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HP Pro SFF 400 G9 Product End-Of-Life Disassembly Instructions
HP Pro SFF 400 G9 Product End-Of-Life Disassembly Instructions

HP Pro SFF 400 G9 Product End-Of-Life Disassembly Instructions

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Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP Pro SFF 400 G9 Desktop PC/HSC-F003SF
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for
the disassembly of HP Inc. products to remove components and materials requiring selective treatment, as defined by EU
directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on
the plastic part. For any questions on plastic marking or identification of location of parts or components requiring selective
treatment, please contact
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment. An "X" in the list of components and parts indicates the
product contains the component or part requiring selective treatment
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA) with a surface greater than 10 sq
cm
Batteries, excluding Li-Ion batteries. This includes
standard alkaline, coin or button style batteries
Li-Ion batteries. Includes all Li-Ion batteries if more
than one is provided with the product (such as a
detachable notebook keyboard battery, etc.)
Mercury-containing components. For example,
mercury in lamps, display backlights, scanner lamps,
switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm. Includes background illuminated
displays with gas discharge lamps
Cathode Ray Tubes (CRT)
EL-MF877-00
Template Revision D
last updated 3-March-2022
HP's Sustainability
Contact.
HPI instructions for this template are available at
Components and parts requiring selective
treatments
[ x
] Main board (MB) PCB
[ x
] Solid state drive (SSD) PCB
] Hard disk drive (HDD) PCB
[ x
[ x
] Memory PCB
[ x
] Internal power supply (IPS) PCB
[ x ] External Keyboard (KB)
[ x ] External Mouse
[ x
] Others: Graphic Card PCB
RTC coin battery
Battery(ies) are attached to the product by:
[
] screws
[
] snaps
[
] adhesive
[
] other. Explain
[
] Panel LCD
EL-MF877-01
Quantity of
items included
in product
9
1
0
0
0
0
Page 1

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Summary of Contents for HP Pro SFF 400 G9

  • Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP Inc. products to remove components and materials requiring selective treatment, as defined by EU directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2 Quantity of Components and parts requiring selective Item Description items included treatments in product Capacitors / condensers (Containing PCB/PCT) Electrolytic Capacitors / Condensers measuring [ x ] Power Supply capacitor(s) or condenser(s) greater than 2.5 cm in diameter or height External electrical cables and cords ] AC power cord ] Audio, video or data cables...
  • Page 3 Disconnect ODD SATA cable and power cable Remove ODD from cage Remove the front bezel Rotate and open drive cage Disconnect HDD SATA cable and power cable Loose the Screw and remove HDD Remove HDD from Chassis, The PCA of HDD as below: Remove fan duct latch Remove fan duct Remove CPU cooler...
  • Page 4 3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations). Step1 Use T-15 screwdriver to release thumb screw. Step 2 Remove access panel.
  • Page 5 Step7 Disconnect HDD SATA cable and power cable Step 8 Loose the Screw and remove HDD Step9 Remove HDD from Chassis, The PCA of HDD as below: Step10: Remove fan duct latch EL-MF877-00 Page 5 Template Revision D last updated 3-March-2022 HPI instructions for this template are available at EL-MF877-01...
  • Page 6 Step 11 Remove fan duct Step 12 Remove CPU cooler Step 13 Rotate the handle and open it up Step 14 Remove the CPU from the board. Step15 Open the GFX Lock Step 16 Unlock the slot latch and remove Graphic from MB EL-MF877-00 Page 6 Template Revision D...
  • Page 7 Step18 Remove Memory from MB .Step 17 Remove the Graphic card From MB and Show Graphic card PCA as below: Step19 Remove Memory from MB and show Memory PCA as below: Step 20 Release the screw and remove WLAN from MB Step21 Release the screw and remove SSD from MB Step22 Remove SSD from MB and show the SSD PCA.
  • Page 8 Step 23 Disconnect speaker power cable from MB Step 24 Remove Speaker BOX from chassis Step 25 Use T-15 screwdriver to release the screws of MB Step 26 Remove MB from chassis Step 27 Use T-15 screwdriver to release the screws of PSU Step 28 Press the PSU’s latch on chassis EL-MF877-00 Page 8...
  • Page 9 Step 29 Remove the PSU from chassis Step 30 Remove four screws covered Step 31 Remove the screw and open case Step 32 Loose screws and remove PCB from case Step 33 Remove Ele-Cap from PCBA Step 34 Show Ele-Cap on PCBA (C1) EL-MF877-00 Page 9 Template Revision D...

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Hsc-f003sf