15
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