Soldering Precautions; Performance Verification; Environmental Conditions - Keithley 2000-Scan Instruction Manual

Soldering precautions

Should it become necessary to use solder on the circuit board, observe the following
precautions:
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Performance verification
The following paragraphs discuss performance verification procedures for the
Model 2000-SCAN, including path resistance, contact potential, and isolation.
NOTE

Environmental conditions

All verification measurements should be made at an ambient temperature between 18° and
28°C, and at a relative humidity of less than 70%.
Use an OA-based (organic activated) flux, and take care not to spread the flux to other
areas of the circuit board.
Remove the flux from the work areas when the repair has been completed. Use pure
water along with clean cotton swabs or a clean, soft brush to re-move the flux.
Once the flux has been removed, swab only the repaired area with methanol, then blow
dry the board with dry nitrogen gas.
After cleaning, the card should be allowed to dry in a 50°C low-humidity environment
for several hours before use.
Contamination will degrade the performance of the card. To avoid contamination,
always grasp the card by the side edges and covers. Do not touch connector
insulators, board surfaces, or components.
Failure of any performance verification test may indicate that the scanner card is
contaminated. See "Handling and cleaning precautions" on page 4-2
on cleaning the card.
Service Information
for information
4-3