Package Information
5.3
Package Information
5.3.1
Physical Dimensions
Figure 5-1
and
Table 5-6
ball arrangement for the RX881.
Table 5-6 RX881 528-Pin FCBGA Package Physical Dimensions
Ref.
c
A
A1
A2
b
D1
D2
D3
D4
E1
E2
E3
E4
F1
F2
e1
ddd
Note: Maximum height of SMT components is 0.650 mm.
© 2011 Advanced Micro Devices, Inc.
Proprietary
describe the physical dimensions of the RX881 package.
Figure 5-1 RX881 528-Pin FCBGA Package Outline
Min(mm)
Typical (mm)
0.48
1.69
0.30
0.81
0.40
20.85
21.00
-
2.00
1.00
20.85
21.00
-
2.00
1.00
-
19.20
-
19.20
-
0.80 (min. pitch)
-
Max. (mm)
0.58
0.68
1.84
1.99
0.40
0.50
0.86
0.91
0.50
0.60
21.15
8.58
-
-
-
-
-
21.15
7.70
-
-
-
-
-
-
-
-
-
0.20
Figure 5-2
shows the detailed
Mo d- 00 08 5- Rev -0 3
46136 AMD RX881 Databook 1.40
5-5