Soldering; Installing And Removing Integrated Circuits; Use Of Clip Leads; Required Tools, Equipment And Materials - Processor Technology 8KRA Assembly And Test Instructions

Static read/write memory module
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PROCESSOR TECHNOLOGY CORPORATION
8KRA STATIC READ/WRITE MEMORY MODULE
SECTION II
sary handling and wear cotton — rather than synthetic — clothing when
handling these IC's.
2.3.2
Soldering
" IMPORTANT **
1.
Use a low-wattage iron, 25 watts maximum.
2.
Solder neatly and quickly as possible.
3.
DO NOT press tip of iron on pad or trace.
To do so can
cause the pad or trace to "lift" off the board and permanently dam ­
age it.
4.
Use only 60-40 rosin-core solder.
NEVER use acid-core
solder or externally applied fluxes.
5.
The 8KRA uses a circuit board with plated-through holes.
Solder flow through to the component (front) side of the board can
produce solder bridges.
Check for such bridges after each component
is installed.
6.
The 8KRA circuit board has an integral solder mask (a lac­
quer coating) that shields selected areas on the board.
This mask
minimizes the chances of creating solder bridges during assembly.
7.
Additional pointers on soldering are provided in Appendix
III of this manual.
2.3.3
Installing and Removing 8 ERA Module
NEVER install the 8 ERA in, or remove it from, the computer
with the power on.
To do so can damage the module.
2.3.4
Installing and Removing Integrated Circuits
NEVER install or remove integrated circuits while power is
applied to the 8ERA.
To do so can damage the IC.
2.3.5
Use of Clip Leads
NEVER attach clip leads to the top edge of the module when
power is applied to the 8 ERA.
To do so will short the +8 V de bus
to the RAM chip enable lines.
2.4
REQUIRED TOOLS, EQUIPMENT AND MATERIALS
The following tools, equipment and materials are recommended
for assembling the 8 ERA Memory Module:
1.
Needle nose pliers
II-4

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