User's Notice; Manual Revision Information; Cooling Solutions - AMD 770 User Manual

M/b for socket am2/am2+/am3 processor
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USER'S NOTICE

COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS
MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE
REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR
BY ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE
MOTHERBOARD AND WE DO ASSURE THIS MANUAL MEETS USER'S REQUIREMENT BUT
WILL CHANGE, CORRECT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS
MANUAL "AS IS" WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY
INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL DAMAGES (INCLUDING
DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT.2
BE REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND
THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER'S
BENEFIT, WITHOUT INTENT TO INFRINGE.

Manual Revision Information

Reversion
Revision History
3.0
Third Edition
Item Checklist
AMD 770 Platform Processor Chipset based motherboard
Motherboard User's Manual
DVD for motherboard utilities
IDE Cable
Serial ATA IDE Port Cable
I/O Back panel & I/O Back panel Sticker
Kuroshio Promotion Card
AMD Processor Family

Cooling Solutions

As processor technology pushes to faster speeds and higher performance with increasing operation
clock, thermal management becomes increasingly crucial while building computer systems. Maintaining
the proper computing environment without thermal increasing is the key to reliable, stable, and 24
hours system operation. The overall goal is keeping the processor below its specified maximum case
temperature. Heatsinks induce improved processor heat dissipation through increasing surface area
and concentrated airflow from attached active cooling fans. In addition, interface materials allow
effective transfers of heat from the processor to the heatsink. For optimum heat transfer, AMD
recommends the use of thermal grease and mounting clips to attach the heatsink to the processor.
Please refer to the official website for collection of heatsinks evaluated and recommended for AMD
processors.
Date
July, 2009
iv
AMD 770 NB CHIPSET

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