Main Board Assembly Removal - Epson LX-300+II RTP Service Manual

EPSON LX-300+II/300+II RTP/1170II

4.2.5 Main Board Assembly Removal

1. Remove the upper housing. (See 4.2.2 "Upper Housing Unit Removal".)
2. Remove the printer mechanism. (See 4.2.3 "Printer Mechanism Removal".)
3. LX-1170II: Remove 1 screw (C.B.P., Tite, 3x10 F/ZN; Torque 0.78-0.98 N.M.)
and the right grounding plate.
C.B.P., Tite, 3x10 F/ZN
Figure 4-7. Right Grounding Plate Removal (LX-1170II)
4. Remove 2 Jack Sockets (Torque 0.29-0.49 N.M.) securing the serial interface
connector to the lower shield plate.
5. Remove the serial interface connector from the installation hole of the lower shield
plate.
6. Remove 2 screws (C.P., Screw, 3x4 F/ZN; Torque 0.48-0.78 N.M.) securing the
parallel interface to the lower shield plate.
7. Disconnect the option FFC (LX-300+II only) and panel FFC from CN12 and CN13 on
the board.
8. Disconnect the harness connected to the Power Supply Board Assembly from CN8.
Press one edge of CN8 in order to remove or install the harness.
Disassembly and Assembly
Grounding Plate, Right
Disassembly and Assembly
9. Remove 3 screws (C.B.P., Tite, 3x10 F/ZN) securing the main board assembly to the
lower housing.
When the main board assembly is replaced, perform the destination
A D J U S T M E N T
R E Q U I R E D
setting, Bi-D adjustment, top margin adjustment, and bottom margin
adjustment.
Lower Shield Plate
C.B.P., Tite, 3x10 F/ZN
CN8
Main Board Assembly
C.B.P., Tite, 3x10 F/ZN
Figure4-8. C640/641MAIN Board Assembly Removal
Revision D
Hexagon Nut
CN13
C.P., Screw, 3x4 F/ZN
CN12
C.B.P., Tite, 3x10 F/ZN
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