Handling Thermal Interface Materials; Type, Quantity, And Area Of Thermal Interface Materials Application On The Heat Sink - Lenovo IdeaPad 5 2-in-1 14 9 Hardware Maintenance Manual

3. Follow the correct sequence in the steps for removing a FRU, as shown in the illustrations by the
numbers in square callouts.
4. When removing a FRU, move it in the direction as shown by the arrow in the illustration.
5. To install a new FRU in place, perform the removal procedure in reverse and follow any notes that
pertain to replacement.
6. When replacing a FRU, carefully retain and reuse all screws.
7. When replacing the base cover, reapply all labels that come with the replacement base cover. If some
original labels are not included with the replacement base cover, peel them off from the original base
cover and paste them on the replacement base cover.
DANGER
Before removing any FRU or CRU, shut down the computer and unplug all power cords from
electrical outlets.
Attention: After replacing a FRU, do not turn on the computer until you have ensured that all screws,
springs, and other small parts are in place and none are loose inside the computer. Verify this by shaking the
computer gently and listening for rattling sounds. Metallic parts or metal flakes can cause electrical short
circuits.
Attention: The system board is sensitive to and can be damaged by ESD. Before touching it, establish
personal grounding by touching a ground point with one hand or by using an ESD strap (P/N 6405959).

Handling thermal interface materials

Thermal interface materials are typically applied between a heat sink and a CPU (and/or GPU) die to enhance
the heat transfer capability of the heat sink. If thermal interface materials are exposed during computer
servicing, such as when replacing the heat sink or system board, it is important to handle the thermal
interface materials properly.
• You need to completely remove the old thermal interface materials from the CPU and/or GPU die.
• You need to apply new thermal interface materials onto the heat sink according to the type, quantity, and
application areas specified in this publication.
Related topics
"Remove the heat sink" on page 33
"Remove the system board" on page 50
Type, quantity, and area of thermal interface materials application on the
heat sink
The table and figure below provide information on the type and quantity of thermal interface materials, as
well as the specific area on the heat sink where these materials should be applied.
Area
a
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Type
TC-5550
TC-5550
Quantity
0.1 g, 16.64 mm × 11.74 mm × 0.15 mm (for IdeaPad 5 2-in-1
14AHP9 and IdeaPad 5 2-in-1 16AHP9)
0.2 g, 29.95 mm × 13.4 mm × 0.15 mm (for IdeaPad 5 2-in-1
14IRU9 and IdeaPad 5 2-in-1 16IRU9)