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PROCESSOR TECHNOLOGY CORPORATION
8KRA STATIC READ/WRITE MEMORY MODULE
SECTION II
Step 4 .
cation directly above the heat sink.
the longer pins at the top, insert leads
solder and trim leads.
Install male Molex right angle connector in its lo-
Position connector with
in mounting holes,
Z
Step 5 .
Install diode D5 (1N270) in its location to the right
of Area B.
Position D5 so that its dark band mark (cathode)
is on the righthand side.
Solder and trim leads.
Jr) Step 6 .
Install diodes Dl , D2 , D3 and D4 (1N4001 or 1N4002)
in their locations above the heat sink.
Position Dl , D3 and
D4
so
that their dark band marks (cathode) are at the bottom,
and position D2 so that its dark band is at the top.
Step 7 .
Install the
ing locations.
Take
correct orientation.
three tantalum capacitors in the follow-
care to observe proper values and the
LOCATION
VALUE (ufd)
ORIENTATION
(/) C21
15
"+" lead top
(/) 022
1
"+" lead bottom
(/) 023
1
"+" lead right
Check the capacitors for correct value and orientation, bend
leads outward on solder (back) side of board, solder and trim.
(/J Step 8 .
Install disc capacitors in numerical order in the
indicated locations.
Insert leads, pull down snug to board,
bend leads outward on solder (back) side of board, solder
and trim.
NOTE
Disc capacitor leads are usually coated
with wax during the manufacturing pro
cess.
After inserting leads through
mounting holes, remove capacitor and
clear the holes of any wax.
Reinsert
and install.
LOCATION
VALUE ( ufd)
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
TYPE
Disc Ceramic
Disc Ceramic
Disc Ceramic
Disc Ceramic
Disc Ceramic
Disc Ceramic
Disc Ceramic
Disc Ceramic
(Continued on Page II-8. )
II-7
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