HP 280 G2 Manual

Also See for 280 G2:

Maintenance and service manual (130 pages)

Product end-of-life disassembly instructions (13 pages)

Table of Contents

Contents

1 Items Requiring Selective Treatment
2 Tools Required
3 Product Disassembly Process
4 Documents / Resources
- 4.1 Download manual

HP 280 G2 Manual

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model
[List multiple models if applicable.]
HP 280 G2 Small Form Factor Business PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

Items Requiring Selective Treatment

Items listed below are classified as requiring selective treatment.
Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.

Item Description	Notes	Quantity of items included in product
Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)	With a surface greater than 10 sqcm MB, Memory, HDD PCA,ODD PCA,PSU PCA	5
Batteries	All types including standard alkaline and lithium coin or button style batteriesMB	1
Mercury-containing components	For example, mercury in lamps, display backlights, scanner lamps, switches, batteries	0
Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm	Includes background illuminated displays with gas discharge lamps	0
Cathode Ray Tubes (CRT)		0
Capacitors / condensers (Containing PCB/PCT)		0
Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height	PSU	2
External electrical cables and cords	Power cord	1
Gas Discharge Lamps		0
Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above)	system fan, Cooler fan, PSU fan	3
Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner	Include the cartridges, print heads, tubes, vent chambers, and service stations.	0
Components and waste containing asbestos		0
Components, parts and materials containing refractory ceramic fibers		0
Components, parts and materials containing radioactive substances		0

Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.

Tool Description	Tool Size (if applicable)
Description #1crisscross screw driver	2#
Description #2 hexagon screw driver	T15
Description #3 electric iron	QUICK 310
Description #4
Description #5

Product Disassembly Process

List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Release the screw on the access panel.
2. Remove access panel from the unit.
3. Remove front bezel from the unit.
4. Remove the heat sink cover from unit.
5. Remove HDD / ODD cable from the unit.
6. Remove ODD from the unit.
7. Remove HDD cage from the unit.
8. Remove HDD from HDD cage.
9. Remove PCA power cable and system fan cable from PCA.
10. Take out PCA from unit.
11. Remove cooler from PCA.
12. Remove memory from PCA
13. Take off PSU and system fan from the unit.
14. Open the PSU and take off the PSU fan.
15. Take off PCA from the PSU.
16. Take off CAP using electric iron..
Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).

	Release the screw on the access panel.
	Remove access panel from the unit. Griping the tab at the end of access panel, pull access panel towards the rear and remove it from unit.
	Remove front bezel from the unit. Release 3 bezel latches from chassis by pulling the bezel latches outwards.
	Remove the heat sink cover from unit.
	Remove HDD / ODD cable from the unit.
	Remove ODD from the unit.
.	Remove HDD cage from the unit. Release screw from the HDD cage, and take out the HDD cage from unit.
	Remove HDD from HDD cage. Release 4pcs screw from HDD cage, and take out HDD from HDD cage.
	Remove PCA power cable and system fan cable from PCA.
	Take out PCA from unit. Release 7pcs screws from PCA, and take out the motherboard from unit.
	Remove cooler from PCA. Release 4pcs cooler screws from PCA, and remove cooler from PCA.
	Remove memory from PCA.
	Take off PSU and system fan from the unit. Release 4pcs system fan screws from chassis, press PSU raised and takes out PSU from the unit.
	Open the PSU and take off the PSU fan. Rotate screw driver to release PSU cover, and remove PSU fan.
	Take off PCA from the PSU. Rotate the screw driver to release the PCA from PSU.
	Take off CAP using electric iron.