Appendix A: Specifications; System Specifications - Enterasys X-Pedition XSR-3150 Getting Started Manual

System Specifications

This appendix details XSR data about hardware functionality including:
• Processor, system memory, chassis, power supply, interfaces
• Required cabling, CompactFlash and other accessories
• Pinout assignments for WAN and LAN interfaces
• LED behavior
Refer to tables throughout this appendix for specific information.
Category
Processor
Hardware
accelerator
System
Memory
Chassis
Heat
Dissipation
Environment
Table A-1 XSR Hardware Specifications
Parameters
Type Broadcom 1250 with two CPU cores
Dual-core 1700 Dhrystone MIPS @ 600 MHz
Operating Speed
VPN Encryption Module chip (310 Mbps) for 3DES encryption,
message digest (MD-5, SHA-1), and public key acceleration,
RAM 2, Micron 184-pin, SDRAM DIMM, 128 Mbyte memory modules
at 133 MHz each (data rate of 256 Mbps)
Non-Volatile 8 Mbytes of Onboard Flash - no upgrade
Up to 1 Gbyte optional plug-in CompactFlash card. Type I and II
CF cards supported
Form Factor 19" rack-mountable
Dimensions 1U (1 11/16" high by 17" wide by 21" deep)
Weight 20 pounds
Forced air cooling 100 watts (maximum) of heat dissipation by 5 system and 3 in-
board power supply fans. Failure detection capability supported
Operating temp. 0 - 40° C
Storage temp. -40 - 70° C
Relative Humidity 5% - 90%, non-condensing
A
Specifications
A-1