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PROCESSOR TECHNOLOGY CORPORATION
8KRA STATIC READ/WRITE MEMORY MODULE
SECTION II
which is connected to ground) for Id.
Also measure be
tween +5-volt bus (positive mounting pad for C23) and each
mounting pad (excluding pad 10 which is connected to
+5
volts) for IC1.
Then measure between all combinations of
vertically and horizontally adjacent pads for Id.
There
should be no continuity in any of these measurements.
If you measure continuity in any of the preceding tests, the
PC Board is defective and should be returned to Processor
Technology for replacement.
If none of the measurements show
continuity, proceed to Step 2.
) Step 2 .
Install heat sink.
Position the large, black heat
sink (flat side to board) over the square foil area in the
upper right corner.
Orient the sink so that the two triangles
of mounting holes in the board are under the triangular cut
outs in the sink.
Using two 6-32 screws, lockwashers and nuts,
attach heat sink to board.
Insert screws from back (solder)
side of board.
(See Figure 2-2.)
) Step 3 .
Install IC65 and IC66 (340T-5.0 or 7805UC). Position
IC65 on the heat sink and observe how leads must be bent to
fit the mounting holes. Note that the center lead (3) must be
bent down at a point approximately 0.2 inches further from
the body than the other leads.
Bend leads so no contact is
made with heat sink when IC65 is flat against the sink and
its mounting hole is aligned with the hole in the sink. Fasten
IC65 to sink using 6-32 screw, lockwasher and nut.
Insert
screw from back (solder) side of board. Solder and trim leads.
Install IC66 the same way as you did IC65.
(See Figure 2-2.)
IC66
Upper
corns
DIP Switch location
IC65
NOTE:
IC65 is
shown
rotated
approximately
position.
130° (CCW) from
its
correct
Figure 2-2.
Heat sink and IC65 and 1066 installation
II-6
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