Removing A Module Or Blank; Connect Equipment To The Ports And Power On The System - Qlogic SilverStorm 9000 Hardware Installation Manual

2 – Installation
Installation Tasks
2. When placing the spine modules and leaf modules/VICs into chassis slots, the
following recommendations apply:
a. Spine Modules — It is recommended that the spine module(s) be installed
❑
❑
b. Leaf Modules/VICs — Modules should be populated beginning with slot 1,
3. To install a module or filler, hold it so that the ejector handles are on the bottom
4. Pull the handles out to extend them. Slide the module into the appropriate slot
of the chassis until it makes contact with the backplane. As the module seats
in the chassis, the handles will begin to close.
5. Push the handles in to fully close.
NOTE:
2.3.7.2

Removing a Module or Blank

The handles are self-locking. To unlock, push up on the handles to disengage from
the lock notch. Then gently pull the handles out and slide the module out of the slot.
NOTE:
2.3.7.3

Connect Equipment to the Ports and Power On the System

1. Connect a Category 5 or 6 (Cat 5/6) Ethernet cable to one of the RJ-45
connectors on the switch. Connect the other end of the Cat 5/6 to the OOB LAN
workstation.
2. Connect the switch to IB-enabled hosts using 4X-to-4X IB or IB/Fiber Optic
cables.
2-12
into:
9120 and 9240 Lower Hemisphere: Slot 1 for managed. For redundant
management, populate slots 1 and 2 with management-capable spines.
Use slot 3 for unmanaged.
9240 Upper Hemisphere: Slot 5 for managed. For redundant management,
populate slots 5 and 6 with management-capable spines. Use slot 4 for
unmanaged.
then slot 2, then slots 3 through x respectively.
Be sure that all cards are fully inserted in their respective chassis slots,
and that the handles are in the locked position. This prevents accidental
removal, provides proper grounding for the system, and helps to seat the
bus connectors in the backplane receptacles.
If removing, but not replacing a module, remember to replace with a
module blank. All slots must be either populated with a module or have
blanks for EMI and thermal integrity.
Q
D000024-000 Rev. A