HP Pro SFF 400 G9, HSC-F003SF Manual

Also See for Pro SFF 400 G9:

Maintenance and service manual (128 pages)

Product end-of-life disassembly instructions (9 pages)

Table of Contents

Contents

1 Introduction
2 Items Requiring Selective Treatment
3 Tools Required
4 Product Disassembly Process
5 Documents / Resources
- 5.1 Download manual

HP Pro SFF 400 G9, HSC-F003SF Manual

Introduction

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP Inc. products to remove components and materials requiring selective treatment, as defined by EU directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the plastic part. For any questions on plastic marking or identification of location of parts or components requiring selective treatment, please contact HP's Sustainability Contact.

Items Requiring Selective Treatment

Items listed below are classified as requiring selective treatment. An "X" in the list of components and parts indicates the product contains the component or part requiring selective treatment

Item Description	Components and parts requiring selective treatments	Quantity of items included in product
Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) with a surface greater than 10 sq cm	[ x ] Main board (MB) PCB [ x ] Solid state drive (SSD) PCB [ x ] Hard disk drive (HDD) PCB [ x ] Memory PCB [ x ] Internal power supply (IPS) PCB [ x ] External Keyboard (KB) [ x ] External Mouse [ x ] Others: Graphic Card PCB	9
Batteries, excluding Li-Ion batteries. This includes standard alkaline, coin or button style batteries	RTC coin battery	1
Li-Ion batteries. Includes all Li-Ion batteries if more than one is provided with the product (such as a detachable notebook keyboard battery, etc.)	Battery(ies) are attached to the product by: [ ] screws [ ] snaps [ ] adhesive [ ] other. Explain	0
Mercury-containing components. For example, mercury in lamps, display backlights, scanner lamps, switches, batteries		0
Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm. Includes background illuminated displays with gas discharge lamps	[ ] Panel LCD	0
Cathode Ray Tubes (CRT)		0
Capacitors / condensers (Containing PCB/PCT)		0
Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height	[ x ] Power Supply capacitor(s) or condenser(s)	1
External electrical cables and cords	[ x ] AC power cord [ ] Audio, video or data cables [ ] Other:	1
Gas Discharge Lamps		0
Plastics containing Brominated Flame Retardants (not including external electrical cables and cords, PCBs or PCAs already listed as a separate item above)		0
Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner. Include the cartridges, print heads, tubes, vent chambers, and service stations.		0
Components and waste containing asbestos		0
Components, parts and materials containing refractory ceramic fibers		0
Components, parts and materials containing radioactive substances		0
Components containing chlorofluorocarbons (CFC), hydrochlorofluorocarbons (HCFC) or hydrofluorocarbons (HFC), hydrocarbons (HC)		0

Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.

Tool Description	Tool Size (if applicable)
Hexagon Screw Driver	T-15
Electric Iron	QUICK 310
Crisscross Screw Driver	PH1

Product Disassembly Process

List the basic steps that should typically be followed to remove components and materials requiring selective treatment including the required steps to remove the external enclosure:
NOTE - For disassembly instructions of the external power supply (EPS), external keyboard (KB) external mouse and external cables and cords, refer to the links below:
Generic Keyboard
Generic Mouse
Generic cables and cord

Optional Graphic
If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).