PROCESSOR TECHNOLOGY CORPORATION
8KRA STATIC READ/WRITE MEMORY MODULE
SECTION II
Step 15 .
Install RAM DIP sockets and check installations.
Install these sockets in the indicated locations with their
end notches oriented as shown on the assembly drawing.
Take
care not to create solder bridges between the pins and/or
traces.
(Note that after each row of sockets — e.g.,
IC1
through 16 and IC17 through 32 — is installed, you will be
testing for shorts.)
(/) Id through IC16 .
Install 16-pin DIP sockets in loca
tions IC1 through IC16.
Then perform the "RAM Area Test"
described in Step 1 of the Assembly Procedure.
Make the
measurements at IC1.
If any of the tests fail, you cre
ated a solder short at one or more points in the row of
sockets just installed.
Find and eliminate the short(s)
before proceeding further.
If your installations pass
the test, continue on to the next row.
IC17 through IC32 .
Install 16-pin DIP sockets in loca
tions IC17 through IC32.
Check this row as you did IC1
through IC16, but make the measurements at IC17 .
/
IC33 through IC48 .
Install 16-pin DIP sockets in loca
tions IC33 through IC48.
Check this row as you did IC1
through IC16 , but make the measurements at IC33.
/
) IC49 through IC64 .
Install 16-pin DIP sockets in loca
tions IC49 through IC64.
Check this row as you did IC1
through IC16, but make the measurements at IC49.
After installing the sockets for IC1 through IC64 and check
ing your installations for freedom from shorts, proceed to
the next step.
Step 16 .
Install remaining DIP sockets.
Install each sock
et in the indicated location with its end notch oriented as
shown on the assembly drawing.
Take care not to create sol
der shorts between the pins and/or traces.
LOCATION
SOCKET TYPE
IC70
IC72
IC74
IC75
IC77
IC78
IC79
IC67 through IC69
IC71
IC73
) IC76
14 pin
14 pin
14 pin
14 pin
14 pin
14 pin
14 pin
16 pin
16 pin
16 pin
16 pin
11-11