Cleanliness Requirements - Ruijie RG-WS6512 Installation And Reference Manual

Hardware Installation and Reference Guide
2.2.2

Cleanliness Requirements

Dust poses a major threat to the device. Indoor dust causes electrostatic adherence
when falling on the device, resulting in poor contact. Such electrostatic adherence may
occur more easily when the relative humidity is low, not only affecting the service life of
the device, but also causing communication faults.
Max. Diameter
(μm)
Max.
Concentration
(Particle
Quantity/m
Apart from dust, the sulfide in the air in the equipment room must also meet strict
requirements. These harmful substances will accelerate metal corrosion and the aging of
some components. Therefore, the equipment room should be properly protected against
the intrusion of harmful gases, such as sulfur dioxide, hydrogen sulfide, nitrogen
dioxide, ammonia gas, and chlorine gas. The following table lists limit values for harmful
gases.
Gas
Sulfur dioxide
(SO2)
Hydrogen sulfide
(H2S)
Nitrogen dioxide
(NO2)
Ammonia gas
(NH3)
Chlorine gas (CI2)
0.5
1.4×10
7
)
3
Average (mg/m3)
0.2
0.006
0.04
0.05
0.01
1 3
7×10 2.4×10
5
Maximum (mg/m3)
1.5
0.03
0.15
0.15
0.3
9
Preparing for Installation
5
1.3×10
5 5