HP EliteDesk 800 G2 Disassembly Manual

Also See for EliteDesk 800 G2:

Maintenance and service manual (154 pages)

Hardware reference manual (52 pages)

Disassembly instructions manual (13 pages)

Table of Contents

Contents

1 Items Requiring Selective Treatment
2 Tools Required
3 Product Disassembly Process
4 Documents / Resources
- 4.1 Download manual

HP EliteDesk 800 G2 Disassembly Manual

Items Requiring Selective Treatment

Items listed below are classified as requiring selective treatment.
Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.

Item Description	Notes	Quantity of items included in product
Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)	With a surface greater than 10 sq cm	2
Batteries	All types including standard alkaline and lithium coin or button style batteries	1
Mercury-containing components	For example, mercury in lamps, display backlights, scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm	Includes background illuminated displays with gas discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height	Acbel STD	3
External electrical cables and cords		1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above)
Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner	Include the cartridges, print heads, tubes, vent chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing refractory ceramic fibers
Components, parts and materials containing radioactive substances

Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.

Tool Description	Tool Size (if applicable)
Screwdriver	T-15
Micro shear	170II
Screwdriver	PH1
Description #4
Description #5

Product Disassembly Process

List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Loose the screw and remove access panel.(see Figure 1 below)
2. Rotate the driver cage form the hook on slide rail.(see Figure 2 below)
3. Disconnect FIO cables from the MB.(see Figure 3-5 below)
4. Disconnect SATA cables from the MB.(see Figure 6 below)
5. Disconnect other PSU cables from the MB.(see Figure 7-11 below)
6. Remove HDD/ODD from chassis.(see Figure 12-20 below)
7. Remove the heatsink from MB.(see Figure 21-24 below)
8. Separate the fan from CPU heatsink. (see Figure 25-26 below)
9. Remove the CPU from the MB.(see Figure 27-28 below)
10. Remove the Memory card from the MB.(see Figure 29 below)
11. Remove the battery from the MB.(see Figure 30 below)
12. Remove M/B from chassis.(see Figure 31-32 below)
13. Remove front panel from chassis.(see Figure 33 below)
14. Remove FIO/Speaker/LED holder from chassis.(see Figure 34-36 below)
15. Remove PSU cover.(see Figure 37-43 below)
16. Disconnect all the cables and remove the Electrolytic Capacitors.(see Figure 44-47 below)
Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).