Related Manuals for Intel 7500
Summarization of Contents
Introduction to Scalable Memory Buffer Thermal Design
Design Flow for Thermal Solutions
Outlines the process for developing a reliable, cost-effective thermal solution using provided tools.
Definition of Key Terms and Acronyms
Defines key terms and acronyms used throughout the document for clarity and understanding.
Reference Documents for Thermal Design
Lists related documents essential for understanding material and concepts presented in this specification.
Packaging Technology and Mechanical Requirements
Package Mechanical Load Specifications
Specifies mechanical load limits for the component package during installation and use, ensuring package integrity.
Thermal Specifications for Memory Buffers
Thermal Design Power (TDP) Targets
Defines the target power dissipation for thermal solutions, crucial for component cooling design.
Die Case Temperature Operating Limits
Specifies the maximum/minimum die temperatures required for proper operation and reliability of the component.
Thermal Metrology and Measurement Guidelines
Component Die Temperature Measurement Procedures
Provides guidelines for accurately measuring component die temperatures to ensure functionality and reliability.
Reference Thermal Solution 1: Tall Torsional Clip
Operating Environment for Thermal Solution 1
Details ambient temperature and airflow conditions for the reference thermal solution's performance assessment.
Heatsink Performance Analysis
Describes how to determine thermal solution performance using simulated data and provides a performance equation.
Mechanical Design Envelope Constraints
Defines height, width, and depth constraints for the component thermal solution.
Board Component Keepout Dimensions for Solution 1
Shows locations of hole patterns and keepout zones for the reference thermal solution on the board.
Tall Torsional Clip Heatsink Assembly Details
Details the passive extruded heatsink, clip attachment, and anchors for the thermal solution.
Reliability Guidelines for Thermal Solution 1
Provides recommendations for defining reliability test criteria and evaluating the completed assembly in various environments.
Reference Thermal Solution 2: Short Torsional Clip
Operating Environment for Thermal Solution 2
Details ambient temperature and airflow conditions for the short torsional clip heatsink reference solution.
Short Heatsink Performance Analysis
Presents simulated thermal performance data for the short heatsink versus approach air velocity.
Mechanical Design Envelope for Short Heatsink
Defines the height, width, and depth constraints for the short torsional clip heatsink.
Keepout Dimensions for Short Heatsink Solution
Refers to Section 5.4 for keepout dimensions, common with the tall heatsink solution.
Short Torsional Clip Heatsink Assembly Description
Describes the passive extruded heatsink and clip attachment for the short heatsink solution.
Reliability Guidelines for Thermal Solution 2
Refers to Section 5.6 for reliability testing recommendations applicable to this solution.
Thermal Solution Component Suppliers
Suppliers for Tall Torsional Clip Heatsink
Lists suppliers and part numbers for components of the tall torsional clip heatsink thermal solution.
Suppliers for Short Torsional Clip Heatsink
Lists suppliers and part numbers for components of the short torsional clip heatsink thermal solution.
Mechanical Drawings of Heatsink Assemblies
List of Mechanical Drawings
A list of mechanical drawings included in the appendix for heatsink assemblies and clips.
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